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H01L2224/481

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/481Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dual die integrated circuit system in an integrated circuit package...
- Patent number 12,341,138
- Issue date Jun 24, 2025
- TDK-MICRONAS GMBH
- Paolo Marozzi
- G01 - MEASURING TESTING
Information Patent Grant
Packaging structure and power amplifier
- Patent number 12,341,480
- Issue date Jun 24, 2025
- Huawei Technologies Co., Ltd.
- Xiaomin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 12,341,135
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device for improving internal quantum efficiency
- Patent number 12,334,485
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Jin Woo Choi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having chip stack
- Patent number 12,327,821
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for a multi-phase motor driving circuit
- Patent number 12,327,993
- Issue date Jun 10, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Chung-Kuang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,327,808
- Issue date Jun 10, 2025
- Hitachi Power Semiconductor Device, Ltd.
- Naoki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,327,771
- Issue date Jun 10, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intra-cardiac echocardiography interposer
- Patent number 12,324,701
- Issue date Jun 10, 2025
- PHILIPS IMAGE GUIDED THERAPY CORPORATION
- Wojtek Sudol
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic power module using polymer p...
- Patent number 12,322,604
- Issue date Jun 3, 2025
- SAFRAN
- Baptiste Joël Christian Fedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and semiconductor module
- Patent number 12,315,838
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor amplifiers that include integrated passive devi...
- Patent number 12,315,829
- Issue date May 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- David Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 12,308,361
- Issue date May 20, 2025
- Nichia Corporation
- Takeshi Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge bend for isolation packages
- Patent number 12,293,953
- Issue date May 6, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package device and method of operating the same
- Patent number 12,293,987
- Issue date May 6, 2025
- Realtek Semiconductor Corporation
- Chih-Chiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siliconized heterogeneous optical engine
- Patent number 12,292,605
- Issue date May 6, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 12,293,992
- Issue date May 6, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,293,950
- Issue date May 6, 2025
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,283,574
- Issue date Apr 22, 2025
- Fuji Electric Co., Ltd.
- Tamiko Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge circuit package structure
- Patent number 12,283,558
- Issue date Apr 22, 2025
- MOTOR SEMICONDUCTOR CO., LTD.
- Kuo-Lun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with antenna and front end integrated circuit
- Patent number 12,279,353
- Issue date Apr 15, 2025
- Skyworks Solutions, Inc.
- George Khoury
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH
- Publication number 20250210496
- Publication date Jun 26, 2025
- Christopher Schaef
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210533
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210580
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hee Woo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF LIDAR SENSOR SYSTEMS HAVING INTEGRATED SEMIC...
- Publication number 20250208299
- Publication date Jun 26, 2025
- AURORA OPERATIONS, INC.
- James Ferrara
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210592
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210424
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210443
- Publication date Jun 26, 2025
- Mitsubishi Electric Corporation
- Yasuhiro SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210504
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Masashi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210570
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hakmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210542
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Wooyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVES TO FACILITATE MOLD COMPOUND FLOW
- Publication number 20250201774
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chittranjan Mohan GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH BOND PAD
- Publication number 20250201738
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JEFFREY SOLAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...
- Publication number 20250201682
- Publication date Jun 19, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE CO...
- Publication number 20250201766
- Publication date Jun 19, 2025
- Intel Corporation
- Nicolas Butzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...
- Publication number 20250201767
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A SUBSTRATE WITH CONNECTING PORTIONS
- Publication number 20250201641
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Gyuhyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250201679
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Mitsuki KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE
- Publication number 20250201680
- Publication date Jun 19, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Lung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250201755
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Kihong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20250194115
- Publication date Jun 12, 2025
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20250192102
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING DEVICE
- Publication number 20250192009
- Publication date Jun 12, 2025
- ACTRON TECHNOLOGY CORPORATION
- PEN-HUNG HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...
- Publication number 20250192077
- Publication date Jun 12, 2025
- CIENA CORPORATION
- Joël Boyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...
- Publication number 20250192035
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Keunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BENT POLYIMIDE TAPE AND ASSOCIATED MANUF...
- Publication number 20250191959
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192007
- Publication date Jun 12, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A COMPOSITE SPACER
- Publication number 20250192129
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES
- Publication number 20250194016
- Publication date Jun 12, 2025
- Western Digital Technologies, Inc.
- Dibin Gangadharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE
- Publication number 20250183238
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual die integrated circuit system in an integrated circuit package...

Packaging structure and power amplifier

Semiconductor device comprising PN junction diode and Schottky barr...

Display device for improving internal quantum efficiency

Inverted leads for packaged isolation devices

Semiconductor package having chip stack

Semiconductor package for a multi-phase motor driving circuit

Semiconductor device

Semiconductor module

Intra-cardiac echocardiography interposer

Device and method for UBM/RDL routing

Method for manufacturing an electronic power module using polymer p...

Die attached leveling control by metal stopper bumps

Wiring structure and semiconductor module

Switching device and electronic circuit

Packaged transistor amplifiers that include integrated passive devi...

Light-emitting device

Package for power semiconductor devices

Edge bend for isolation packages

Semiconductor module and method for manufacturing semiconductor module

Semiconductor package including shielding cover that covers molded...

Electronic package device and method of operating the same

Siliconized heterogeneous optical engine

Semiconductor device and method of forming leadframe with clip bond...

Semiconductor assemblies with systems and methods for managing high...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor module

Half-bridge circuit package structure

Hybrid embedded packaging structure and manufacturing method thereof

Packaged module with antenna and front end integrated circuit

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS OF LIDAR SENSOR SYSTEMS HAVING INTEGRATED SEMIC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

MONITORING OF ELECTRONIC PACKAGES

SEMICONDUCTOR PACKAGE

PASSIVES TO FACILITATE MOLD COMPOUND FLOW

DIE WITH BOND PAD

SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE CO...

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...

SEMICONDUCTOR PACKAGES HAVING A SUBSTRATE WITH CONNECTING PORTIONS

SEMICONDUCTOR DEVICE

INTELLIGENT POWER MODULE

SEMICONDUCTOR PACKAGE

ISOLATOR

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

DRIVING DEVICE

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...

SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...

SEMICONDUCTOR DEVICES WITH BENT POLYIMIDE TAPE AND ASSOCIATED MANUF...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING A COMPOSITE SPACER

EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES

STACK CHIP PACKAGE