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H01L2224/161

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/161Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low cost embedded integrated circuit dies
- Patent number 12,368,089
- Issue date Jul 22, 2025
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,368,280
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,368,132
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side integration semiconductor package and method of forming...
- Patent number 12,368,142
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clock-gating in die-to-die (D2D) interconnects
- Patent number 12,362,306
- Issue date Jul 15, 2025
- Intel Corporation
- Narasimha Lanka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device using EMC wafer support system and fabricating...
- Patent number 12,362,343
- Issue date Jul 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper sensor for 3-dimensional die stack
- Patent number 12,361,808
- Issue date Jul 15, 2025
- Xilinx, Inc.
- Thomas Paul Leboeuf
- G08 - SIGNALLING
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and storage system
- Patent number 12,354,941
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shu-Liang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous integration scheme for III-V/Si and Si CMOS integrated...
- Patent number 12,355,024
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of LIDAR sensor systems having integrated semic...
- Patent number 12,352,868
- Issue date Jul 8, 2025
- AURORA OPERATIONS, INC.
- James Ferrara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Bump structures for low temperature chip bonding
- Patent number 12,354,988
- Issue date Jul 8, 2025
- Northrop Grumman Systems Corporation
- Justin C. Hackley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer circuit
- Patent number 12,352,814
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine-pitch joining pad structure
- Patent number 12,354,983
- Issue date Jul 8, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,987
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 12,347,802
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fault isolation, computer device, medium a...
- Patent number 12,347,093
- Issue date Jul 1, 2025
- China Electronics Reliability And Environmental Testing Institute
- Chao Pang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect architecture with silicon interposer and EMIB
- Patent number 12,347,783
- Issue date Jul 1, 2025
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display panel including electrically connected...
- Patent number 12,342,620
- Issue date Jun 24, 2025
- BOE Technology Group Co., Ltd.
- Xue Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 12,334,474
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having copper pillar within solder bump and...
- Patent number 12,334,463
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode
- Patent number 12,334,481
- Issue date Jun 17, 2025
- PlayNitride Display Co., Ltd.
- Chi-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor structure with a deep trench capacitor structures and...
- Publication number 20250240985
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Fan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239572
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES
- Publication number 20250239579
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tso-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250239215
- Publication date Jul 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- Hyun Joon KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...
- Publication number 20250239543
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Jae Yong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20250233039
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250233111
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233118
- Publication date Jul 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC SYST...
- Publication number 20250234562
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Siwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20250226342
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20250224556
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
- Publication number 20250226365
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250226332
- Publication date Jul 10, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE
- Publication number 20250219004
- Publication date Jul 3, 2025
- NITTO DENKO CORPORATION
- Masatoshi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250219010
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE TRANSFORMER POWER MODULES
- Publication number 20250218908
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo CALABRESE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ACTIVE CHIP WITHIN INTERPOSER
- Publication number 20250219022
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...
- Publication number 20250219036
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Matteo Staffaroni
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low cost embedded integrated circuit dies

Microelectronic devices with through-substrate interconnects and as...

Semiconductor device and method

Joint structure in semiconductor package and manufacturing method t...

Semiconductor chip package having underfill material surrounding a...

Double side integration semiconductor package and method of forming...

Thermocompression bonding with passivated silver-based contacting m...

Clock-gating in die-to-die (D2D) interconnects

Semiconductor device using EMC wafer support system and fabricating...

Tamper sensor for 3-dimensional die stack

Thermocompression bonding with passivated gold contacting metal

3D semiconductor memory device and structure

Chip package structure and storage system

Heterogenous integration scheme for III-V/Si and Si CMOS integrated...

Systems and methods of LIDAR sensor systems having integrated semic...

Bump structures for low temperature chip bonding

Interposer circuit

Fine-pitch joining pad structure

Semiconductor device

Thermocompression bonding with passivated tin-based contacting metal

Die corner removal for underfill crack suppression in semiconductor...

Method and apparatus for fault isolation, computer device, medium a...

Interconnect architecture with silicon interposer and EMIB

Semiconductor components having conductive vias with aligned back s...

Array substrate and display panel including electrically connected...

Forming recesses in molding compound of wafer to reduce stress

Semiconductor structure having copper pillar within solder bump and...

Chip packaging structure and related inner lead bonding method

Micro light-emitting diode

Lthc as charging barrier in info package formation

Patents Applicationslast 30 patents

Semiconductor structure with a deep trench capacitor structures and...

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES

DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...

SEMICONDUCTOR PACKAGE

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC SYST...

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Making a Molded IPD-CoW

INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

MICROELECTRONIC ASSEMBLIES

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

CONNECTING STRUCTURE

SEMICONDUCTOR STRUCTURE

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

MULTI-DIE TRANSFORMER POWER MODULES

EMBEDDED ACTIVE CHIP WITHIN INTERPOSER

ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...