Disposition

Industry

CPC
H01L2224/161

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/161Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor device
- Patent number 12,199,053
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,199,063
- Issue date Jan 14, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable embedded silicon bridge via pillars in lithographically de...
- Patent number 12,199,067
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,199,002
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,199,061
- Issue date Jan 14, 2025
- SK hynix Inc.
- Ha Gyeong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,272
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,238
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
- Patent number 12,191,288
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 12,183,718
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing same, and semiconduc...
- Patent number 12,183,713
- Issue date Dec 31, 2024
- ULTRAMEMORY, INC.
- Fumitake Okutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 12,183,595
- Issue date Dec 31, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and electronic apparatus
- Patent number 12,185,502
- Issue date Dec 31, 2024
- Fujitsu Limited
- Shinya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,664
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having bridge structure for connection between se...
- Patent number 12,183,681
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro bump, method for forming micro bump, chip interconnection str...
- Patent number 12,176,311
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 12,176,334
- Issue date Dec 24, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
- Patent number 12,176,257
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,176,337
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,176,313
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Hyoungjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 12,176,327
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL CHIP OR WAFER STACK
- Publication number 20250022800
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDU...
- Publication number 20250022868
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-DEUK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250022867
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Dooho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022787
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022799
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yong Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250015063
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
- Publication number 20250014986
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Rui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
- Publication number 20250015035
- Publication date Jan 9, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional integrated system with compatible chip and manufa...
- Publication number 20250014969
- Publication date Jan 9, 2025
- CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 44 RESEARCH INSTITUTE
- Xiaodong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015046
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250015025
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...
- Publication number 20250015053
- Publication date Jan 9, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250006648
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ovenized MEMS
- Publication number 20250007455
- Publication date Jan 2, 2025
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250006625
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250008749
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Hyundong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006577
- Publication date Jan 2, 2025
- Innolux Corporation
- Mei-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION
- Publication number 20250006626
- Publication date Jan 2, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Didier BELOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE POWER TRANSFER ON PRINTED CIRCUIT BOARD
- Publication number 20250006713
- Publication date Jan 2, 2025
- Intel Corporation
- Bharath Reddy GUDIGOPURAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250006619
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Chonghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure
- Publication number 20250006684
- Publication date Jan 2, 2025
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
- Publication number 20250006699
- Publication date Jan 2, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH COVER LAYERS
- Publication number 20250006564
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS
- Publication number 20250006719
- Publication date Jan 2, 2025
- Intel Corporation
- Georgios Panagopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429146
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Minwoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a manufacturing method thereof

Multi-die package structures including redistribution layers

3D semiconductor devices and structures with metal layers

Electronic device and semiconductor device

Microelectronic assemblies

Scalable embedded silicon bridge via pillars in lithographically de...

Semiconductor package and method of manufacturing the same

Manufacturing optically accessible co-packaged optics

Semiconductor packages

Multi-chip packaging

Package structure

Semiconductor device assembly with pillar array

Semiconductor package

Electrical bridge package with integrated off-bridge photonic chann...

Manufacturing method of an electronic apparatus

Integrated voltage regulator (IVR) package including inductor and c...

Semiconductor package having a high reliability

Semiconductor module, method for manufacturing same, and semiconduc...

Selective underfill assembly and method therefor

Low cost package warpage solution

Semiconductor apparatus and electronic apparatus

Semiconductor package

Package structure having bridge structure for connection between se...

Micro bump, method for forming micro bump, chip interconnection str...

Method for manufacturing display panel, display panel, and display...

Semiconductor structure having an anti-arcing pattern disposed on a...

Manufacturing method of semiconductor package

Semiconductor devices and methods of manufacturing

Semiconductor package

Method for fabricating electronic package

Patents Applicationslast 30 patents

THREE-DIMENSIONAL CHIP OR WAFER STACK

STACK-TYPE SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDU...

DISPLAY APPARATUS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER

Multi-Die Fine Grain Integrated Voltage Regulation

A SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME

Three-dimensional integrated system with compatible chip and manufa...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Ovenized MEMS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

HIGH VOLTAGE POWER TRANSFER ON PRINTED CIRCUIT BOARD

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Bonding structure

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

SEMICONDUCTOR STRUCTURES WITH COVER LAYERS

ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...