-
Chip Package Structure with Bump
-
Publication number 20240387431
-
Publication date Nov 21, 2024
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Wei-Yu CHEN
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
SEMICONDUCTOR PACKAGE
-
Publication number 20240387311
-
Publication date Nov 21, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Wen-Wei Shen
-
H01 - BASIC ELECTRIC ELEMENTS
-
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
-
Publication number 20240387349
-
Publication date Nov 21, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Chin-Hua WANG
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
SEMICONDUCTOR PACKAGE
-
Publication number 20240387486
-
Publication date Nov 21, 2024
-
Samsung Electronics Co., Ltd.
-
Dahee Kim
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
PACKAGE STRUCTURE
-
Publication number 20240387434
-
Publication date Nov 21, 2024
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Hsien-Wei Chen
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
-
-
MEMORY DEVICE
-
Publication number 20240379136
-
Publication date Nov 14, 2024
-
Macronix International Co., Ltd.
-
Teng-Hao Yeh
-
G11 - INFORMATION STORAGE
-
-
-
SEMICONDUCTOR DEVICE
-
Publication number 20240377851
-
Publication date Nov 14, 2024
-
NUVOTON TECHNOLOGY CORPORATION JAPAN
-
Satoshi ENDO
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
CHIP PACKAGE
-
Publication number 20240379566
-
Publication date Nov 14, 2024
-
Ping-Jung Yang
-
H01 - BASIC ELECTRIC ELEMENTS
-
-