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H01L2224/221

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/221Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,040,299
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Sangkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including post
- Patent number 11,967,578
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of power-grounds in package structures
- Patent number 11,929,340
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,916,035
- Issue date Feb 27, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 11,881,437
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
- Patent number 11,854,922
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,854,927
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 11,824,032
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,784,152
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming Hsien Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,749,657
- Issue date Sep 5, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure with integrated antenna
- Patent number 11,742,564
- Issue date Aug 29, 2023
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,735,553
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Sangkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,721,597
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 11,721,635
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,688,726
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yasunori Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package
- Patent number 11,670,670
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative air gap for antenna fan out package
- Patent number 11,652,273
- Issue date May 16, 2023
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including multiple dies surrounded by conductive...
- Patent number 11,637,071
- Issue date Apr 25, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
- Patent number 11,626,340
- Issue date Apr 11, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 11,322,450
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,309,303
- Issue date Apr 19, 2022
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semicondcutor package
- Patent number 11,233,019
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a thermal conductive layer and meth...
- Patent number 11,205,604
- Issue date Dec 21, 2021
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming openings through insulat...
- Patent number 11,127,666
- Issue date Sep 21, 2021
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having singular wire bond on bonding pads
- Patent number 11,056,465
- Issue date Jul 6, 2021
- Intel Corporation
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure with integrated antenna
- Patent number 11,043,730
- Issue date Jun 22, 2021
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240387310
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH EMBEDDED TRACES
- Publication number 20240387350
- Publication date Nov 21, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371814
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING POST
- Publication number 20240243090
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Jaekul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20240203922
- Publication date Jun 20, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement of Power-Grounds in Package Structures
- Publication number 20240178177
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slot Bow-Tie Antenna On Package
- Publication number 20240178163
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE...
- Publication number 20240153921
- Publication date May 9, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Randy Yach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20240128208
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
- Publication number 20240120248
- Publication date Apr 11, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063179
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240047327
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240021560
- Publication date Jan 18, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
- Publication number 20230387061
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230386955
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20230352432
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Sangkyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230335503
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ASSEMBLY, DISPLAY DEVICE, AND METHOD FOR MAKING LIGH...
- Publication number 20230290758
- Publication date Sep 14, 2023
- Century Technology (Shenzhen) Corporation Limited
- KUANG-HUA LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20230261037
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230260945
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY MODULE WITH THERMAL STORAGE
- Publication number 20230238301
- Publication date Jul 27, 2023
- GE AVIATION SYSTEMS LLC
- Rinaldo Luigi Miorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20230207415
- Publication date Jun 29, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER
- Publication number 20230197661
- Publication date Jun 22, 2023
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
- Publication number 20230130659
- Publication date Apr 27, 2023
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coreless Component Carrier With Embedded Components
- Publication number 20230128938
- Publication date Apr 27, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Allen ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230064152
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230012399
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Dae Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415838
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- SANGJIN LEE
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package

Package structure with conductive patterns in a redistribution layer

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor package including post

Method for packaging an integrated circuit (IC) package with embedd...

Arrangement of power-grounds in package structures

Package structure and manufacturing method thereof

Embedded package with electrically isolating dielectric liner

Semicondutor package substrate with die cavity and redistribution l...

Semiconductor package and method of forming same

Die corner removal for underfill crack suppression in semiconductor...

Semiconductor device package and method for manufacturing the same

Fan-out packaging structure and method

Fan-out package structure with integrated antenna

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device and manufacturing method of the same

Chip package and method of forming the same

Semiconductor device

Manufacturing method of package

Innovative air gap for antenna fan out package

Package structure including multiple dies surrounded by conductive...

Integrated circuit (IC) package with embedded heat spreader in a re...

Semiconductor packages having thermal through vias (TTV)

Chip package and method of forming the same

Semiconductor package including stacked semiconductor chips

Manufacturing method of semicondcutor package

Semiconductor package including a thermal conductive layer and meth...

Semiconductor device and method of forming openings through insulat...

Semiconductor package having singular wire bond on bonding pads

Fan-out package structure with integrated antenna

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

PACKAGE WITH EMBEDDED TRACES

METHOD OF FORMING PACKAGE STRUCTURE

PACKAGE STRUCTURE

PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING POST

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE

Arrangement of Power-Grounds in Package Structures

Slot Bow-Tie Antenna On Package

ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE...

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

Embedded Package with Electrically Isolating Dielectric Liner

QUASI-MONOLITHIC DIE ARCHITECTURES

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF

DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CHIP PACKAGE AND METHOD OF FORMING THE SAME

LIGHT-EMITTING ASSEMBLY, DISPLAY DEVICE, AND METHOD FOR MAKING LIGH...

PACKAGE

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

POWER OVERLAY MODULE WITH THERMAL STORAGE

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER

Embedded Package with Electrically Isolating Dielectric Liner

Coreless Component Carrier With Embedded Components

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME