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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/221
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package including post
Patent number
11,967,578
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Jaekul Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
Patent number
11,929,300
Issue date
Mar 12, 2024
Qorvo US, Inc.
Kevin J. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Arrangement of power-grounds in package structures
Patent number
11,929,340
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ting-Yu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,916,035
Issue date
Feb 27, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded package with electrically isolating dielectric liner
Patent number
11,881,437
Issue date
Jan 23, 2024
Infineon Technologies AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
Patent number
11,854,922
Issue date
Dec 26, 2023
Texas Instruments Incorporated
Vivek Swaminathan Sridharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming same
Patent number
11,854,927
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ting-Chen Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
11,824,032
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method for manufacturing the same
Patent number
11,784,152
Issue date
Oct 10, 2023
Advanced Semiconductor Engineering, Inc.
Ming Hsien Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out packaging structure and method
Patent number
11,749,657
Issue date
Sep 5, 2023
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package structure with integrated antenna
Patent number
11,742,564
Issue date
Aug 29, 2023
Mediatek Inc.
Nai-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
11,735,553
Issue date
Aug 22, 2023
Samsung Electronics Co., Ltd.
Sangkyu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of the same
Patent number
11,721,597
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Yang-Che Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming the same
Patent number
11,721,635
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,688,726
Issue date
Jun 27, 2023
Kioxia Corporation
Yasunori Iwashita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package
Patent number
11,670,670
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Innovative air gap for antenna fan out package
Patent number
11,652,273
Issue date
May 16, 2023
Mediatek Inc.
Nai-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including multiple dies surrounded by conductive...
Patent number
11,637,071
Issue date
Apr 25, 2023
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
Patent number
11,626,340
Issue date
Apr 11, 2023
Qorvo US, Inc.
Kevin J. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having thermal through vias (TTV)
Patent number
11,373,922
Issue date
Jun 28, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Sen-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming the same
Patent number
11,322,450
Issue date
May 3, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including stacked semiconductor chips
Patent number
11,309,303
Issue date
Apr 19, 2022
SK hynix Inc.
Ju Il Eom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semicondcutor package
Patent number
11,233,019
Issue date
Jan 25, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a thermal conductive layer and meth...
Patent number
11,205,604
Issue date
Dec 21, 2021
Samsung Electronics Co., Ltd.
Jae Choon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming openings through insulat...
Patent number
11,127,666
Issue date
Sep 21, 2021
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having singular wire bond on bonding pads
Patent number
11,056,465
Issue date
Jul 6, 2021
Intel Corporation
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package structure with integrated antenna
Patent number
11,043,730
Issue date
Jun 22, 2021
Mediatek Inc.
Nai-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method for manufacturing the same
Patent number
11,037,898
Issue date
Jun 15, 2021
Advanced Semiconductor Engineering, Inc.
Ming Hsien Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and manufacturing method thereof
Patent number
11,018,215
Issue date
May 25, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out semiconductor package
Patent number
11,011,482
Issue date
May 18, 2021
Samsung Electronics Co., Ltd.
Doo Hwan Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
Publication number
20240203922
Publication date
Jun 20, 2024
SiPLP Microelectronics (Chongqing) Limited
Weiyuan YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Arrangement of Power-Grounds in Package Structures
Publication number
20240178177
Publication date
May 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ting-Yu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Slot Bow-Tie Antenna On Package
Publication number
20240178163
Publication date
May 30, 2024
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE...
Publication number
20240153921
Publication date
May 9, 2024
MICROCHIP TECHNOLOGY INCORPORATED
Randy Yach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
Publication number
20240120248
Publication date
Apr 11, 2024
INFINEON TECHNOLOGIES AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063179
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240047327
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Gun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240021560
Publication date
Jan 18, 2024
TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
Ting-Yu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
Publication number
20230387061
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
Publication number
20230386955
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Ting-Chen Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20230352432
Publication date
Nov 2, 2023
Samsung Electronics Co., Ltd.
Sangkyu LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20230335503
Publication date
Oct 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING ASSEMBLY, DISPLAY DEVICE, AND METHOD FOR MAKING LIGH...
Publication number
20230290758
Publication date
Sep 14, 2023
Century Technology (Shenzhen) Corporation Limited
KUANG-HUA LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE
Publication number
20230261037
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
Publication number
20230260945
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER OVERLAY MODULE WITH THERMAL STORAGE
Publication number
20230238301
Publication date
Jul 27, 2023
GE AVIATION SYSTEMS LLC
Rinaldo Luigi Miorini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
Publication number
20230207415
Publication date
Jun 29, 2023
Qorvo US, Inc.
Kevin J. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER
Publication number
20230197661
Publication date
Jun 22, 2023
Intel Corporation
Kristof Kuwawi Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
Publication number
20230130659
Publication date
Apr 27, 2023
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Coreless Component Carrier With Embedded Components
Publication number
20230128938
Publication date
Apr 27, 2023
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Allen ZHAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20230064152
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing company Ltd.
YANG-CHE CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20230012399
Publication date
Jan 12, 2023
Samsung Electronics Co., Ltd.
Dae Hee Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20220415838
Publication date
Dec 29, 2022
Samsung Electronics Co., Ltd.
SANGJIN LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
Publication number
20220406744
Publication date
Dec 22, 2022
Semiconductor Components Industries, LLC
JooYang EOM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...
Publication number
20220406673
Publication date
Dec 22, 2022
TEXAS INSTRUMENTS INCORPORATED
Vivek Swaminathan SRIDHARAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
Publication number
20220310467
Publication date
Sep 29, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ting-Chen Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
Publication number
20220302064
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
Publication number
20220285241
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Sen-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20220254724
Publication date
Aug 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS