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H05K3/0047
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ELECTRICITY
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Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00
Apparatus or processes for manufacturing printed circuits
Current Industry
H05K3/0047
Drilling of holes
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Patents Grants
last 30 patents
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Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
Patent number
11,968,780
Issue date
Apr 23, 2024
International Business Machines Corporation
Kyle Indukummar Giesen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Machining station and method for machining workpieces
Patent number
11,963,305
Issue date
Apr 16, 2024
Skybrain Vermögensverwaltungs GmbH
Markus Winterschladen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensional (3D) copper in printed circuit boards
Patent number
11,956,898
Issue date
Apr 9, 2024
Apple Inc.
Anne M. Mason
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mating backplane for high speed, high density electrical connector
Patent number
11,950,356
Issue date
Apr 2, 2024
Amphenol Corporation
Mark W. Gailus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
Patent number
11,904,073
Issue date
Feb 20, 2024
Verily Life Sciences LLC
Alexander Loo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer and electronic device including the same
Patent number
11,889,626
Issue date
Jan 30, 2024
Samsung Electronics Co., Ltd.
Kyungho Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Machining station and method for controlling or identifying plateli...
Patent number
11,877,387
Issue date
Jan 16, 2024
SCHMOLL MASCHINEN GMBH
Markus Winterschladen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Drill hole inspection method, drill hole inspection system and insp...
Patent number
11,847,774
Issue date
Dec 19, 2023
DER LIH FUH CO., LTD.
Chen-Te Yu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi head flexible printed circuit ultraviolet laser drilling devi...
Patent number
11,839,032
Issue date
Dec 5, 2023
WUHAN HERO OPTOELECTRONICS TECHNOLOGY CO., LTD.
Xuelian Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate with buried component and manufacture method thereof
Patent number
11,792,939
Issue date
Oct 17, 2023
Unimicron Technology Corp.
Yu-Shen Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
Patent number
11,792,928
Issue date
Oct 17, 2023
Acleap Power Inc.
John Andrew Trelford
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
Patent number
11,785,706
Issue date
Oct 10, 2023
Cisco Technology, Inc.
Shadi Ebrahimi Asl
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
LED precision assembly method
Patent number
11,749,791
Issue date
Sep 5, 2023
Jabil Inc.
Weiping Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-core broadband PCB antenna
Patent number
11,735,804
Issue date
Aug 22, 2023
QUALCOMM Incorporated
Chaoqi Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure having conductor extending along dielectric...
Patent number
11,737,205
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for optimized filling hole and manufacturing fine line on pr...
Patent number
11,729,917
Issue date
Aug 15, 2023
TRIALLIAN CORPORATION
Albert Yeh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
Patent number
11,699,640
Issue date
Jul 11, 2023
Infineon Technologies AG
Thomas Stoek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
Patent number
11,696,407
Issue date
Jul 4, 2023
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for back-drilling a multi-layer circuit board
Patent number
11,690,177
Issue date
Jun 27, 2023
NextGin Technology BV
J.A.A.M. Tourne
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electroplating edge connector pins of printed circuit boards withou...
Patent number
11,653,455
Issue date
May 16, 2023
NVIDIA Corporation
Mingyi Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electroless and electrolytic deposition process for forming traces...
Patent number
11,653,453
Issue date
May 16, 2023
CATLAM, LLC
Kenneth S Bahl
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Method for identifying PCB core-layer properties
Patent number
11,644,501
Issue date
May 9, 2023
International Business Machines Corporation
Tao Song
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a closed cavity printed circuit board with pattern...
Patent number
11,622,453
Issue date
Apr 4, 2023
Skyworks Solutions, Inc.
Ki Wook Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component carrier with embedded component exposed by blind hole
Patent number
11,617,259
Issue date
Mar 28, 2023
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Mikael Tuominen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Component carrier with a solid body protecting a component carrier...
Patent number
11,612,064
Issue date
Mar 21, 2023
AT&SAustria Technologie & Systemtechnik AG
Erich Schlaffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board
Patent number
11,558,961
Issue date
Jan 17, 2023
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Jungwoo Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mating backplane for high speed, high density electrical connector
Patent number
11,546,983
Issue date
Jan 3, 2023
Amphenol Corporation
Mark W. Gailus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for maximizing signal integrity on circuit boards
Patent number
11,510,317
Issue date
Nov 22, 2022
Dell Products L.P.
Sandor Farkas
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
Patent number
11,504,453
Issue date
Nov 22, 2022
Verily Life Sciences LLC
Alexander Loo
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Passive device packaging structure embedded in glass medium and met...
Patent number
11,503,712
Issue date
Nov 15, 2022
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
Publication number
20240121897
Publication date
Apr 11, 2024
NXP B.V.
Abdellatif Zanati
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
Publication number
20240114622
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
Publication number
20240114625
Publication date
Apr 4, 2024
SHENNAN CIRCUITS CO.,LTD.
Dantian LIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
Publication number
20240080978
Publication date
Mar 7, 2024
Dell Products L.P.
Sandor FARKAS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
Publication number
20240074055
Publication date
Feb 29, 2024
Micron Technology, Inc.
Walter L. Moden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD MANUFACTURING SYSTEM AND METHOD
Publication number
20240057260
Publication date
Feb 15, 2024
UFab Corporation
Tyler Richards
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INDEXING PROCESSING MACHINE
Publication number
20240042564
Publication date
Feb 8, 2024
SUGINO MACHINE LIMITED
Hiroki HAREMAKI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY
Publication number
20240008186
Publication date
Jan 4, 2024
International Business Machines Corporation
Yanyan Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CAVITY BASED POWER DELIVERY AND DECOUPLING
Publication number
20230397343
Publication date
Dec 7, 2023
Cisco Technology, Inc.
Mike Sapozhnikov
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD TO MANUFACTURE CONDUCTIVE ANODIC FILAMENT-RESISTANT MICROVIAS
Publication number
20230397331
Publication date
Dec 7, 2023
International Business Machines Corporation
Kyle Indukummar Giesen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS
Publication number
20230371169
Publication date
Nov 16, 2023
Cisco Technology, Inc.
Shadi Ebrahimi Asl
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
Publication number
20230354503
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun-Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF, AND ELECTRONI...
Publication number
20230354506
Publication date
Nov 2, 2023
Huawei Technologies Co., Ltd
Feng GAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
Publication number
20230328901
Publication date
Oct 12, 2023
Skyworks Solutions, Inc.
Ki Wook Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
Publication number
20230276578
Publication date
Aug 31, 2023
NVIDIA Corporation
Mingyi YU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semi-Additive Process for Printed Circuit Boards
Publication number
20230247774
Publication date
Aug 3, 2023
CATLAM, LLC
Kenneth S. BAHL
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
MULTI HEAD FLEXIBLE PRINTED CIRCUIT ULTRAVIOLET LASER DRILLING DEVI...
Publication number
20230240019
Publication date
Jul 27, 2023
WUHAN HERO OPTOELECTRONICS TECHNOLOGY CO., LTD.
XUELIAN LI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING A PACKAGING SUBSTRATE, AND PACKAGING SUBST...
Publication number
20230232545
Publication date
Jul 20, 2023
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...
Publication number
20230199958
Publication date
Jun 22, 2023
ABB Schweiz AG
John Andrew Trelford
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
Publication number
20230199945
Publication date
Jun 22, 2023
LG ENERGY SOLUTION, LTD.
Ga Young WOO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Publication number
20230199957
Publication date
Jun 22, 2023
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
Publication number
20230189438
Publication date
Jun 15, 2023
Asahi Kasei Kabushiki Kaisha
Hiroyuki HONMA
D03 - WEAVING
Information
Patent Application
METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS
Publication number
20230180397
Publication date
Jun 8, 2023
R&D Circuits
Donald Eric Thompson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE
Publication number
20230137841
Publication date
May 4, 2023
Unimicron Technology Corp.
John Hon-Shing Lau
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH
Publication number
20230121347
Publication date
Apr 20, 2023
Raytheon Company
Andrew R. Southworth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Machining Station and Method for Machining Workpieces
Publication number
20230119865
Publication date
Apr 20, 2023
Skybrain Vermögensverwaltungs GmbH
Markus Winterschladen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Component Carrier With Partially Metallized Hole Using Anti-Plating...
Publication number
20230119480
Publication date
Apr 20, 2023
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Jiangfeng ZHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
Publication number
20230113153
Publication date
Apr 13, 2023
Amphenol Corporation
Mark W. Gailus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and Drill for Removing Partial Metal Wall of Hole
Publication number
20230097273
Publication date
Mar 30, 2023
UNIMICRON TECHNOLOGY CORPORATION
Cheng-Jui Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FORMING WAVEGUIDES AND HEAT TRANSFER ELEMENTS IN PRINTED CIRCUIT BO...
Publication number
20230082429
Publication date
Mar 16, 2023
TTM TECHNOLOGIES INC.
Niels Kirkeby
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR