Drilling of holes

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CPC
H05K3/0047

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0047Drilling of holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 12,225,658
- Issue date Feb 11, 2025
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,193,155
- Issue date Jan 7, 2025
- Asahi Kasei Kabushiki Kaisha
- Hiroyuki Honma
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Manufacturing method for pcb with thermal conductor embedded therei...
- Patent number 12,171,057
- Issue date Dec 17, 2024
- SHENGYI ELECTRONICS CO., LTD.
- Lu Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technologies for power tunnels on circuit boards
- Patent number 12,156,331
- Issue date Nov 26, 2024
- Intel Corporation
- Khai Ern See
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for detecting defective back-drills in printed ci...
- Patent number 12,153,084
- Issue date Nov 26, 2024
- R & D Circuits, Inc.
- Donald Eric Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cemented carbide and cutting tool using same
- Patent number 12,098,448
- Issue date Sep 24, 2024
- Sumitomo Electric Hardmetal Corp.
- Takahiro Yamakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for removing undesired metal within vias from p...
- Patent number 11,997,800
- Issue date May 28, 2024
- TTM Technologies, Inc.
- Mace Lehrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
- Patent number 11,968,780
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machining station and method for machining workpieces
- Patent number 11,963,305
- Issue date Apr 16, 2024
- Skybrain Vermögensverwaltungs GmbH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
- Patent number 11,904,073
- Issue date Feb 20, 2024
- Verily Life Sciences LLC
- Alexander Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electronic device including the same
- Patent number 11,889,626
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Kyungho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machining station and method for controlling or identifying plateli...
- Patent number 11,877,387
- Issue date Jan 16, 2024
- SCHMOLL MASCHINEN GMBH
- Markus Winterschladen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Drill hole inspection method, drill hole inspection system and insp...
- Patent number 11,847,774
- Issue date Dec 19, 2023
- DER LIH FUH CO., LTD.
- Chen-Te Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi head flexible printed circuit ultraviolet laser drilling devi...
- Patent number 11,839,032
- Issue date Dec 5, 2023
- WUHAN HERO OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xuelian Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 11,785,706
- Issue date Oct 10, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED precision assembly method
- Patent number 11,749,791
- Issue date Sep 5, 2023
- Jabil Inc.
- Weiping Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-core broadband PCB antenna
- Patent number 11,735,804
- Issue date Aug 22, 2023
- QUALCOMM Incorporated
- Chaoqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for optimized filling hole and manufacturing fine line on pr...
- Patent number 11,729,917
- Issue date Aug 15, 2023
- TRIALLIAN CORPORATION
- Albert Yeh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
- Patent number 11,699,640
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD WITH REDUCED VIA STRIPING
- Publication number 20250040045
- Publication date Jan 30, 2025
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...
- Publication number 20250040060
- Publication date Jan 30, 2025
- enovate3D (Hangzhou) Technology Development Co., Ltd.
- Wangcan Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED VIA-IN-VIA VERTICAL CONNECTION
- Publication number 20250031318
- Publication date Jan 23, 2025
- Nokia Solutions and Networks Oy
- Paul BROWN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341043
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
PACKAGING SUBSTRATES HAVING RINGLESS VIAS
- Publication number 20240314940
- Publication date Sep 19, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20240306297
- Publication date Sep 12, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A BATTERY SENSOR
- Publication number 20240274895
- Publication date Aug 15, 2024
- Xin HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE HAVING THE CIRCUIT BOARD AND METHO...
- Publication number 20240244749
- Publication date Jul 18, 2024
- QUAN MEI TECHNOLOGY CO., LTD.
- Ching-Ming FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CEMENTED CARBIDE AND CUTTING TOOL USING SAME
- Publication number 20240240291
- Publication date Jul 18, 2024
- SUMITOMO ELECTRIC HARDMETAL CORP.
- Takahiro YAMAKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...
- Publication number 20240188217
- Publication date Jun 6, 2024
- TTM TECHNOLOGIES INC.
- Matthew Douglas Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
- Publication number 20240114622
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
- Publication number 20240114625
- Publication date Apr 4, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Dantian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
- Publication number 20240080978
- Publication date Mar 7, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MANUFACTURING SYSTEM AND METHOD
- Publication number 20240057260
- Publication date Feb 15, 2024
- UFab Corporation
- Tyler Richards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDEXING PROCESSING MACHINE
- Publication number 20240042564
- Publication date Feb 8, 2024
- SUGINO MACHINE LIMITED
- Hiroki HAREMAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY
- Publication number 20240008186
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Yanyan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAVITY BASED POWER DELIVERY AND DECOUPLING
- Publication number 20230397343
- Publication date Dec 7, 2023
- Cisco Technology, Inc.
- Mike Sapozhnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO MANUFACTURE CONDUCTIVE ANODIC FILAMENT-RESISTANT MICROVIAS
- Publication number 20230397331
- Publication date Dec 7, 2023
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS
- Publication number 20230371169
- Publication date Nov 16, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20230354503
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF, AND ELECTRONI...
- Publication number 20230354506
- Publication date Nov 2, 2023
- Huawei Technologies Co., Ltd
- Feng GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20230328901
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS

Drilling of holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interlaced crosstalk controlled traces, vias, and capacitors

Component carrier having a double dielectric layer and method of ma...

Embeddable electrically insulating thermal connector and circuit bo...

Glass cloth, prepreg, and printed wiring board

Manufacturing method for pcb with thermal conductor embedded therei...

Technologies for power tunnels on circuit boards

System and method for detecting defective back-drills in printed ci...

Method for detecting and adjusting poor back drills in printed circ...

Multi-layer printed circuit board made of different materials and m...

Cemented carbide and cutting tool using same

Method and process for creating high-performance coax sockets

Component carrier comprising at least two components

Systems and methods for removing undesired metal within vias from p...

Method to manufacture conductive anodic filament-resistant microvias

Machining station and method for machining workpieces

Three-dimensional (3D) copper in printed circuit boards

Mating backplane for high speed, high density electrical connector

Biocompatible electromechanical connection for ceramic substrate el...

Interposer and electronic device including the same

Machining station and method for controlling or identifying plateli...

Drill hole inspection method, drill hole inspection system and insp...

Multi head flexible printed circuit ultraviolet laser drilling devi...

Substrate with buried component and manufacture method thereof

Printed circuit boards with plated blind slots for improved vertica...

Interlaced crosstalk controlled traces, vias, and capacitors

LED precision assembly method

Multi-core broadband PCB antenna

Interconnect structure having conductor extending along dielectric...

Method for optimized filling hole and manufacturing fine line on pr...

Power semiconductor module for PCB embedding, power electronic asse...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD WITH REDUCED VIA STRIPING

HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...

PLATED VIA-IN-VIA VERTICAL CONNECTION

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

PACKAGING SUBSTRATES HAVING RINGLESS VIAS

Ultra-Thin Sandwich Component

Three-Dimensional (3D) Copper in Printed Circuit Boards

METHOD OF MAKING A BATTERY SENSOR

CIRCUIT BOARD, ELECTRONIC DEVICE HAVING THE CIRCUIT BOARD AND METHO...

CEMENTED CARBIDE AND CUTTING TOOL USING SAME

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...

Structures for Forming Printed Board Interconnects Using Solder

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...

CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD

SYSTEM AND METHOD TO ELIMINATE VIA STRIPING

SUBSTRATES WITH CONTINUOUS SLOT VIAS

CIRCUIT BOARD MANUFACTURING SYSTEM AND METHOD

INDEXING PROCESSING MACHINE

REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY

CAVITY BASED POWER DELIVERY AND DECOUPLING

METHOD TO MANUFACTURE CONDUCTIVE ANODIC FILAMENT-RESISTANT MICROVIAS

INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF, AND ELECTRONI...

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...