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Eccentric cams

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  • CPC
  • H01L2224/78344
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78344Eccentric cams
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 6,676,005
    • Issue date Jan 13, 2004
    • International Business Machines Corporation
    • Kenji Itoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonder and a bonding tool and bonding arm
    • Patent number 5,699,951
    • Issue date Dec 23, 1997
    • Kaijo Corporation
    • Hideaki Miyoshi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 5,207,370
    • Issue date May 4, 1993
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus for semiconductor device
    • Patent number 4,466,565
    • Issue date Aug 21, 1984
    • Tokyo Shibaura Denki Kabushiki Kaisha
    • Kenzi Miyazima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ball bonding of wire
    • Patent number 4,459,452
    • Issue date Jul 10, 1984
    • The Welding Institute
    • Albert W. Carter
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding method and apparatus
    • Patent number 4,098,447
    • Issue date Jul 4, 1978
    • The Welding Institute
    • Donald A. Edson
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Apparatus for bonding wire leads
    • Patent number 4,037,772
    • Issue date Jul 26, 1977
    • Northern Telecom Limited
    • Jean Marcel Dupuis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method and apparatus for bonding and breaking leads to semiconductors
    • Patent number 3,954,217
    • Issue date May 4, 1976
    • Orthodyne Electronics
    • Michael C. Smith
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    3848473
    • Patent number 3,848,473
    • Issue date Nov 19, 1974
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Grant

    3819102
    • Patent number 3,819,102
    • Issue date Jun 25, 1974
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    3709422
    • Patent number 3,709,422
    • Issue date Jan 9, 1973
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Grant

    3664567
    • Patent number 3,664,567
    • Issue date May 23, 1972
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    3643321
    • Patent number 3,643,321
    • Issue date Feb 22, 1972
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3430835
    • Patent number 3,430,835
    • Issue date Mar 4, 1969
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    3342395
    • Patent number 3,342,395
    • Issue date Sep 19, 1967
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    3211353
    • Patent number 3,211,353
    • Issue date Oct 12, 1965
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3179785
    • Patent number 3,179,785
    • Issue date Apr 20, 1965
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents