3643321

Information

• Patent Grant
• 3643321

• References
• Source

• Patent Number

  3,643,321

• Date Filed

  Not available

• Date Issued

  Tuesday, February 22, 1972
  53 years ago

• CPC

  • H01L24/85 - using a wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L24/45 - of an individual wire connector
  • H01L2224/45015 - being circular
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/78301 - Capillary
  • H01L2224/78344 - Eccentric cams
  • H01L2224/786 - Means for supplying the connector to be connected in the bonding apparatus
  • H01L2224/851 - the connector being supplied to the parts to be connected in the bonding apparatus
  • H01L2224/85181 - connecting first on the semiconductor or solid-state body
  • H01L2224/85201 - Compression bonding
  • H01L2224/85203 - Thermocompression bonding
  • H01L2224/85205 - Ultrasonic bonding
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/14 - Integrated circuits
  • H01L2924/20752 - larger or equal to 20 microns less than 30 microns

• US Classifications

  • 228 - Metal fusion bonding