3430835

Information

• Patent Grant
• 3430835

• References
• Source

• Patent Number

  3,430,835

• Date Filed

  Not available

• Date Issued

  Tuesday, March 4, 1969
  55 years ago

• CPC

  • H01L24/85 - using a wire connector
  • B23K5/006 - specially adapted for particular articles or work
  • B23K20/007 - Ball bonding
  • H01L24/48 - of an individual wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L24/45 - of an individual wire connector
  • H01L2224/45015 - being circular
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/48247 - connecting the wire to a bond pad of the item
  • H01L2224/48465 - the other connecting portion not on the bonding area being a wedge bond
  • H01L2224/48599 - Principal constituent of the connecting portion of the wire connector being Gold (Au)
  • H01L2224/73265 - Layer and wire connectors
  • H01L2224/78301 - Capillary
  • H01L2224/78344 - Eccentric cams
  • H01L2224/85181 - connecting first on the semiconductor or solid-state body
  • H01L2224/85201 - Compression bonding
  • H01L2224/85203 - Thermocompression bonding
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/14 - Integrated circuits
  • H01L2924/16195 - Flat cap [not enclosing an internal cavity]
  • Y10S228/904 - Wire bonding
  • Y10T29/26 - Paper-fastener making
  • Y10T29/49121 - Beam lead frame or beam lead device

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 257 - Active solid-state devices