3211353

Information

• Patent Grant
• 3211353

• References
• Source

• Patent Number

  3,211,353

• Date Filed

  Not available

• Date Issued

  Tuesday, October 12, 1965
  59 years ago

• CPC

  • H01L24/85 - using a wire connector
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L24/48 - of an individual wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01R43/02 - for soldered or welded connections
  • H01L24/45 - of an individual wire connector
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/4847 - the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
  • H01L2224/48599 - Principal constituent of the connecting portion of the wire connector being Gold (Au)
  • H01L2224/78301 - Capillary
  • H01L2224/78344 - Eccentric cams
  • H01L2224/85 - using a wire connector
  • H01L2224/85203 - Thermocompression bonding
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/3011 - Impedance
  • Y10S228/903 - Metal to nonmetal

• US Classifications

  • 228 - Metal fusion bonding