TREA

Encapsulated connections

Follow

Industry

  • CPC
  • H05K2201/10977
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10977Encapsulated connections
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240138066
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240130042
    • Publication date Apr 18, 2024
    • Murata Manufacturing Co., Ltd.
    • Kumiko ISHIKAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...
    • Publication number 20240122073
    • Publication date Apr 11, 2024
    • BFLY OPERATIONS, INC.
    • Jonathan M. Rothberg
    • B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • Information Patent Application

    ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240074127
    • Publication date Feb 29, 2024
    • Chipbond Technology Corporation
    • Chen-Yu Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
    • Publication number 20240044946
    • Publication date Feb 8, 2024
    • ALLEGRO MICROSYSTEMS, LLC
    • Robert A. Briano
    • G01 - MEASURING TESTING
  • Information Patent Application

    STACKABLE VIA PACKAGE AND METHOD
    • Publication number 20230354523
    • Publication date Nov 2, 2023
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Akito Yoshida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS
    • Publication number 20230254975
    • Publication date Aug 10, 2023
    • Samsung Electronics Co., Ltd.
    • Sunjae KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
    • Publication number 20230217599
    • Publication date Jul 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Toru Komatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMBEDDED PRINTED CIRCUIT BOARD
    • Publication number 20230199967
    • Publication date Jun 22, 2023
    • Shinko Electric Industries Co., Ltd.
    • Seiji Sato
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE ASSEMBLY
    • Publication number 20230189434
    • Publication date Jun 15, 2023
    • Wiwynn Corporation
    • Yi Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230113302
    • Publication date Apr 13, 2023
    • LG Innotek Co., Ltd.
    • Yong Han JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20230115957
    • Publication date Apr 13, 2023
    • Samsung Electronics Co., Ltd.
    • KIJU LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20230100404
    • Publication date Mar 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Tadashi NOMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RUGGEDIZED DV-LED DISPLAY SYSTEMS AND MODULES, AND METHODS OF MANUF...
    • Publication number 20230076449
    • Publication date Mar 9, 2023
    • PLANAR SYSTEMS, INC.
    • Pete LUTY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20230060577
    • Publication date Mar 2, 2023
    • Showa Denko Materials Co., Ltd.
    • Kunihiko AKAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD INTERCONNECTION DEVICE AND CIRCUIT BOARD ASSEMBLY
    • Publication number 20230056822
    • Publication date Feb 23, 2023
    • BorgWarner Inc.
    • Sisay Tadele
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230008582
    • Publication date Jan 12, 2023
    • IBIDEN CO., LTD.
    • Yoshinori TAKENAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230011786
    • Publication date Jan 12, 2023
    • IBIDEN CO., LTD.
    • Yoshinori TAKENAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER MODULE WITH HOUSED POWER SEMICONDUCTORS FOR CONTROLLABLE ELEC...
    • Publication number 20220418088
    • Publication date Dec 29, 2022
    • ZF Friedrichshafen AG
    • Thomas Maier
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE STRUCTURE
    • Publication number 20220361317
    • Publication date Nov 10, 2022
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Shungo Hiratani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE
    • Publication number 20220346235
    • Publication date Oct 27, 2022
    • MURATA MANUFACTURING CO., LTD.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Apparatus for manufacturing electronics without PCB
    • Publication number 20220322535
    • Publication date Oct 6, 2022
    • Nikolay V. Khatuntsev
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY
  • Information Patent Application

    MODULE
    • Publication number 20220304201
    • Publication date Sep 22, 2022
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC ELECTRONIC COMPONENT, SUBSTRATE ARRANGEMENT, AND METHOD OF...
    • Publication number 20220301778
    • Publication date Sep 22, 2022
    • Taiyo Yuden Co., Ltd.
    • Yasutomo SUGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FINE PITCH COPPER PILLAR PACKAGE AND METHOD
    • Publication number 20220189866
    • Publication date Jun 16, 2022
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Robert Francis Darveaux
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKABLE VIA PACKAGE AND METHOD
    • Publication number 20220117087
    • Publication date Apr 14, 2022
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Akito Yoshida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC UNIT COMPRISING ELECTRONIC COMPONENTS AND AN ARRANGEMENT...
    • Publication number 20220007517
    • Publication date Jan 6, 2022
    • ZF Friedrichshafen AG
    • Josef Loibl
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE MODULE
    • Publication number 20210410288
    • Publication date Dec 30, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Mok JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit Carrier Having an Installation Place for Electronic Compone...
    • Publication number 20210351151
    • Publication date Nov 11, 2021
    • SIEMENS AKTIENGESELLSCHAFT
    • Robby Urbahn
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOUNTING STRUCTURE AND ELECTRONIC DEVICE
    • Publication number 20210289620
    • Publication date Sep 16, 2021
    • NEC Corporation
    • Kyoko OTSUKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR