Etching selective parts of a metal substrate through part of its thickness

Industry

CPC
H05K2203/0369

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0369Etching selective parts of a metal substrate through part of its thickness

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,999,935
- Issue date May 4, 2021
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for manufacturing flexible printed circuit board (FPCB) and...
- Patent number 10,887,997
- Issue date Jan 5, 2021
- Inktec Co., Ltd.
- Kwang-Choon Chung
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Carrier substrate
- Patent number 10,820,426
- Issue date Oct 27, 2020
- Unimicron Technology Corp.
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Piezochromic stamp
- Patent number 10,813,223
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,515,918
- Issue date Dec 24, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board and stamp
- Patent number 10,512,166
- Issue date Dec 17, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,426,038
- Issue date Sep 24, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,362,682
- Issue date Jul 23, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,163,840
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 10,117,336
- Issue date Oct 30, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for making a circuit board
- Patent number 10,104,771
- Issue date Oct 16, 2018
- Avary Holding (Shenzhen) Co., Limited.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,098,234
- Issue date Oct 9, 2018
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and structure
- Patent number 9,900,996
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiant heat circuit board and method for manufacturing the same
- Patent number 9,844,142
- Issue date Dec 12, 2017
- LG Innotek Co., Ltd
- In Hee Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board with conductive post...
- Patent number 9,713,267
- Issue date Jul 18, 2017
- Ibiden Co., Ltd.
- Toru Furuta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Carrier substrate and manufacturing method thereof
- Patent number 9,661,761
- Issue date May 23, 2017
- Unimicron Technology Corp.
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 9,596,769
- Issue date Mar 14, 2017
- MPI Corporation
- Wei-Cheng Ku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Security mesh and method of making
- Patent number 9,565,777
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 9,480,156
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Toru Furuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded architecture using resin coated copper
- Patent number 9,451,696
- Issue date Sep 20, 2016
- Intel Corporation
- Dilan Seneviratne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,345,143
- Issue date May 17, 2016
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core substrate, manufacturing method thereof, and structure for met...
- Patent number 9,338,887
- Issue date May 10, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hoon Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid printed wiring board and manufacturing method thereof
- Patent number 9,155,209
- Issue date Oct 6, 2015
- Daisho Denshi Co., Ltd.
- Akihiro Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,137,890
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for printed wiring board
- Patent number 9,113,562
- Issue date Aug 18, 2015
- Ibiden Co., Ltd.
- Hideo Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,089,041
- Issue date Jul 21, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating wiring board
- Patent number 9,084,379
- Issue date Jul 14, 2015
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated device and manufacturing method
- Patent number 9,049,806
- Issue date Jun 2, 2015
- Citizen Holdings Co., Ltd.
- Masafumi Ide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid electrolytic capacitor and circuit board having the same
- Patent number 9,030,808
- Issue date May 12, 2015
- Industrial Technology Research Institute
- Chien-Min Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING TRANSMISSION SUBSTRATE
- Publication number 20250151203
- Publication date May 8, 2025
- Sumitomo Electric Industries, Ltd.
- Yuya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20250063651
- Publication date Feb 20, 2025
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240155778
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT PATTERN, SEMI-FINISHED BASE MATERIAL FOR CIRCUIT SUBSTRATE,...
- Publication number 20240023234
- Publication date Jan 18, 2024
- NHK Spring Co., Ltd.
- Shinya YANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Publication number 20220295641
- Publication date Sep 15, 2022
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20190281703
- Publication date Sep 12, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20190019774
- Publication date Jan 17, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOCHROMIC STAMP
- Publication number 20180376599
- Publication date Dec 27, 2018
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR MAKING A CIRCUIT BOARD
- Publication number 20180310406
- Publication date Oct 25, 2018
- Avary Holding (Shenzhen) Co., Limited.
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20170273186
- Publication date Sep 21, 2017
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160044792
- Publication date Feb 11, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150382472
- Publication date Dec 31, 2015
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH CONDUCTIVE POST...
- Publication number 20150282314
- Publication date Oct 1, 2015
- IBIDEN CO., LTD.
- Toru FURUTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDIN...
- Publication number 20150101848
- Publication date Apr 16, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Ji Sung CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20150027977
- Publication date Jan 29, 2015
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Kohichi OHSUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140332252
- Publication date Nov 13, 2014
- Unimicron Technology Corp.
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140226346
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140215782
- Publication date Aug 7, 2014
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF
- Publication number 20140145329
- Publication date May 29, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140116759
- Publication date May 1, 2014
- IBIDEN CO., LTD.
- Satoshi WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140118977
- Publication date May 1, 2014
- Murata Manufacturing Co., Ltd.
- Satoshi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND STRUCTURE FOR MET...
- Publication number 20140102770
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hoon CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED ARCHITECTURE USING RESIN COATED COPPER
- Publication number 20140090879
- Publication date Apr 3, 2014
- Dilan SENEVIRATNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME
- Publication number 20140060908
- Publication date Mar 6, 2014
- LG Innotek Co., Ltd.
- Chung Sik Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH AN INSULATED METAL SUBSTRATE
- Publication number 20140034362
- Publication date Feb 6, 2014
- VALEO SYSTEMES DE CONTROLE MOTEUR
- Emmanuel Talon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20130234328
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID ELECTROLYTIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME
- Publication number 20130233605
- Publication date Sep 12, 2013
- Industrial Technology Research Institute
- Chien-Min Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20130146337
- Publication date Jun 13, 2013
- Samsung Electro-mechanics Co., Ltd.
- Jong-gyu CHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Etching selective parts of a metal substrate through part of its thickness

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Manufacturing method of circuit board

Method for manufacturing flexible printed circuit board (FPCB) and...

Carrier substrate

Piezochromic stamp

Methods of fluxless micro-piercing of solder balls, and resulting d...

Manufacturing method of circuit board and stamp

Manufacturing method of circuit board

Manufacturing method of circuit board

Methods of fluxless micro-piercing of solder balls, and resulting d...

Method of manufacturing a wiring substrate

Method for making a circuit board

Manufacturing method of circuit board

Package substrate and structure

Radiant heat circuit board and method for manufacturing the same

Method for manufacturing printed wiring board with conductive post...

Carrier substrate and manufacturing method thereof

Multilayer circuit board

Security mesh and method of making

Method for manufacturing printed wiring board

Embedded architecture using resin coated copper

Method of fabricating a wiring board

Core substrate, manufacturing method thereof, and structure for met...

Flex-rigid printed wiring board and manufacturing method thereof

Wiring board and light emitting device

Manufacturing method for printed wiring board

Method of fabricating a wiring board

Process for fabricating wiring board

Integrated device and manufacturing method

Solid electrolytic capacitor and circuit board having the same

Patents Applicationslast 30 patents

METHOD FOR PRODUCING TRANSMISSION SUBSTRATE

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

WIRING SUBSTRATE

PRINTED WIRING BOARD

CIRCUIT PATTERN, SEMI-FINISHED BASE MATERIAL FOR CIRCUIT SUBSTRATE,...

Method for producing a metal-ceramic substrate, and metal-ceramic s...

MANUFACTURING METHOD OF CIRCUIT BOARD

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

PIEZOCHROMIC STAMP

METHOD FOR MAKING A CIRCUIT BOARD

MANUFACTURING METHOD OF CIRCUIT BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH CONDUCTIVE POST...

SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDIN...

METHOD OF MANUFACTURING WIRING BOARD

CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND LIGHT EMITTING DEVICE

MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

WIRING BOARD

CORE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND STRUCTURE FOR MET...

EMBEDDED ARCHITECTURE USING RESIN COATED COPPER

PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD WITH AN INSULATED METAL SUBSTRATE

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

SOLID ELECTROLYTIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME

MULTI-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF