Features of the lamination press or of the lamination process

Industry

CPC
H05K2203/068

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/068Features of the lamination press or of the lamination process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,889,624
- Issue date Jan 30, 2024
- Sumitomo Electric Printed Circuits, Inc.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,710,645
- Issue date Jul 25, 2023
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of printed circuit board
- Patent number 11,641,719
- Issue date May 2, 2023
- SHENNAN CIRCUITS CO., LTD.
- Hegen Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer board insulating sheet, multilayer board, and method of...
- Patent number 11,546,989
- Issue date Jan 3, 2023
- TDK Corporation
- Seiko Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating an asymmetric printed circuit board with minimized warpage
- Patent number 11,523,519
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of copper foil and circuit board assembly for...
- Patent number 11,466,379
- Issue date Oct 11, 2022
- Nan Ya Plastics Corporation
- Shih-Ching Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer substrate and method of producing multilayer substrate
- Patent number 11,443,886
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for high-temperature lamination of printed circui...
- Patent number 11,445,619
- Issue date Sep 13, 2022
- Matrix Electronics Limited
- Kieran Healy
- B32 - LAYERED PRODUCTS
Information Patent Grant
Removable tabs and methods of making and using the same
- Patent number 11,414,226
- Issue date Aug 16, 2022
- Hutchinson Technology Incorporated
- Erich W. Bierbrauer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fluororesin film and laminate, and method for producing hot pressed...
- Patent number 11,370,200
- Issue date Jun 28, 2022
- AGC Inc.
- Tomoya Hosoda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing method of mounting structure
- Patent number 11,315,804
- Issue date Apr 26, 2022
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board-to-board connecting structure and method for manufacturing th...
- Patent number 11,310,922
- Issue date Apr 19, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,289,400
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing resin multilayer board
- Patent number 11,212,923
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Jun Wakiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed board
- Patent number 11,212,913
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermo induction press for welding printed circuits and method carr...
- Patent number 11,148,384
- Issue date Oct 19, 2021
- CEDAL EQUIPMENT CO., LTD.
- Marco Bianchi
- B30 - PRESSES
Information Patent Grant
Laminate, method for producing same, and flexible printed circuit b...
- Patent number 11,046,046
- Issue date Jun 29, 2021
- Zeon Corporation
- Mitsuteru Endo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heating of printed circuit board core during laminate cure
- Patent number 11,044,819
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Eric J. Campbell
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fabric having multiple layered circuit thereon integrating with ele...
- Patent number 10,893,608
- Issue date Jan 12, 2021
- National Taipei University of Technology
- Tzu-Wei Chou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Process for the preparation of a flame-retardant modified styrene-m...
- Patent number 10,815,372
- Issue date Oct 27, 2020
- Nan Ya Plastics Corporation
- Cheng-Chung Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal-clad laminate, metal member with resin, and wiring board
- Patent number 10,820,413
- Issue date Oct 27, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing metal-clad laminate, and metal-clad laminate
- Patent number 10,807,352
- Issue date Oct 20, 2020
- Kuraray Co., Ltd.
- Takahiro Nakashima
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photo-curable and heat-curable resin composition and dry film solde...
- Patent number 10,795,259
- Issue date Oct 6, 2020
- LG Chem, Ltd.
- Byung Ju Choi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 10,766,238
- Issue date Sep 8, 2020
- DENSO CORPORATION
- Yoshihito Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for making a multi-layer circuit board using conductive past...
- Patent number 10,765,003
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- Publication number 20250006647
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...
- Publication number 20240397634
- Publication date Nov 28, 2024
- FIND HOW ENTERPRISE CO. LTD.
- Kuo-Ching Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...
- Publication number 20240301176
- Publication date Sep 12, 2024
- Asahi Kasei Kabushiki Kaisha
- Kenzo ONIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board
- Publication number 20240298412
- Publication date Sep 5, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...
- Publication number 20240224433
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS
- Publication number 20240224434
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240196546
- Publication date Jun 13, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20240147633
- Publication date May 2, 2024
- DAIWA CO., LTD.
- Eiji YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORK PATCH FOR AN ELECTRONIC CIRCUIT
- Publication number 20240040706
- Publication date Feb 1, 2024
- Jabil Inc.
- Muhammad Irsyad Bin Suhaimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...
- Publication number 20240032209
- Publication date Jan 25, 2024
- Chihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE FOR HOT-PRESS BONDING
- Publication number 20230422405
- Publication date Dec 28, 2023
- SuperC-Touch Corporation
- Hsiang-Yu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING EXTENDED LENGTH FLEXIBLE CIRCUITS
- Publication number 20230422410
- Publication date Dec 28, 2023
- All Flex Solutions, Inc.
- Jason David Hoium
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...
- Publication number 20230115820
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS AND MULTILAYER CIR...
- Publication number 20230095254
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Sang Min LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via Bond attachment
- Publication number 20230053225
- Publication date Feb 16, 2023
- Harbor Electronics, Inc.
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATOR
- Publication number 20230049939
- Publication date Feb 16, 2023
- DOOSAN CORPORATION
- Sungmoon KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of Manufacturing Component Carrier and Component Carrier Int...
- Publication number 20220377911
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Roll-to-Roll Copper Foil Laminating Device
- Publication number 20220353998
- Publication date Nov 3, 2022
- XIAMEN UNIVERSITY OF TECHNOLOGY
- An Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUI...
- Publication number 20220354001
- Publication date Nov 3, 2022
- Matrix Electronics Limited
- Kieran HEALY
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20220304166
- Publication date Sep 22, 2022
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20220173010
- Publication date Jun 2, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUI...
- Publication number 20220132678
- Publication date Apr 28, 2022
- Matrix Electronics Limited
- Kieran HEALY
- B32 - LAYERED PRODUCTS
Information Patent Application
DOUBLE-SIDED METAL-CLAD LAMINATE AND PRODUCTION METHOD THEREFOR, IN...
- Publication number 20220105707
- Publication date Apr 7, 2022
- DENKA COMPANY LIMITED
- Ikuka INODA
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD OF PRINTED BOARD
- Publication number 20220087011
- Publication date Mar 17, 2022
- MURATA MANUFACTURING CO., LTD.
- Toshikazu HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...
- Publication number 20220061167
- Publication date Feb 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY S...
- Publication number 20210259113
- Publication date Aug 19, 2021
- Nan Ya Plastics Corporation
- SHIH-CHING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20210219425
- Publication date Jul 15, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20210204413
- Publication date Jul 1, 2021
- SHENNAN CIRCUITS CO., LTD.
- Hegen ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Features of the lamination press or of the lamination process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bent laminated printed circuit board

Wiring board

Via bond attachment

Method for manufacturing printed wiring board

Method of manufacturing bonded body for insulation circuit substrat...

Flexible printed circuit board and method of manufacturing flexible...

Manufacturing method of mounting structure, and sheet therefor

Manufacturing method of printed circuit board

Multilayer board insulating sheet, multilayer board, and method of...

Fabricating an asymmetric printed circuit board with minimized warpage

Manufacturing method of copper foil and circuit board assembly for...

Multilayer substrate and method of producing multilayer substrate

System and method for high-temperature lamination of printed circui...

Removable tabs and methods of making and using the same

Fluororesin film and laminate, and method for producing hot pressed...

Manufacturing method of mounting structure

Board-to-board connecting structure and method for manufacturing th...

Method of manufacturing bonded body for insulation circuit substrat...

Method for producing resin multilayer board

Manufacturing method of printed board

Thermo induction press for welding printed circuits and method carr...

Laminate, method for producing same, and flexible printed circuit b...

Heating of printed circuit board core during laminate cure

Fabric having multiple layered circuit thereon integrating with ele...

Process for the preparation of a flame-retardant modified styrene-m...

Metal-clad laminate, metal member with resin, and wiring board

Method for producing metal-clad laminate, and metal-clad laminate

Photo-curable and heat-curable resin composition and dry film solde...

Method of manufacturing multilayer substrate

Method for making a multi-layer circuit board using conductive past...

Patents Applicationslast 30 patents

CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...

Circuit board

DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...

METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

REWORK PATCH FOR AN ELECTRONIC CIRCUIT

MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...

CIRCUIT STRUCTURE FOR HOT-PRESS BONDING

SYSTEM AND METHOD FOR FABRICATING EXTENDED LENGTH FLEXIBLE CIRCUITS

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...

MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS AND MULTILAYER CIR...

Via Bond attachment

LAMINATOR

Method of Manufacturing Component Carrier and Component Carrier Int...

Roll-to-Roll Copper Foil Laminating Device

SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUI...

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUI...

DOUBLE-SIDED METAL-CLAD LAMINATE AND PRODUCTION METHOD THEREFOR, IN...

MANUFACTURING METHOD OF PRINTED BOARD

BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...

MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY S...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD