for devices being provided for in H01L29/00

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POWER MODULE

    • Publication number 20240421106
    • Publication date Dec 19, 2024
    • Hyundai Motor Company
    • Jin Myeong YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BIPOLAR TRANSISTOR

    • Publication number 20240404940
    • Publication date Dec 5, 2024
    • STMicroelectronics International N.V.
    • Pascal CHEVALIER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

    • Publication number 20240404941
    • Publication date Dec 5, 2024
    • ROHM CO., LTD.
    • Asuma IMAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND VEHICLE

    • Publication number 20240404939
    • Publication date Dec 5, 2024
    • Fuji Electric Co., Ltd.
    • Tsubasa NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240395691
    • Publication date Nov 28, 2024
    • Fuji Electric Co., Ltd.
    • Yuta EBUKURO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    • Publication number 20240395690
    • Publication date Nov 28, 2024
    • Mitsubishi Electric Corporation
    • Kenta NAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240387474
    • Publication date Nov 21, 2024
    • DENSO CORPORATION
    • TOSHIHIRO NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE

    • Publication number 20240387473
    • Publication date Nov 21, 2024
    • Fuji Electric Co., Ltd.
    • Tomoya KISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SWITCHING DEVICE AND POWER SUPPLY DEVICE

    • Publication number 20240388209
    • Publication date Nov 21, 2024
    • Rohm Co., Ltd.
    • Tan Nhat HOANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

    • Publication number 20240347441
    • Publication date Oct 17, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Anindya Poddar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240321834
    • Publication date Sep 26, 2024
    • Fuji Electric Co., Ltd.
    • Mitsuhiro KAKEFU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE

    • Publication number 20240321811
    • Publication date Sep 26, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    • Publication number 20240321720
    • Publication date Sep 26, 2024
    • Mitsubishi Electric Corporation
    • Yuki YANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240312960
    • Publication date Sep 19, 2024
    • Kabushiki Kaisha Toshiba
    • Shun TAKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE ARRANGEMENT

    • Publication number 20240304538
    • Publication date Sep 12, 2024
    • INFINEON TECHNOLOGIES AG
    • Christoph Bayer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20240304537
    • Publication date Sep 12, 2024
    • Fuji Electric Co., Ltd.
    • Motohito HORI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240282692
    • Publication date Aug 22, 2024
    • ROHM CO., LTD.
    • Yo MOCHIZUKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

    • Publication number 20240282675
    • Publication date Aug 22, 2024
    • ROHM CO., LTD.
    • Toshio HANADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

    • Publication number 20240274523
    • Publication date Aug 15, 2024
    • Monolithic 3D Inc.
    • Zvi Or-Bach
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

    • Publication number 20240258264
    • Publication date Aug 1, 2024
    • DENSO CORPORATION
    • Takanori KAWASHIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE THERMAL MANAGEMENT

    • Publication number 20240234238
    • Publication date Jul 11, 2024
    • GM GLOBAL TECHNOLOGY OPERATIONS LLC
    • Chandra S. Namuduri
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COOLED POWER MODULE

    • Publication number 20240234239
    • Publication date Jul 11, 2024
    • GM GLOBAL TECHNOLOGY OPERATIONS LLC
    • Muhammad Hussain Alvi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC APPARATUS

    • Publication number 20240222254
    • Publication date Jul 4, 2024
    • Shinko Electric Industries Co., Ltd.
    • Kenichi Koi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20240222214
    • Publication date Jul 4, 2024
    • HYUNDAI MOBIS CO., LTD.
    • Yoon Ju KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240222255
    • Publication date Jul 4, 2024
    • Power Master Semiconductor Co., Ltd.
    • Jooyaung EOM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...

    • Publication number 20240203912
    • Publication date Jun 20, 2024
    • NXP USA, Inc.
    • Jeffrey Spencer Roberts
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE

    • Publication number 20240203862
    • Publication date Jun 20, 2024
    • ROBERT BOSCH GmbH
    • Gunnar BRUNS
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE ARRANGEMENT

    • Publication number 20240203950
    • Publication date Jun 20, 2024
    • INFINEON TECHNOLOGIES AG
    • Christian MÜLLER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW RESISTANCE METALIZATION FOR CONNECTING A VERTICAL TRANSPORT FET...

    • Publication number 20240203993
    • Publication date Jun 20, 2024
    • International Business Machines Corporation
    • Brent A. Anderson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE

    • Publication number 20240203863
    • Publication date Jun 20, 2024
    • ROBERT BOSCH GmbH
    • Gunnar BRUNS
    • H01 - BASIC ELECTRIC ELEMENTS