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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49844for devices being provided for in H01L29/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,249,570
- Issue date Mar 11, 2025
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving current balance of parallel chips in power modu...
- Patent number 12,243,814
- Issue date Mar 4, 2025
- Hyundai Mobis Co., Ltd.
- Yu Cheol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a thermally and electrically conductiv...
- Patent number 12,224,222
- Issue date Feb 11, 2025
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with power electronics carrier having trench...
- Patent number 12,183,667
- Issue date Dec 31, 2024
- Infineon Technologies AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,810
- Issue date Dec 3, 2024
- Denso Corporation
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 12,131,988
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,125,779
- Issue date Oct 22, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,113,009
- Issue date Oct 8, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,100,646
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,739
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Toshiya Tadakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,235
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masaaki Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,033,984
- Issue date Jul 9, 2024
- Fuji Electric Co., Ltd.
- Mitsuhiro Kakefu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked die multichip module package
- Patent number 12,015,019
- Issue date Jun 18, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a multi-branch switch node connector
- Patent number 12,009,290
- Issue date Jun 11, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure coupled to multiple interconnect conductive\ str...
- Patent number 11,990,433
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,978,700
- Issue date May 7, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient IGBT switching
- Patent number 11,979,141
- Issue date May 7, 2024
- EHT Ventures LLC
- Timothy Ziemba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
- Patent number 11,973,015
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Masashi Hoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250069981
- Publication date Feb 27, 2025
- Mitsubishi Electric Corporation
- Shogo TOKUMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069967
- Publication date Feb 27, 2025
- DENSO CORPORATION
- Akinori SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046664
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20250038075
- Publication date Jan 30, 2025
- Huawei Technologies Co., Ltd
- Weichuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL, METHOD FOR MANUFACTURING TERMINAL, AND SEMICONDUCTOR DEVICE
- Publication number 20250038098
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
- Publication number 20250040231
- Publication date Jan 30, 2025
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20250038079
- Publication date Jan 30, 2025
- Mitsubishi Electric Corporation
- Ren KUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MULTI-CHIP PACKAGE DEVICE
- Publication number 20250022721
- Publication date Jan 16, 2025
- FORCE MOS TECHNOLOGY CO., LTD.
- YUAN-SHUN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022791
- Publication date Jan 16, 2025
- FLOSFIA INC.
- Hiroshi KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY
- Publication number 20250014973
- Publication date Jan 9, 2025
- Wolfspeed, Inc.
- Paul WHEELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429206
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240421106
- Publication date Dec 19, 2024
- Hyundai Motor Company
- Jin Myeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR TRANSISTOR
- Publication number 20240404940
- Publication date Dec 5, 2024
- STMicroelectronics International N.V.
- Pascal CHEVALIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND VEHICLE
- Publication number 20240404939
- Publication date Dec 5, 2024
- Fuji Electric Co., Ltd.
- Tsubasa NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395691
- Publication date Nov 28, 2024
- Fuji Electric Co., Ltd.
- Yuta EBUKURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395690
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387474
- Publication date Nov 21, 2024
- DENSO CORPORATION
- TOSHIHIRO NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240387473
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Tomoya KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND POWER SUPPLY DEVICE
- Publication number 20240388209
- Publication date Nov 21, 2024
- Rohm Co., Ltd.
- Tan Nhat HOANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321834
- Publication date Sep 26, 2024
- Fuji Electric Co., Ltd.
- Mitsuhiro KAKEFU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240321720
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Yuki YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312960
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Shun TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240304538
- Publication date Sep 12, 2024
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240304537
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS

for devices being provided for in H01L29/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Method of improving current balance of parallel chips in power modu...

Semiconductor package having a thermally and electrically conductiv...

Semiconductor package with power electronics carrier having trench...

Die package and method of forming a die package

Semiconductor device

Gallium nitride (GAN) three-dimensional integrated circuit technology

Power amplifier modules including semiconductor resistor and tantal...

Semiconductor package and passive element with interposer

Semiconductor device

Semiconductor device

3D semiconductor device and structure with metal layers

Semiconductor device

Package with different types of semiconductor dies attached to a fl...

Semiconductor device

Semiconductor module

Semiconductor device

Semiconductor device

Semiconductor device package with thermal pad

Stacked die multichip module package

Semiconductor module having a multi-branch switch node connector

Bond pad structure coupled to multiple interconnect conductive\ str...

Semiconductor package having a chip carrier with a pad offset feature

Power semiconductor module arrangement

Efficient IGBT switching

Power module semiconductor device and inverter equipment, and fabri...

Plurality of overlapping power terminals in a semiconductor module

Semiconductor device

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device package comprising a pin in the form of a dril...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE

TERMINAL, METHOD FOR MANUFACTURING TERMINAL, AND SEMICONDUCTOR DEVICE

GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

METHOD OF MAKING A MULTI-CHIP PACKAGE DEVICE

SEMICONDUCTOR DEVICE

POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY

SEMICONDUCTOR DEVICE

POWER MODULE

BIPOLAR TRANSISTOR

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND VEHICLE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SWITCHING DEVICE AND POWER SUPPLY DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE ARRANGEMENT

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...