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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49844for devices being provided for in H01L29/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
- Patent number 11,973,015
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Masashi Hoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,942,411
- Issue date Mar 26, 2024
- Mitsubishi Electric Corporation
- Takamasa Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with press-fit contacts
- Patent number 11,901,273
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic optoelectronic module packaging
- Patent number 11,886,023
- Issue date Jan 30, 2024
- II-VI DELAWARE, INC.
- Gilles P. Denoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 11,881,398
- Issue date Jan 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module, and electronic...
- Patent number 11,876,029
- Issue date Jan 16, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 11,869,836
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Donghee Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,871,571
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Soodoo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power transistors
- Patent number 11,862,536
- Issue date Jan 2, 2024
- MACOM Technology Solutions Holdings, Inc.
- Aram Mkhitarian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 11,848,262
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically power assembly with thick electrically conductive layers
- Patent number 11,791,254
- Issue date Oct 17, 2023
- Mitsubishi Electric Corporation
- Roberto Mrad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 11,791,255
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metal layer in power packages
- Patent number 11,784,114
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 11,776,890
- Issue date Oct 3, 2023
- Samsung SDI Co., Ltd.
- Florian Maxl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Embedded die packaging for power semiconductor devices
- Patent number 11,776,883
- Issue date Oct 3, 2023
- GaN Systems Inc.
- Cameron Mcknight-Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,891
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,764,141
- Issue date Sep 19, 2023
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing electronic module
- Patent number 11,756,906
- Issue date Sep 12, 2023
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front end (RFFE) hetero-integration
- Patent number 11,749,746
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,511
- Issue date Aug 22, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,688,722
- Issue date Jun 27, 2023
- Fuji Electric Co., Ltd.
- Mitsuhiro Kakefu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,664,304
- Issue date May 30, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128241
- Publication date Apr 18, 2024
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME
- Publication number 20240128246
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC OPTOELECTRONIC MODULE PACKAGING
- Publication number 20240118506
- Publication date Apr 11, 2024
- II-VI Delaware, Inc.
- Gilles P. Denoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
- Publication number 20240113046
- Publication date Apr 4, 2024
- Intel Corporation
- Jason Scott Steill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105566
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105578
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088064
- Publication date Mar 14, 2024
- Mitsubishi Electric Corporation
- Daichi OTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Passive Element with Interposer
- Publication number 20240079310
- Publication date Mar 7, 2024
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079383
- Publication date Mar 7, 2024
- DENSO CORPORATION
- TAKANORI KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240071898
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Parasitic Inductance Power Module Having Staggered, Interleavin...
- Publication number 20240063149
- Publication date Feb 22, 2024
- Sentec E&E Co., Ltd.
- Jason An Cheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055316
- Publication date Feb 15, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047433
- Publication date Feb 8, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240047311
- Publication date Feb 8, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20240047330
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240047338
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030080
- Publication date Jan 25, 2024
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20240030078
- Publication date Jan 25, 2024
- Fuji Electric Co., Ltd.
- Naoki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE
- Publication number 20240021512
- Publication date Jan 18, 2024
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240021487
- Publication date Jan 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230411339
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411274
- Publication date Dec 21, 2023
- Yoichi NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20230402363
- Publication date Dec 14, 2023
- Samsung SDI Co., Ltd.
- Florian MAXL
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230402421
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395483
- Publication date Dec 7, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE COUPLED TO MULTIPLE INTERCONNECT CONDUCTIVE\ STR...
- Publication number 20230395540
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES HAVING MOISTURE BARRIERS
- Publication number 20230378010
- Publication date Nov 23, 2023
- Wolfspeed, Inc.
- Dev Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE INTEGRATED CIRCUIT PACKAGE
- Publication number 20230378022
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230369195
- Publication date Nov 16, 2023
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS

for devices being provided for in H01L29/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Plurality of overlapping power terminals in a semiconductor module

Semiconductor device

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device package comprising a pin in the form of a dril...

Semiconductor module

Semiconductor module

Semiconductor device

Power module with press-fit contacts

Photonic optoelectronic module packaging

Semiconductor device and method for supporting ultra-thin semicondu...

Method of manufacturing electronic component module, and electronic...

Semiconductor device having a metallization structure

Method for forming a semiconductor device

Nonvolatile memory device and method for fabricating the same

High power transistors

Semiconductor package and passive element with interposer

Electrically power assembly with thick electrically conductive layers

Die package and method of forming a die package

Plated metal layer in power packages

Power semiconductor device

Embedded die packaging for power semiconductor devices

Semiconductor device

Semiconductor device

Electronic module and method of manufacturing electronic module

Radio frequency front end (RFFE) hetero-integration

Semiconductor device

Semiconductor device

Semiconductor package having a chip carrier and a metal plate sized...

Semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME

PHOTONIC OPTOELECTRONIC MODULE PACKAGING

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

SEMICONDUCTOR DEVICE

Semiconductor Package and Passive Element with Interposer

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Low Parasitic Inductance Power Module Having Staggered, Interleavin...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

PLATED METAL LAYER IN POWER PACKAGES

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

BOND PAD STRUCTURE COUPLED TO MULTIPLE INTERCONNECT CONDUCTIVE\ STR...

POWER SEMICONDUCTOR DEVICES HAVING MOISTURE BARRIERS

POWER MODULE INTEGRATED CIRCUIT PACKAGE

POWER MODULE AND METHOD FOR MANUFACTURING SAME