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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03003for holding or transferring a preform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternative integration for redistribution layer process
- Patent number 11,450,631
- Issue date Sep 20, 2022
- Lam Research Corporation
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated stretchable electronics
- Patent number 11,375,895
- Issue date Jul 5, 2022
- The Regents of the University of California
- Sheng Xu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,282,810
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-foil-attached ultra-thin copper foil
- Patent number 11,164,831
- Issue date Nov 2, 2021
- Iljin Materials Co., Ltd.
- Won Jin Beom
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,004,838
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated fan-out package
- Patent number 10,756,052
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with carrier construction configuration a...
- Patent number 10,679,954
- Issue date Jun 9, 2020
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for hybrid wafer bonding integrated with CMOS processing
- Patent number 10,510,597
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Nan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 10,475,779
- Issue date Nov 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure
- Patent number 10,431,559
- Issue date Oct 1, 2019
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated fan-out package
- Patent number 10,366,966
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, making method, and laminate
- Patent number 10,297,485
- Issue date May 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 10,068,887
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with periphery contact pads surrounding central c...
- Patent number 9,859,196
- Issue date Jan 2, 2018
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,847,324
- Issue date Dec 19, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,768,155
- Issue date Sep 19, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for hybrid wafer bonding integrated with CMOS processing
- Patent number 9,728,453
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Nan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with first and second contact pads and related me...
- Patent number 9,466,557
- Issue date Oct 11, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 9,159,680
- Issue date Oct 13, 2015
- Samsung Electronics Co., Ltd.
- Sang-Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,082,806
- Issue date Jul 14, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,076,752
- Issue date Jul 7, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,064,936
- Issue date Jun 23, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 8,912,088
- Issue date Dec 16, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic device by reducing thickness...
- Patent number 8,815,651
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...
- Publication number 20240243081
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF...
- Publication number 20210257322
- Publication date Aug 19, 2021
- ACTRON TECHNOLOGY CORPORATION
- I-Dar Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200335477
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FOIL-ATTACHED ULTRA-THIN COPPER FOIL
- Publication number 20190371750
- Publication date Dec 5, 2019
- ILJIN Materials Co., Ltd.
- Won Jin Beom
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED FAN-OUT PACKAGE
- Publication number 20190355694
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...
- Publication number 20190184480
- Publication date Jun 20, 2019
- The Government of the United States of America, as represented by the Secreta...
- Raymond C.Y. Auyeung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20190013283
- Publication date Jan 10, 2019
- Powertech Technology Inc.
- HIROYUKI FUJISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...
- Publication number 20180374809
- Publication date Dec 27, 2018
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20180374836
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20180026023
- Publication date Jan 25, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Hybrid Wafer Bonding Integrated with CMOS Processing
- Publication number 20170338150
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Nan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20160027694
- Publication date Jan 28, 2016
- Semiconductor Components Industries, LLC
- Darrel Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-BASED METAL DIFFUSION BARRIER
- Publication number 20140339700
- Publication date Nov 20, 2014
- Fan Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CHIP PACKAGE STRUCTURE
- Publication number 20140322869
- Publication date Oct 30, 2014
- CHIPMOS TECHNOLOGIES INC.
- Chien-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Hybrid Wafer Bonding Integrated with CMOS Processing
- Publication number 20140273347
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Nan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...
- Publication number 20140230989
- Publication date Aug 21, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140231981
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140145343
- Publication date May 29, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20130200528
- Publication date Aug 8, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...
- Publication number 20130196504
- Publication date Aug 1, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20130168870
- Publication date Jul 4, 2013
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20120309130
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20120309167
- Publication date Dec 6, 2012
- Sang-Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
- Publication number 20120306092
- Publication date Dec 6, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
- Publication number 20120119367
- Publication date May 17, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Contacting a Semiconductor Substrate
- Publication number 20120080088
- Publication date Apr 5, 2012
- UNIVERSITAET STUTTGART
- Peter Grabitz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120049386
- Publication date Mar 1, 2012
- Samsung Electronics Co., Ltd.
- Hyung-Geun OH
- H01 - BASIC ELECTRIC ELEMENTS

for holding or transferring a preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged die and RDL with bonding structures therebetween

High-temperature superconducting striated tape combinations

Packaged die and RDL with bonding structures therebetween

Fabrication of high-temperature superconducting striated tape combi...

Alternative integration for redistribution layer process

Three-dimensional integrated stretchable electronics

Integrated fan-out package and manufacturing method thereof

Carrier-foil-attached ultra-thin copper foil

Packaged die and RDL with bonding structures therebetween

Method of manufacturing integrated fan-out package

Integrated circuit system with carrier construction configuration a...

Methods for hybrid wafer bonding integrated with CMOS processing

Semiconductor device and method of forming a vertical interconnect...

Method for manufacturing a semiconductor structure

Method of manufacturing integrated fan-out package

Semiconductor device, making method, and laminate

Transfer substrate for forming metal wiring and method for forming...

Semiconductor packages and methods of forming the same

Electronic device with periphery contact pads surrounding central c...

Semiconductor device and method of forming a vertical interconnect...

Method for creating a connection between metallic moulded bodies an...

Semiconductor device and method of forming a vertical interconnect...

Methods for hybrid wafer bonding integrated with CMOS processing

Electronic device with first and second contact pads and related me...

Method of fabricating semiconductor device

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and method for manufacturing the same

Semiconductor device and method of forming a vertical interconnect...

Transfer substrate for forming metal wiring and method for forming...

Method for manufacturing an electronic device by reducing thickness...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

CARRIER-FOIL-ATTACHED ULTRA-THIN COPPER FOIL

METHOD OF MANUFACTURING INTEGRATED FAN-OUT PACKAGE

Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...

Semiconductor package and manufacturing method thereof

INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...

Semiconductor Packages and Methods of Forming the Same

Semiconductor Device and Method of Forming a Vertical Interconnect...

Methods for Hybrid Wafer Bonding Integrated with CMOS Processing

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

GRAPHENE-BASED METAL DIFFUSION BARRIER

METHOD FOR MANUFACTURING CHIP PACKAGE STRUCTURE

Methods for Hybrid Wafer Bonding Integrated with CMOS Processing

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Method of Forming a Vertical Interconnect...

TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...

DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

Method of Manufacturing a Semiconductor Device

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

Method of Contacting a Semiconductor Substrate

SEMICONDUCTOR PACKAGE