for shielding around a single via or around a group of vias

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC SYSTEM

    • Publication number 20240314920
    • Publication date Sep 19, 2024
    • MEDIATEK INC.
    • Tso-Ju YI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240298406
    • Publication date Sep 5, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD

    • Publication number 20240282687
    • Publication date Aug 22, 2024
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH FREQUENCY CIRCUIT

    • Publication number 20240237192
    • Publication date Jul 11, 2024
    • Sumitomo Electric Industries, Ltd.
    • Shun IGARASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

    • Publication number 20240196518
    • Publication date Jun 13, 2024
    • Amphenol Corporation
    • Mark W. Gailus
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH FREQUENCY CIRCUIT

    • Publication number 20240138055
    • Publication date Apr 25, 2024
    • Sumitomo Electric Industries, Ltd.
    • Shun IGARASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE WITH SELF SHIELDING

    • Publication number 20240121884
    • Publication date Apr 11, 2024
    • Avago Technologies International Sales Pte. Limited
    • Hongya Xu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD

    • Publication number 20230389172
    • Publication date Nov 30, 2023
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS

    • Publication number 20230363083
    • Publication date Nov 9, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Snehamay Sinha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

    • Publication number 20230354503
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jiun-Yi WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE

    • Publication number 20230262890
    • Publication date Aug 17, 2023
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wiring Board and Signal Connecting Structure

    • Publication number 20230240001
    • Publication date Jul 27, 2023
    • Nippon Telegraph and Telephone Corporation
    • Hitoshi Wakita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS

    • Publication number 20230180397
    • Publication date Jun 8, 2023
    • R&D Circuits
    • Donald Eric Thompson
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE

    • Publication number 20230156908
    • Publication date May 18, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE

    • Publication number 20230156909
    • Publication date May 18, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE

    • Publication number 20230156918
    • Publication date May 18, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD GROUND VIA PATTERNS FOR MINIMIZING CROSSTALK BETWEEN...

    • Publication number 20230138739
    • Publication date May 4, 2023
    • Dell Products L.P.
    • James CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

    • Publication number 20230113153
    • Publication date Apr 13, 2023
    • Amphenol Corporation
    • Mark W. Gailus
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COAXIAL VIA SHIELDED INTERPOSER

    • Publication number 20230063808
    • Publication date Mar 2, 2023
    • Apple Inc.
    • Nima Shahidi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIDE BAND PRINTED CIRCUIT BOARD THROUGH CONNECTOR

    • Publication number 20230053195
    • Publication date Feb 16, 2023
    • Daniel S. Shaw
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

    • Publication number 20220386451
    • Publication date Dec 1, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jiun-Yi WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

    • Publication number 20220386453
    • Publication date Dec 1, 2022
    • Nitto Denko Corporation
    • Akihito MATSUTOMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SLOTTED VIAS FOR CIRCUIT BOARDS

    • Publication number 20220369452
    • Publication date Nov 17, 2022
    • Dell Products L.P.
    • Jason PRITCHARD
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    AUTOMATION FIELD DEVICE

    • Publication number 20220330418
    • Publication date Oct 13, 2022
    • Endress+Hauser SE+Co. KG
    • Christian Strittmatter
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT AND DISPLAY APPARATUS

    • Publication number 20220317735
    • Publication date Oct 6, 2022
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Meizhu ZHENG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD

    • Publication number 20220304153
    • Publication date Sep 22, 2022
    • NextGin Technology BV
    • J.A.A.M. Tourne
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESONANT-COUPLED TRANSMISSION LINE

    • Publication number 20220272834
    • Publication date Aug 25, 2022
    • Teradyne, Inc.
    • Andrew Westwood
    • G01 - MEASURING TESTING
  • Information Patent Application

    CO-AXIAL VIA STRUCTURE

    • Publication number 20220240368
    • Publication date Jul 28, 2022
    • Unimicron Technology Corp.
    • Pei-Wei WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME

    • Publication number 20220240375
    • Publication date Jul 28, 2022
    • Unimicron Technology Corp.
    • Ching-Sheng CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

    • Publication number 20220232694
    • Publication date Jul 21, 2022
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR