for supporting the semiconductor or solid-state body

Industry

CPC
H01L2224/03002

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03002for supporting the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic carrier for high aspect ratio fanout
- Patent number 11,955,349
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,855,061
- Issue date Dec 26, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 11,791,307
- Issue date Oct 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,742,217
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device including patternin...
- Patent number 11,670,609
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display apparatus
- Patent number 11,618,940
- Issue date Apr 4, 2023
- Samsung Display Co., Ltd.
- Kyubum Kim
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of manufacturing display apparatus
- Patent number 11,597,994
- Issue date Mar 7, 2023
- Samsung Display Co., Ltd.
- Kyubum Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,444,020
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged dies with metal outer layers extending from die back sides...
- Patent number 11,437,276
- Issue date Sep 6, 2022
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,437,359
- Issue date Sep 6, 2022
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,435,523
- Issue date Sep 6, 2022
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with exposed input/output pad in recess
- Patent number 11,430,775
- Issue date Aug 30, 2022
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having an epitaxial vertical semico...
- Patent number 11,424,231
- Issue date Aug 23, 2022
- SanDisk Technologies LLC
- Adarsh Rajashekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic carrier for high aspect ratio fanout
- Patent number 11,393,701
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad-out structure for semiconductor device and method of forming th...
- Patent number 11,387,218
- Issue date Jul 12, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liang Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a cleaning compo...
- Patent number 11,380,537
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Hoyoung Kim
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Batch manufacture of component carriers
- Patent number 11,380,650
- Issue date Jul 5, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition
- Patent number 11,347,146
- Issue date May 31, 2022
- Toray Industries, Inc.
- Yuki Masuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 11,348,833
- Issue date May 31, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 11,282,796
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,211,372
- Issue date Dec 28, 2021
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for standard logic performance improvement having a back-...
- Patent number 11,107,767
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,069,652
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device comprising a conductiv...
- Patent number 11,043,458
- Issue date Jun 22, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Won Chul Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,018,086
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,004,826
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
- Publication number 20240006352
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- SyuFong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Polymer Layer to Reduce Stress
- Publication number 20230260939
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20230197652
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaoxuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
- Publication number 20230114550
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Yongbum KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE
- Publication number 20230040064
- Publication date Feb 9, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wei XIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20220392882
- Publication date Dec 8, 2022
- ADVANCED MICRO DEVICES, INC.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220384373
- Publication date Dec 1, 2022
- XINTEC INC.
- Chieh CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Carrier for High Aspect Ratio Fanout
- Publication number 20220328327
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD-OUT STRUCTURE FOR XTACKING ARCHITECTURE
- Publication number 20220068883
- Publication date Mar 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liang XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210407984
- Publication date Dec 30, 2021
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20210233889
- Publication date Jul 29, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Chandrasekhar MANDALAPU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pattern Polymer Layer to Reduce Stress
- Publication number 20210175190
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Devices in Package-on-Package Structures and Methods for Fo...
- Publication number 20210125923
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20210066274
- Publication date Mar 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Carrier for High Aspect Ratio Fanout
- Publication number 20210050229
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING AN EPITAXIAL VERTICAL SEMICO...
- Publication number 20200335487
- Publication date Oct 22, 2020
- SANDISK TECHNOLOGIES LLC
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...
- Publication number 20200335398
- Publication date Oct 22, 2020
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Manufacture of Component Carriers
- Publication number 20200251445
- Publication date Aug 6, 2020
- AT&S Austria Technologies & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Semiconductor Device Connection and Methods of Forming the...
- Publication number 20200243442
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACKING USING VERTICAL INTERCONNECTION BY THROUG...
- Publication number 20200227397
- Publication date Jul 16, 2020
- SANDISK TECHNOLOGIES LLC
- Shinsuke YADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20200194413
- Publication date Jun 18, 2020
- ADVANCED MICRO DEVICES, INC.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...
- Publication number 20200168584
- Publication date May 28, 2020
- Sony Semiconductor Solutions Corporation
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-...
- Publication number 20200161244
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20200152599
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20200098638
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS

for supporting the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated chip for standard logic performance improvement having a...

Via for semiconductor device connection and methods of forming the...

Anisotropic carrier for high aspect ratio fanout

Offset-aligned three-dimensional integrated circuit

Wafer scale bonded active photonics interposer

3DIC formation with dies bonded to formed RDLs

DBI to SI bonding for simplified handle wafer

Passive devices in package-on-package structures and methods for fo...

Method for manufacturing a semiconductor device including patternin...

Method of manufacturing display apparatus

Method of manufacturing display apparatus

Via for semiconductor device connection and methods of forming the...

Packaged dies with metal outer layers extending from die back sides...

Offset-aligned three-dimensional integrated circuit

Wafer scale bonded active photonics interposer

Semiconductor device with exposed input/output pad in recess

Three-dimensional memory device having an epitaxial vertical semico...

Anisotropic carrier for high aspect ratio fanout

Pad-out structure for semiconductor device and method of forming th...

Method of manufacturing a semiconductor device and a cleaning compo...

Batch manufacture of component carriers

Resin composition

IR assisted fan-out wafer level packaging using silicon handler

Integrated fan-out package and method of fabricating the same

Semiconductor device

Structure for standard logic performance improvement having a back-...

Method of manufacturing semiconductor structure

Method of manufacturing an electronic device comprising a conductiv...

Passive devices in package-on-package structures and methods for fo...

3DIC formation with dies bonded to formed RDLs

Patents Applicationslast 30 patents

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Bonding Structure with Stress Buffer Zone and Method of Forming Same

Patterning Polymer Layer to Reduce Stress

PACKAGE STRUCTURE AND PACKAGING METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

DISPLAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE

OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Anisotropic Carrier for High Aspect Ratio Fanout

PAD-OUT STRUCTURE FOR XTACKING ARCHITECTURE

FABRICATING METHOD OF SEMICONDUCTOR DEVICE

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

Pattern Polymer Layer to Reduce Stress

Passive Devices in Package-on-Package Structures and Methods for Fo...

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Anisotropic Carrier for High Aspect Ratio Fanout

THREE-DIMENSIONAL MEMORY DEVICE HAVING AN EPITAXIAL VERTICAL SEMICO...

PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...

Batch Manufacture of Component Carriers

Via for Semiconductor Device Connection and Methods of Forming the...

SEMICONDUCTOR DIE STACKING USING VERTICAL INTERCONNECTION BY THROUG...

OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...

STRUCTURE FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER