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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2223/54453
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last 30 patents
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Patent Grant
Semiconductor structure and method for manufacturing same
Patent number
11,984,406
Issue date
May 14, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Yunsheng Xia
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
3D semiconductor devices and structures with metal layers
Patent number
11,984,445
Issue date
May 14, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Method for fabricating semiconductor structure having alignment mar...
Patent number
11,901,305
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co. Ltd.
Kuo-Hung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,887,935
Issue date
Jan 30, 2024
Renesas Electronics Corporation
Takehiro Ueda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Secure inspection and marking of semiconductor wafers for trusted m...
Patent number
11,804,411
Issue date
Oct 31, 2023
International Business Machines Corporation
Effendi Leobandung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
11,749,756
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Che-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Recognition method for photolithography process and semiconductor d...
Patent number
11,682,557
Issue date
Jun 20, 2023
Winbond Electronics Corp.
Chih-Yu Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
Patent number
11,676,889
Issue date
Jun 13, 2023
Intel Corporation
Arnab Sarkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Secure inspection and marking of semiconductor wafers for trusted m...
Patent number
11,652,009
Issue date
May 16, 2023
International Business Machines Corporation
Effendi Leobandung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor devices and structures with metal layers
Patent number
11,646,309
Issue date
May 9, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip singulation method
Patent number
11,646,230
Issue date
May 9, 2023
NUVOTON TECHNOLOGY CORPORATION JAPAN
Takeshi Harada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
Patent number
11,626,372
Issue date
Apr 11, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D integrated circuit device and structure with hybrid bonding
Patent number
11,605,630
Issue date
Mar 14, 2023
Monolithic 3D Inc.
Zvi Or-Bach
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Semiconductor arrangement with fin features having different heights
Patent number
11,469,144
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company Limited
Tsung-Yu Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gate electrodes with notches and methods for forming the same
Patent number
11,456,176
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Min-Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to form a 3D integrated circuit
Patent number
11,374,118
Issue date
Jun 28, 2022
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and fabricating method thereof
Patent number
11,362,039
Issue date
Jun 14, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-Hung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser processing apparatus and laser processing method
Patent number
11,348,793
Issue date
May 31, 2022
Disco Corporation
Yuta Yoshida
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method
Patent number
11,322,403
Issue date
May 3, 2022
Disco Corporation
Masaru Nakamura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Workpiece processing method
Patent number
11,289,348
Issue date
Mar 29, 2022
Disco Corporation
Byeongdeck Jang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
Patent number
11,257,743
Issue date
Feb 22, 2022
Intel Corporation
Arnab Sarkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,222,851
Issue date
Jan 11, 2022
Fuji Electric Co., Ltd.
Naoko Kodama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
Patent number
11,217,556
Issue date
Jan 4, 2022
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for alignment of vertically stacked wafers and die
Patent number
11,205,621
Issue date
Dec 21, 2021
STMicroelectronics, Inc.
John H. Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser processing apparatus
Patent number
11,177,148
Issue date
Nov 16, 2021
Disco Corporation
Tsutomu Maeda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3D semiconductor device and structure
Patent number
11,121,021
Issue date
Sep 14, 2021
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
3D device and devices with bonding
Patent number
11,101,266
Issue date
Aug 24, 2021
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Test line letter for embedded non-volatile memory technology
Patent number
11,069,419
Issue date
Jul 20, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Jui-Tsung Lien
G11 - INFORMATION STORAGE
Information
Patent Grant
Plasma etch singulated semiconductor packages and related methods
Patent number
11,037,903
Issue date
Jun 15, 2021
Semiconductor Components Industries, LLC
Darrell Truhitte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame system
Patent number
11,024,562
Issue date
Jun 1, 2021
Texas Instruments Incorporated
Xingliang Deng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20240120291
Publication date
Apr 11, 2024
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20240120332
Publication date
Apr 11, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER STRUCTURE
Publication number
20240049382
Publication date
Feb 8, 2024
Siliconware Precision Industries Co., Ltd.
Chin-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230378361
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Che-Yu LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
Publication number
20230260884
Publication date
Aug 17, 2023
Intel Corporation
Arnab SARKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
Publication number
20230223361
Publication date
Jul 13, 2023
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20230139773
Publication date
May 4, 2023
Semiconductor Manufacturing International (Beijing) Corporation
Xinxing BAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Gate Electrodes with Notches and Methods for Forming the Same
Publication number
20220359205
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Min-Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20220328474
Publication date
Oct 13, 2022
Monolithic 3D Inc.
Zvi Or-Bach
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
TEMPLATE, MANUFACTURING METHOD OF TEMPLATE, AND MANUFACTURING METHO...
Publication number
20220301908
Publication date
Sep 22, 2022
KIOXIA Corporation
Kazuhiro TAKAHATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SECURE INSPECTION AND MARKING OF SEMICONDUCTOR WAFERS FOR TRUSTED M...
Publication number
20220238395
Publication date
Jul 28, 2022
International Business Machines Corporation
Effendi LEOBANDUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
Publication number
20220189838
Publication date
Jun 16, 2022
Murata Manufacturing Co., Ltd.
Ryohei OKABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
Publication number
20220130743
Publication date
Apr 28, 2022
Intel Corporation
Arnab SARKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
Publication number
20220122938
Publication date
Apr 21, 2022
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD FOR ANNEALING DIE AND WAFER
Publication number
20210257230
Publication date
Aug 19, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin-Hao YEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
Publication number
20210257208
Publication date
Aug 19, 2021
Semiconductor Components Industries, LLC
Michael J. SEDDON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SECURE INSPECTION AND MARKING OF SEMICONDUCTOR WAFERS FOR TRUSTED M...
Publication number
20210134682
Publication date
May 6, 2021
International Business Machines Corporation
Effendi LEOBANDUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D DEVICE AND DEVICES WITH BONDING
Publication number
20210125981
Publication date
Apr 29, 2021
MonolithIC 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
Publication number
20210125942
Publication date
Apr 29, 2021
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D INTEGRATED CIRCUIT DEVICE AND STRUCTURE WITH BONDING
Publication number
20210104517
Publication date
Apr 8, 2021
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DEPTH ETCHING IN SEMICONDUCTOR ARRANGEMENT
Publication number
20210066132
Publication date
Mar 4, 2021
Tsung-Yu CHIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20210050451
Publication date
Feb 18, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Che-Yu LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
Publication number
20210028120
Publication date
Jan 28, 2021
Taiwan Semiconductor Manufacturing Co. Ltd.
Kuo-Hung LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D INTEGRATED CIRCUIT
Publication number
20200365583
Publication date
Nov 19, 2020
MonolithIC 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
Publication number
20200365463
Publication date
Nov 19, 2020
MonolithIC 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD TO FORM A 3D INTEGRATED CIRCUIT
Publication number
20200350310
Publication date
Nov 5, 2020
MonolithIC 3D Inc.
Zvi Or-Bach
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
Publication number
20200335399
Publication date
Oct 22, 2020
MonolithIC 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20200294931
Publication date
Sep 17, 2020
Fuji Electric Co., Ltd.
Naoko KODAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD TO IMPROVE NIKON WAFER LOADER REPEATABILITY
Publication number
20200294835
Publication date
Sep 17, 2020
TEXAS INSTRUMENTS INCORPORATED
Gao Yong WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR ALIGNMENT OF VERTICALLY STACKED WAFERS AND DIE
Publication number
20200203286
Publication date
Jun 25, 2020
STMicroelectronics, Inc.
John H. Zhang
H01 - BASIC ELECTRIC ELEMENTS