Fusion bonding

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CPC
B81C2203/036

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/036Fusion bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
- Patent number 12,208,416
- Issue date Jan 28, 2025
- Zhejiang Xiansheng Technology Co., Ltd.
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor with high stability
- Patent number 12,139,398
- Issue date Nov 12, 2024
- Invensense, Inc.
- Weng Shen Su
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon MEMS gyroscopes with upper and lower sense plates
- Patent number 12,092,460
- Issue date Sep 17, 2024
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microchannel chip and method for manufacturing same
- Patent number 12,091,308
- Issue date Sep 17, 2024
- Zeon Corporation
- Hiroya Nishioka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device
- Patent number 11,944,965
- Issue date Apr 2, 2024
- Imec VZW
- Giuseppe Fiorentino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive microphone sensor design and fabrication method for achi...
- Patent number 11,902,741
- Issue date Feb 13, 2024
- Kathirgamasundaram Sooriakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method for making the same
- Patent number 11,851,318
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device comprising different types of microelectromech...
- Patent number 11,851,323
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Fu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducers and related apparatus and me...
- Patent number 11,828,729
- Issue date Nov 28, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 11,806,747
- Issue date Nov 7, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon substrate having cavity and cavity SOI substrate including...
- Patent number 11,738,993
- Issue date Aug 29, 2023
- Murata Manufacturing Co., Ltd.
- Yutaka Kishimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with polysilicon and etch stop layer
- Patent number 11,731,871
- Issue date Aug 22, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for integrated microphone
- Patent number 11,678,133
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Extended acid etch for oxide removal
- Patent number 11,655,146
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Ta Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 11,618,674
- Issue date Apr 4, 2023
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductive structure and manufacturing method thereof
- Patent number 11,591,211
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducer having individual cells with...
- Patent number 11,559,827
- Issue date Jan 24, 2023
- BFLY OPERATIONS, INC.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS apparatus with anti-stiction layer
- Patent number 11,542,151
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for fabricating silicon MEMS gyroscopes with upper and lowe...
- Patent number 11,530,917
- Issue date Dec 20, 2022
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Layered silicon and stacking of microfluidic chips
- Patent number 11,529,627
- Issue date Dec 20, 2022
- International Business Machines Corporation
- Joshua T. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive microphone sensor design and fabrication method for achi...
- Patent number 11,523,224
- Issue date Dec 6, 2022
- Kathirgamasundaram Sooriakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus having a bondline structure and a diffusion barrier with...
- Patent number 11,505,451
- Issue date Nov 22, 2022
- Texas Instruments Incorporated
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having microelectromechanical systems devices...
- Patent number 11,491,510
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 11,484,911
- Issue date Nov 1, 2022
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,263,424
- Issue date Mar 1, 2022
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced MEMS cavity gap
- Patent number 11,220,423
- Issue date Jan 11, 2022
- Invensense, Inc.
- Ian Flader
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
- Publication number 20250030998
- Publication date Jan 23, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...
- Publication number 20240137711
- Publication date Apr 25, 2024
- Innogrity Pte Ltd
- KATHIRGAMASUNDARAM SOORIAKUMAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20240024917
- Publication date Jan 25, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING DIFFERENT TYPES OF MICROELECTROMECH...
- Publication number 20230406695
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Fu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386948
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- You-Ru Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...
- Publication number 20230302495
- Publication date Sep 28, 2023
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EXTENDED ACID ETCH FOR OXIDE REMOVAL
- Publication number 20230264949
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta KUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROCHANNEL CHIP AND METHOD FOR MANUFACTURING SAME
- Publication number 20230212000
- Publication date Jul 6, 2023
- ZEON CORPORATION
- Hiroya NISHIOKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20230202835
- Publication date Jun 29, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20230128755
- Publication date Apr 27, 2023
- SCHOTT AG
- Antti Määttänen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT SCANNER PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230127991
- Publication date Apr 27, 2023
- WEMEMS CO.,LTD.
- Jonghyun LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR WITH HIGH STABILITY
- Publication number 20230089813
- Publication date Mar 23, 2023
- InvenSense, Inc.
- Weng Shen Su
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FABRICATING SILICON MEMS GYROSCOPES WITH UPPER AND LOWE...
- Publication number 20230076161
- Publication date Mar 9, 2023
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20230064645
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...
- Publication number 20230054811
- Publication date Feb 23, 2023
- Innogrity Pte Ltd
- KATHIRGAMASUNDARAM SOORIAKUMAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20230037849
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230036136
- Publication date Feb 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20230017034
- Publication date Jan 19, 2023
- BFLY Operations, Inc
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-MACHINED ULTRASOUND TRANSDUCERS WITH INSULATION LAYER AND MET...
- Publication number 20230002213
- Publication date Jan 5, 2023
- eXo Imaging, Inc.
- Naresh MANTRAVADI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER
- Publication number 20220380209
- Publication date Dec 1, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...
- Publication number 20220362804
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ROTOR WITH COATED BOTTOM SURFACE
- Publication number 20220340411
- Publication date Oct 27, 2022
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20220340407
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BACKSIDE COATING OF SUSPENDED MEMS MIRROR ACTUATORS FOR STRESS MATC...
- Publication number 20220204338
- Publication date Jun 30, 2022
- Sae Won Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...
- Publication number 20220172506
- Publication date Jun 2, 2022
- InvenSense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Fusion bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...

Method and system for fabricating a MEMS device

Pressure sensor with high stability

Silicon MEMS gyroscopes with upper and lower sense plates

Microchannel chip and method for manufacturing same

Microfluidic device

Capacitive microphone sensor design and fabrication method for achi...

MEMS device and method for making the same

Semiconductor device comprising different types of microelectromech...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Microfabricated ultrasonic transducers and related apparatus and me...

Bottom electrode via structures for micromachined ultrasonic transd...

Silicon substrate having cavity and cavity SOI substrate including...

Actuator layer patterning with polysilicon and etch stop layer

Packaging method and associated packaging structure

Microelectromechanical structure with bonded cover

Structure for integrated microphone

Extended acid etch for oxide removal

Actuator layer patterning with topography

Semiconductive structure and manufacturing method thereof

Microfabricated ultrasonic transducer having individual cells with...

MEMS apparatus with anti-stiction layer

Methods for fabricating silicon MEMS gyroscopes with upper and lowe...

Layered silicon and stacking of microfluidic chips

Capacitive microphone sensor design and fabrication method for achi...

Apparatus having a bondline structure and a diffusion barrier with...

Semiconductor device having microelectromechanical systems devices...

Bottom electrode via structures for micromachined ultrasonic transd...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Reduced MEMS cavity gap

Patents Applicationslast 30 patents

FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

MICROMECHANICAL STRUCTURE WITH BONDED COVER

SEMICONDUCTOR DEVICE COMPRISING DIFFERENT TYPES OF MICROELECTROMECH...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...

EXTENDED ACID ETCH FOR OXIDE REMOVAL

MICROCHANNEL CHIP AND METHOD FOR MANUFACTURING SAME

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME

LIGHT SCANNER PACKAGE AND METHOD FOR MANUFACTURING SAME

PRESSURE SENSOR WITH HIGH STABILITY

METHODS FOR FABRICATING SILICON MEMS GYROSCOPES WITH UPPER AND LOWE...

PROTECTIVE BONDLINE CONTROL STRUCTURE

CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

MICRO-MACHINED ULTRASOUND TRANSDUCERS WITH INSULATION LAYER AND MET...

ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER

SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...

MEMS ROTOR WITH COATED BOTTOM SURFACE

MEMS DEVICE AND METHOD FOR MAKING THE SAME

BACKSIDE COATING OF SUSPENDED MEMS MIRROR ACTUATORS FOR STRESS MATC...

INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...