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SEMICONDUCTOR PACKAGE
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Publication number 20240136329
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Hyuekjae Lee
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H01 - BASIC ELECTRIC ELEMENTS
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VERTICALLY MOUNTED DIE GROUPS
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Publication number 20240014172
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Publication date Jan 11, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Jen-Yuan Chang
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H01 - BASIC ELECTRIC ELEMENTS
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PROTECTION OF INTEGRATED CIRCUITS
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Publication number 20230245984
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Publication date Aug 3, 2023
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STMicroelectronics (Grenoble 2) SAS
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Denis FARISON
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H01 - BASIC ELECTRIC ELEMENTS
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PLANAR MULTI-CHIP DEVICE
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Publication number 20230215786
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Publication date Jul 6, 2023
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HARVATEK CORPORATION
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CHIN-JUI LIANG
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H01 - BASIC ELECTRIC ELEMENTS
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VERTICAL TYPE MULTI-CHIP DEVICE
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Publication number 20230215785
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Publication date Jul 6, 2023
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HARVATEK CORPORATION
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CHIN-JUI LIANG
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H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
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Publication number 20220384389
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Publication date Dec 1, 2022
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Intel Corporation
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Shawna M. Liff
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20220359430
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Publication date Nov 10, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Tsung-Fu TSAI
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H01 - BASIC ELECTRIC ELEMENTS
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VERTICALLY MOUNTED DIE GROUPS
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Publication number 20220359461
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Publication date Nov 10, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Jen-Yuan Chang
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H01 - BASIC ELECTRIC ELEMENTS
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