Geometry of the stack

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CPC
H01L2225/06555

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06555Geometry of the stack

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip and semiconductor package
- Patent number 12,355,004
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
- Patent number 12,327,819
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,315,840
- Issue date May 27, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a substrate-to-substrate interconnection s...
- Patent number 12,315,845
- Issue date May 27, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 12,266,634
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,249,593
- Issue date Mar 11, 2025
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vertically mounted die groups
- Patent number 12,237,303
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,308
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 12,183,718
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation and bonding methods and structures formed thereby
- Patent number 12,159,860
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
- Patent number 12,119,296
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 12,040,313
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 12,015,007
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body and method of manufacturing the same
- Patent number 12,002,779
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,990,454
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,984,425
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Ji-seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,948,896
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,935,872
- Issue date Mar 19, 2024
- Kioxia Corporation
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 11,929,348
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,336
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,894,346
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a substrate-to-substrate interconnection s...
- Patent number 11,869,875
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for releveled bump planes for chiplets
- Patent number 11,862,604
- Issue date Jan 2, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210576
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PHOTORESIST APPLICATION METHOD AND SEMICONDUCTOR PACKAGE...
- Publication number 20250180994
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Juhyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS STACKED IN A V...
- Publication number 20250174601
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Dongki CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY
- Publication number 20250151293
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jeehyun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140714
- Publication date May 1, 2025
- SK HYNIX INC.
- Yun Cheol HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAYOUTS UTILIZING NON-RECTANGULAR PERIPHERAL CHIPS
- Publication number 20250140742
- Publication date May 1, 2025
- NVIDIA Corp.
- Benjamin Giles Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140752
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079393
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062286
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...
- Publication number 20250046710
- Publication date Feb 6, 2025
- Micron Technology Inc.
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional Stack Package Structure And Method Making The Same
- Publication number 20250006702
- Publication date Jan 2, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...
- Publication number 20240404993
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY
- Publication number 20240395775
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371743
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332255
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290754
- Publication date Aug 29, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Yu-Duk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274501
- Publication date Aug 15, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240266336
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243102
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234373
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS

Geometry of the stack

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip and semiconductor package

Devices employing thermal and mechanical enhanced layers and method...

Semiconductor structure and manufacturing method thereof

Package structure and manufacturing method thereof

Microelectronic assemblies

Electronic device having a substrate-to-substrate interconnection s...

Vertically mounted die groups

Electronic device

Vertically mounted die groups

Semiconductor package

Semiconductor device and method of forming micro interconnect struc...

Stacked semiconductor device assembly in computer system

Semiconductor die connection system and method

Semiconductor package having a high reliability

Singulation and bonding methods and structures formed thereby

Semiconductor device assemblies with molded support substrates

Encircling a semiconductor device with stacked frames on a substrate

Through-substrate via structure and method of manufacture

Semiconductor package and a method for manufacturing the same

Adhesive member and display device including the same

Multilayer body and method of manufacturing the same

Package structure and method of forming the same

Semiconductor package

Package structure

Semiconductor device and method of manufacturing semiconductor device

Vertically mounted die groups

Semiconductor package

Semiconductor package having a high reliability

Electronic device having a substrate-to-substrate interconnection s...

Systems and methods for releveled bump planes for chiplets

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SELECTIVE PHOTORESIST APPLICATION METHOD AND SEMICONDUCTOR PACKAGE...

Semiconductor Die Connection System and Method

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS STACKED IN A V...

Stacked Semiconductor Device Assembly in Computer System

Wafer Level Integration of Passive Devices

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

HIGH BANDWIDTH MEMORY

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE LAYOUTS UTILIZING NON-RECTANGULAR PERIPHERAL CHIPS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...

Three-dimensional Stack Package Structure And Method Making The Same

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...

SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME