Gold [Au] as principal constituent

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H01L2224/05144

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05144Gold [Au] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 12,315,769
- Issue date May 27, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,272,296
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display panel, method of manufacturing display panel, and display d...
- Patent number 12,266,621
- Issue date Apr 1, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,218,123
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 12,211,811
- Issue date Jan 28, 2025
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same
- Patent number 12,040,294
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder ball application for singular die
- Patent number 11,978,711
- Issue date May 7, 2024
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system, memory chip unit, and wafer
- Patent number 11,923,325
- Issue date Mar 5, 2024
- Kioxia Corporation
- Yasuhito Yoshimizu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250183205
- Publication date Jun 5, 2025
- WIN SEMICONDUCTORS CORP.
- Shao-Yu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
- Publication number 20250118690
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
- Publication number 20250110301
- Publication date Apr 3, 2025
- Intel Corporation
- Saeed Fathololoumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20250079376
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250046659
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Se Ra Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022822
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
- Publication number 20240395750
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Shen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240395743
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20240387423
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Vasantha Kumar Vaddagere Nagaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321679
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS
- Publication number 20240290736
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Shinzo ISHIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243086
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240222303
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
- Publication number 20240153896
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION
- Publication number 20240113054
- Publication date Apr 4, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Clément Lobre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088075
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD F...
- Publication number 20240088076
- Publication date Mar 14, 2024
- OLYMPUS CORPORATION
- Keiichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Gold [Au] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Build-up package for integrated circuit devices, and methods of mak...

Method of forming a bonded semiconductor structure

Semiconductor packages and methods of forming same

Semiconductor device and manufacturing method thereof

Conductive bump of a semiconductor device and fabricating method th...

Display device

Display panel, method of manufacturing display panel, and display d...

Semiconductor device and method of forming micro interconnect struc...

Chip parts

Electronic device and method of manufacturing electronic device

Semiconductor package with intermetallic-compound solder-joint comp...

Manufacturing method of an electronic apparatus

Process flow for fabrication of cap metal over top metal with sinte...

Semiconductor device assembly with die support structures

Through-substrate via structure and method of manufacture

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor chip with redundant thru-silicon-vias

Semiconductor device and method to minimize stress on stack via

Methods and devices for fabricating and assembling printable semico...

Chip package

Semiconductor devices and semiconductor packages including the same

Semiconductor device having a dual material redistribution line

Semiconductor product with interlocking metal-to-metal bonds and me...

Multiple plated via arrays of different wire heights on a same subs...

Packaged die and RDL with bonding structures therebetween

Fingerprint sensor and manufacturing method thereof

Solder ball application for singular die

Storage system, memory chip unit, and wafer

Silicon photonic interposer with two metal redistribution layers

Bump structure and method of manufacturing bump structure

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

CHIP PACKAGE

DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...

TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES

CHIP PACKAGE

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR PACKAGE SYSTEM AND METHOD

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD F...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...