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H01L2224/05144
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05144
Gold [Au] as principal constituent
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last 30 patents
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Patent Grant
Chip parts
Patent number
12,218,123
Issue date
Feb 4, 2025
Rohm Co., Ltd.
Keisuke Fukae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of manufacturing electronic device
Patent number
12,211,811
Issue date
Jan 28, 2025
Industrial Technology Research Institute
Yu-Ming Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
Patent number
12,206,056
Issue date
Jan 21, 2025
Electronics and Telecommunications Research Institute
Kwang-Seong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of an electronic apparatus
Patent number
12,191,277
Issue date
Jan 7, 2025
INNOLUX CORPORATION
Ming-Chang Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
Patent number
12,159,846
Issue date
Dec 3, 2024
Texas Instruments Incorporated
Richard Allen Faust
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with die support structures
Patent number
12,148,727
Issue date
Nov 19, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate via structure and method of manufacture
Patent number
12,119,294
Issue date
Oct 15, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
Patent number
12,094,729
Issue date
Sep 17, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with redundant thru-silicon-vias
Patent number
12,094,853
Issue date
Sep 17, 2024
Advanced Micro Devices, Inc.
Bryan Black
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method to minimize stress on stack via
Patent number
12,080,600
Issue date
Sep 3, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods and devices for fabricating and assembling printable semico...
Patent number
12,074,213
Issue date
Aug 27, 2024
The Board of Trustees of the University of Illinois
Ralph G. Nuzzo
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Chip package
Patent number
12,062,618
Issue date
Aug 13, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and semiconductor packages including the same
Patent number
12,040,294
Issue date
Jul 16, 2024
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having a dual material redistribution line
Patent number
12,027,447
Issue date
Jul 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Anhao Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
Patent number
12,015,000
Issue date
Jun 18, 2024
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
Patent number
RE49987
Issue date
May 28, 2024
Invensas LLC
Cyprian Emeka Uzoh
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Patent Grant
Packaged die and RDL with bonding structures therebetween
Patent number
11,996,401
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fingerprint sensor and manufacturing method thereof
Patent number
11,990,435
Issue date
May 21, 2024
Amkor Technology Singapore Holding Pte Ltd.
Sung Sun Park
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Solder ball application for singular die
Patent number
11,978,711
Issue date
May 7, 2024
Global Circuit Innovations Incorporated
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Storage system, memory chip unit, and wafer
Patent number
11,923,325
Issue date
Mar 5, 2024
Kioxia Corporation
Yasuhito Yoshimizu
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Silicon photonic interposer with two metal redistribution layers
Patent number
11,923,327
Issue date
Mar 5, 2024
Rockley Photonics Limited
Michael Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bump structure and method of manufacturing bump structure
Patent number
11,923,326
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Chang
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Semiconductor package system and method
Patent number
11,901,319
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,901,320
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive traces in semiconductor devices and methods of forming same
Patent number
11,894,299
Issue date
Feb 6, 2024
TAIWAN SEMICONDUCTOR LTD
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
11,894,306
Issue date
Feb 6, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
11,848,293
Issue date
Dec 19, 2023
Samsung Electronics Co., Ltd.
Sunkyoung Seo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20250046659
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Se Ra Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
Publication number
20250022822
Publication date
Jan 16, 2025
ROHM CO., LTD.
Hirofumi TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
Publication number
20250006674
Publication date
Jan 2, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
Publication number
20240395750
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jui Shen CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240395743
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
Publication number
20240387423
Publication date
Nov 21, 2024
NEXPERIA B.V.
Vasantha Kumar Vaddagere Nagaraju
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20240379566
Publication date
Nov 14, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
Publication number
20240321679
Publication date
Sep 26, 2024
Samsung Electronics Co., Ltd.
Youngjoon KOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
Publication number
20240304577
Publication date
Sep 12, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sung Sun Park
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
Publication number
20240297106
Publication date
Sep 5, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS
Publication number
20240290736
Publication date
Aug 29, 2024
Semiconductor Components Industries, LLC
Shinzo ISHIBE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
Publication number
20240258252
Publication date
Aug 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Yu CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240243086
Publication date
Jul 18, 2024
Advanced Semiconductor Engineering, Inc.
Sheng-Hsiang HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240234228
Publication date
Jul 11, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240234354
Publication date
Jul 11, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240222303
Publication date
Jul 4, 2024
Samsung Electronics Co., Ltd.
Daehyun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-METAL CONTACT STRUCTURE
Publication number
20240203917
Publication date
Jun 20, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
Publication number
20240153896
Publication date
May 9, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION
Publication number
20240113054
Publication date
Apr 4, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Clément Lobre
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240088075
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Sunkyoung SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD F...
Publication number
20240088076
Publication date
Mar 14, 2024
OLYMPUS CORPORATION
Keiichi KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20240071973
Publication date
Feb 29, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FABRICATING DISPLAY PANEL
Publication number
20240072027
Publication date
Feb 29, 2024
SAMSUNG DISPLAY CO., LTD.
Jeong Won HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE AND METHOD OF MAKING THE SAME
Publication number
20240047397
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-Yu CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY D...
Publication number
20240038697
Publication date
Feb 1, 2024
TCL China Star Optoelectronics Technology Co., Ltd.
Jinming Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240030169
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Woon Chun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION
Publication number
20240006353
Publication date
Jan 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Anton Johann BAYERSTADLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...
Publication number
20230352450
Publication date
Nov 2, 2023
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHO...
Publication number
20230352449
Publication date
Nov 2, 2023
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS