Grouped leads

Industry

CPC
H05K2201/10893

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10893Grouped leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for manufacturing a Z-directed printed circuit board compon...
- Patent number 9,814,145
- Issue date Nov 7, 2017
- Lexmark International, Inc.
- Keith Bryan Hardin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with high density optical chips and manufactur...
- Patent number 8,507,927
- Issue date Aug 13, 2013
- Kabushiki Kaisha Toshiba
- Atsuko Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z-directed connector components for printed circuit boards
- Patent number 8,273,996
- Issue date Sep 25, 2012
- Lexmark International, Inc.
- Keith Bryan Hardin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grouped element transmission channel link with pedestal aspects
- Patent number 7,753,744
- Issue date Jul 13, 2010
- Molex Incorporated
- Victor Zaderej
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Column grid array using compliant core
- Patent number 7,700,884
- Issue date Apr 20, 2010
- Honeywell International Inc.
- Anthony Casasnovas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grouped element transmission channel link with pedestal aspects
- Patent number 7,699,672
- Issue date Apr 20, 2010
- Molex Incorporated
- Victor Zaderej
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component for impedance matching
- Patent number 7,652,896
- Issue date Jan 26, 2010
- Hewlett-Packard Development Company, L.P.
- Sachin Navin Chheda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible appliance and related method for orthogonal, non-planar in...
- Patent number 7,479,604
- Issue date Jan 20, 2009
- Harris Corporation
- Brian Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grouped element transmission channel link with pedestal aspects
- Patent number 7,273,401
- Issue date Sep 25, 2007
- Molex Incorporated
- Victor Zaderej
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grouped element transmission channel link termination assemblies
- Patent number 7,160,154
- Issue date Jan 9, 2007
- Molex Incorporated
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Differential transmission channel link for delivering high frequenc...
- Patent number 7,061,342
- Issue date Jun 13, 2006
- Molex Incorporated
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grouped element transmission channel link termination assemblies
- Patent number 6,976,881
- Issue date Dec 20, 2005
- Molex Incorporated
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-path via interconnection structures and methods for manufactu...
- Patent number 6,891,272
- Issue date May 10, 2005
- Silicon Pipe, Inc.
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grouped element transmission channel link termination assemblies
- Patent number 6,840,810
- Issue date Jan 11, 2005
- Molex Incorporated
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor interconnect structure connecting circuit boards
- Patent number 6,641,407
- Issue date Nov 4, 2003
- Nissan Motor Co., Ltd.
- Yoshinori Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for high speed differential signaling, employi...
- Patent number 6,514,090
- Issue date Feb 4, 2003
- International Business Machines Corporation
- Dan M. Neal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Telecommunication main distribution frame structure
- Patent number 6,388,895
- Issue date May 14, 2002
- Ching Feng Blinds Ind. Co., Ltd.
- Pey-Son Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-connection via with electrically isolated segments
- Patent number 6,388,208
- Issue date May 14, 2002
- Teradyne, Inc.
- Sepehr Kiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split via surface mount connector and related techniques
- Patent number 6,137,064
- Issue date Oct 24, 2000
- Teradyne, Inc.
- Sepehr Kiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnection board and connection pin
- Patent number 5,975,913
- Issue date Nov 2, 1999
- Oki Electric Industry Co., Ltd.
- Shigehito Wada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-board electronic assembly including spacer for multiple elect...
- Patent number 5,825,633
- Issue date Oct 20, 1998
- Motorola, Inc.
- C. Gregory Bujalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an apparatus having inner layers supporting...
- Patent number 5,659,953
- Issue date Aug 26, 1997
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless high density connector
- Patent number 5,593,322
- Issue date Jan 14, 1997
- Dell USA, L.P.
- Deepak Swamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having inner layers supporting surface-mount components
- Patent number 5,543,586
- Issue date Aug 6, 1996
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board pins
- Patent number 5,133,669
- Issue date Jul 28, 1992
- Northern Telecom Limited
- Robert L. Barnhouse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect system
- Patent number 4,838,800
- Issue date Jun 13, 1989
- GTE Products Corporation
- Thomas M. Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package with multiconductive base forms for mu...
- Patent number 4,654,472
- Issue date Mar 31, 1987
- Samuel Goldfarb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3375323
- Patent number 3,375,323
- Issue date Mar 26, 1968
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3148356
- Patent number 3,148,356
- Issue date Sep 8, 1964
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20230380053
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING SOLUTION FOR COMPONENTS ON A VERY FINE PITCH ARRAY
- Publication number 20150092373
- Publication date Apr 2, 2015
- ALCATEL-LUCENT CANADA INC.
- Alex CHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENTS HAVING A REMOVABLE END...
- Publication number 20130341078
- Publication date Dec 26, 2013
- KEITH BRYAN HARDIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING FOR AN ELECTRICAL CIRCUIT
- Publication number 20110233907
- Publication date Sep 29, 2011
- Michael Struchholz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Z-Directed Components for Printed Circuit Boards
- Publication number 20110017502
- Publication date Jan 27, 2011
- Keith Bryan Hardin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Z-Directed Connector Components for Printed Circuit Boards
- Publication number 20110017505
- Publication date Jan 27, 2011
- Keith Bryan Hardin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100244059
- Publication date Sep 30, 2010
- Kabushiki Kaisha Toshiba
- Atsuko Iida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
GROUPED ELEMENT TRANSMISSION CHANNEL LINK WITH PEDESTAL ASPECTS
- Publication number 20090227153
- Publication date Sep 10, 2009
- Molex Incorporated
- Victor ZADEREJ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grouped element transmission channel link with pedestal aspects
- Publication number 20080102692
- Publication date May 1, 2008
- Victor Zaderej
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Column grid array using compliant core
- Publication number 20070125571
- Publication date Jun 7, 2007
- Honeywell International Inc.
- Anthony Casasnovas
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component for impedance matching
- Publication number 20060137907
- Publication date Jun 29, 2006
- Hewlett-Packard Development Company, L.P.
- Sachin Navin Chheda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and method of manufacture of an interconnection structure fo...
- Publication number 20050286238
- Publication date Dec 29, 2005
- Stephen C. Joy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grouped element transmission channel link termination assemblies
- Publication number 20050250387
- Publication date Nov 10, 2005
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grouped element transmission channel link with pedestal aspects
- Publication number 20050176268
- Publication date Aug 11, 2005
- Victor Zaderej
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GROUPED ELEMENT TRANSMISSION CHANNEL LINK TERMINATION ASSEMBLIES
- Publication number 20050092513
- Publication date May 5, 2005
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING INTERCONNECTION POSTS FOR MULT...
- Publication number 20040173894
- Publication date Sep 9, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grouped element transmission channel link
- Publication number 20040113711
- Publication date Jun 17, 2004
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grouped element transmission channel link termination assemblies
- Publication number 20030181104
- Publication date Sep 25, 2003
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grouped element transmission channel link with power delivery aspects
- Publication number 20030179050
- Publication date Sep 25, 2003
- David L. Brunker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect structure
- Publication number 20020037656
- Publication date Mar 28, 2002
- Yoshinori Murakami
- H01 - BASIC ELECTRIC ELEMENTS

Grouped leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for manufacturing a Z-directed printed circuit board compon...

Semiconductor device with high density optical chips and manufactur...

Z-directed connector components for printed circuit boards

Grouped element transmission channel link with pedestal aspects

Column grid array using compliant core

Grouped element transmission channel link with pedestal aspects

Component for impedance matching

Flexible appliance and related method for orthogonal, non-planar in...

Grouped element transmission channel link with pedestal aspects

Grouped element transmission channel link termination assemblies

Differential transmission channel link for delivering high frequenc...

Grouped element transmission channel link termination assemblies

Multi-path via interconnection structures and methods for manufactu...

Grouped element transmission channel link termination assemblies

Conductor interconnect structure connecting circuit boards

Method and apparatus for high speed differential signaling, employi...

Telecommunication main distribution frame structure

Multi-connection via with electrically isolated segments

Split via surface mount connector and related techniques

Multilayer interconnection board and connection pin

Multi-board electronic assembly including spacer for multiple elect...

Method of manufacturing an apparatus having inner layers supporting...

Leadless high density connector

Apparatus having inner layers supporting surface-mount components

Circuit board pins

High density interconnect system

Electronic component package with multiconductive base forms for mu...

3375323

3148356

Patents Applicationslast 30 patents

FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF

MOUNTING SOLUTION FOR COMPONENTS ON A VERY FINE PITCH ARRAY

Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENTS HAVING A REMOVABLE END...

HOUSING FOR AN ELECTRICAL CIRCUIT

Z-Directed Components for Printed Circuit Boards

Z-Directed Connector Components for Printed Circuit Boards

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

GROUPED ELEMENT TRANSMISSION CHANNEL LINK WITH PEDESTAL ASPECTS

Grouped element transmission channel link with pedestal aspects

Column grid array using compliant core

Component for impedance matching

Device and method of manufacture of an interconnection structure fo...

Grouped element transmission channel link termination assemblies

Grouped element transmission channel link with pedestal aspects

GROUPED ELEMENT TRANSMISSION CHANNEL LINK TERMINATION ASSEMBLIES

INTEGRATED CIRCUIT PACKAGE INCLUDING INTERCONNECTION POSTS FOR MULT...

Grouped element transmission channel link

Grouped element transmission channel link termination assemblies

Grouped element transmission channel link with power delivery aspects

Interconnect structure