3375323

Information

• Patent Grant
• 3375323

• References
• Source

• Patent Number

  3,375,323

• Date Filed

  Not available

• Date Issued

  Tuesday, March 26, 1968
  57 years ago

• CPC

  • H01R12/523 - by an interconnection through aligned holes in the boards or multilayer board
  • H05K1/112 - directly combined with via connections
  • H05K3/328 - by welding
  • H05K1/0298 - Multilayer circuits
  • H05K2201/09472 - Recessed pad for surface mounting Recessed electrode of component
  • H05K2201/10303 - Pin-in-hole mounted pins
  • H05K2201/10318 - Surface mounted metallic pins
  • H05K2201/10893 - Grouped leads

• US Classifications

  • 174 - Electricity: conductors and insulators
  • 219 - Electric heating
  • 439 - Electrical connectors