HF devices

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CPC
H01L2924/142

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/142HF devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting failures caused by dendrite growth on semiconductor chips
- Patent number 12,315,836
- Issue date May 27, 2025
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,308,355
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,300,637
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having connection unit
- Patent number 12,300,596
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Myongsoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded structure with multi-height components comprising back...
- Patent number 12,300,561
- Issue date May 13, 2025
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package device and method of operating the same
- Patent number 12,293,987
- Issue date May 6, 2025
- Realtek Semiconductor Corporation
- Chih-Chiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal power delivery structure for direct chip attach architect...
- Patent number 12,288,750
- Issue date Apr 29, 2025
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 12,288,744
- Issue date Apr 29, 2025
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,262,605
- Issue date Mar 25, 2025
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-based gallium nitride integrated circuits
- Patent number 12,261,134
- Issue date Mar 25, 2025
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 12,255,382
- Issue date Mar 18, 2025
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical receiving circuit
- Patent number 12,243,862
- Issue date Mar 4, 2025
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display with embedded pixel driver chips
- Patent number 12,243,863
- Issue date Mar 4, 2025
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
- Patent number 12,237,248
- Issue date Feb 25, 2025
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drive chip and display panel
- Patent number 12,211,810
- Issue date Jan 28, 2025
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,205,851
- Issue date Jan 21, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spatial power-combining devices with reduced size
- Patent number 12,143,074
- Issue date Nov 12, 2024
- Qorvo US, Inc.
- Soack Dae Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED INTEGRATED VOLTAGE REGULATOR
- Publication number 20250174597
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20250167048
- Publication date May 22, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...
- Publication number 20250159987
- Publication date May 15, 2025
- Hangzhou Geo-chip Technology Co., Ltd.
- Ruili WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20250158269
- Publication date May 15, 2025
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20250151392
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250149457
- Publication date May 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yu HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP ARRANGEMENT OF INTEGRATED CIRCUITS FOR FLIP CHIP BONDING
- Publication number 20250140725
- Publication date May 1, 2025
- SYNAPTICS INCORPORATED
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140765
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125693
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Shigemi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE VOLTAGE REGULATOR IN INTEGRATED CIRCUIT PACKAGE
- Publication number 20250113503
- Publication date Apr 3, 2025
- Intel Corporation
- Nicolas Butzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASS...
- Publication number 20250112181
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250112215
- Publication date Apr 3, 2025
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Qijun YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
- Publication number 20250105157
- Publication date Mar 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
- Publication number 20250096094
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES
- Publication number 20250087604
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250079319
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeongseok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AN...
- Publication number 20250079358
- Publication date Mar 6, 2025
- Tesla, Inc.
- Abel Misrak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...
- Publication number 20250067942
- Publication date Feb 27, 2025
- Lightmatter, Inc
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRICAL DEVICES AND RELATED METHODS
- Publication number 20250070814
- Publication date Feb 27, 2025
- Skyworks Solutions, Inc.
- Andrew Martin KAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...
- Publication number 20250062592
- Publication date Feb 20, 2025
- PRIMAX ELECTRONICS LTD.
- CHING-HUI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVER BACKPLANE, DISPLAY PANEL, SPLICING SCREEN AND ELECTRONIC APP...
- Publication number 20250056951
- Publication date Feb 13, 2025
- Chengdu Vistar Optoelectronics Co., Ltd.
- Chen SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION
- Publication number 20250054929
- Publication date Feb 13, 2025
- SAMTEC, INC.
- Marc EPITAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250054921
- Publication date Feb 13, 2025
- Sony Semiconductor Solutions Corporation
- Akira OHMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
- Publication number 20250056880
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20250038136
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method for UBM/RDL routing

Limiting failures caused by dendrite growth on semiconductor chips

Semiconductor device and semiconductor module

Packaging architecture for disaggregated integrated voltage regulators

Semiconductor apparatus

Display device having connection unit

Fully molded structure with multi-height components comprising back...

Electronic package device and method of operating the same

Conformal power delivery structure for direct chip attach architect...

Microelectronic assemblies having conductive structures with differ...

Integrated voltage regulator and passive components

Display panel and display device

Aluminum-based gallium nitride integrated circuits

Antenna modules and communication devices

Optical receiving circuit

Display with embedded pixel driver chips

Integrated circuit structure

Semiconductor device and method for manufacture of semiconductor de...

Drive chip and display panel

Die to die high-speed communication without discrete amplifiers bet...

Radio-frequency switching devices having improved voltage handling...

Electrical devices and methods of manufacture

Antenna with graded dielectirc and method of making the same

Semiconductor package with electromagnetic interference shielding

RF amplifier devices including top side contacts and methods of man...

Transistor with integrated passive components

Semiconductor package and antenna module comprising the same

Power amplifier modules including semiconductor resistor and tantal...

Spatial power-combining devices with reduced size

Package embedded magnetic inductor structures and manufacturing tec...

Patents Applicationslast 30 patents

EMBEDDED INTEGRATED VOLTAGE REGULATOR

Structure and Method for Fabricating a Computing System with an Int...

RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...

INTEGRATED CIRCUIT STRUCTURE

ANTENNA MODULES AND COMMUNICATION DEVICES

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

ELECTRONIC DEVICE

Multi-Die Fine Grain Integrated Voltage Regulation

BUMP ARRANGEMENT OF INTEGRATED CIRCUITS FOR FLIP CHIP BONDING

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

CAPACITIVE VOLTAGE REGULATOR IN INTEGRATED CIRCUIT PACKAGE

BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASS...

DISPLAY PANEL AND DISPLAY DEVICE

BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE

IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AN...

ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...

PACKAGED ELECTRICAL DEVICES AND RELATED METHODS

DUAL SWITCHING POWER DEVICE

OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...

DRIVER BACKPLANE, DISPLAY PANEL, SPLICING SCREEN AND ELECTRONIC APP...

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION

LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS

METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...

DEVICE PACKAGE