High-frequency adaptations

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H01L2223/66

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/66High-frequency adaptations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Waveguide interconnects for semiconductor packages and related methods
- Patent number 12,266,840
- Issue date Apr 1, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device to reduce signal loss in a transmission line
- Patent number 12,266,603
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Pablo Jesús Gardella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,266,618
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 12,266,614
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,261,350
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-based gallium nitride integrated circuits
- Patent number 12,261,134
- Issue date Mar 25, 2025
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,255,158
- Issue date Mar 18, 2025
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna chip packaging structure and method for preparing same
- Patent number 12,255,159
- Issue date Mar 18, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yayuan Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 12,255,160
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Juyoun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 12,255,382
- Issue date Mar 18, 2025
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including plurality of gate fingers with vario...
- Patent number 12,249,543
- Issue date Mar 11, 2025
- Sumitomo Electric Industries, Ltd.
- Kenya Nishiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,249,585
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,243,836
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Shunji Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstructure enhanced absorption photosensitive devices
- Patent number 12,243,948
- Issue date Mar 4, 2025
- W&W Sens Devices, Inc.
- Shih-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity resonator for enhancing radio-frequency performance and meth...
- Patent number 12,237,280
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including wiring substrate having multiple sig...
- Patent number 12,237,254
- Issue date Feb 25, 2025
- Renesas Electronics Corporation
- Keita Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk cancelation structures having metal layers between signal...
- Patent number 12,237,258
- Issue date Feb 25, 2025
- RAMBUS INC.
- Shahram Nikoukary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ground fencing
- Patent number 12,230,879
- Issue date Feb 18, 2025
- Apple Inc.
- Xiaofang Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated tunable filter architecture
- Patent number 12,230,592
- Issue date Feb 18, 2025
- pSemi Corporation
- William R. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, front-end module, and communication apparatus
- Patent number 12,230,591
- Issue date Feb 18, 2025
- Murata Manufacturing Co., Ltd.
- Hiroshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave antenna chip and terminal device
- Patent number 12,224,254
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Weixi Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including lead frame having multiple conductive...
- Patent number 12,224,255
- Issue date Feb 11, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MESH INDUCTORS AND ANTENNAS OF ELECTRONIC ASSEMBLIES
- Publication number 20250105143
- Publication date Mar 27, 2025
- Super Micro Computer, Inc.
- Manhtien V. PHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Three-Dimensional On-Chip Inductors
- Publication number 20250098185
- Publication date Mar 20, 2025
- Apple Inc.
- Ming-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...
- Publication number 20250096180
- Publication date Mar 20, 2025
- Fujitsu Limited
- Shirou OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERN...
- Publication number 20250096116
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...
- Publication number 20250096108
- Publication date Mar 20, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Apparatus and Method
- Publication number 20250096167
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE LAUNCHER IN PACKAGE BASED ON HIGH DIELECTRIC CONSTANT CAR...
- Publication number 20250096165
- Publication date Mar 20, 2025
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO COMPENSATED POWER DETECTOR
- Publication number 20250085316
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Adrian John BERGSMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE COMPRISING ANTENNA AND COMMUNICATION M...
- Publication number 20250087606
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES
- Publication number 20250087604
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250087605
- Publication date Mar 13, 2025
- STMicroelectronics International N.V.
- Antoine Le Ravallec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250079374
- Publication date Mar 6, 2025
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, HIGH FREQUENCY DEVICE, AND METHOD OF MANUFACT...
- Publication number 20250079352
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takuma MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH GATE LAYOUT, DEVICE IMPLEMENTING THE TRANSISTOR WIT...
- Publication number 20250080063
- Publication date Mar 6, 2025
- Jonathan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079689
- Publication date Mar 6, 2025
- Advanced Semiconductor Engineering, Inc.
- Christophe ZINCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250079349
- Publication date Mar 6, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079418
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takuma MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
- Publication number 20250079300
- Publication date Mar 6, 2025
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming AIP Structure to Reduce...
- Publication number 20250079350
- Publication date Mar 6, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRICAL DEVICES AND RELATED METHODS
- Publication number 20250070814
- Publication date Feb 27, 2025
- Skyworks Solutions, Inc.
- Andrew Martin KAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF PUSH-PULL POWER AMPLIFIER CHIP AND RF FRONT-END MODULE
- Publication number 20250070733
- Publication date Feb 27, 2025
- RADROCK (SHENZHEN) TECHNOLOGY CO., LTD.
- Yuan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250070058
- Publication date Feb 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY AMPLIFIER HAVING REDUCED GAIN VARIATION
- Publication number 20250062735
- Publication date Feb 20, 2025
- Skyworks Solutions, Inc.
- Philip John Lehtola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures for Dual-Thickness Active Area SOI FETS
- Publication number 20250063822
- Publication date Feb 20, 2025
- pSemi Corporation
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250062209
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Sheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...
- Publication number 20250062243
- Publication date Feb 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF SWITCH DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062253
- Publication date Feb 20, 2025
- DB HiTek Co., Ltd.
- Ja Geon KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES
- Publication number 20250056927
- Publication date Feb 13, 2025
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250055175
- Publication date Feb 13, 2025
- PanelSemi Corporation
- Ching-Kuang Clive TZUANG
- H01 - BASIC ELECTRIC ELEMENTS

High-frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Waveguide interconnects for semiconductor packages and related methods

Semiconductor device to reduce signal loss in a transmission line

Integrated devices in semiconductor packages and methods of forming...

Semiconductor packages and manufacturing methods thereof

Semiconductor device and method of manufacturing the same

Molded laser package with electromagnetic interference shield and m...

Semiconductor packages including antenna pattern

Semiconductor device package and method of manufacturing the same

Thermal management in integrated circuit packages

Aluminum-based gallium nitride integrated circuits

Antenna modules employing three-dimensional (3D) build-up on mold p...

Components for millimeter-wave communication

Antenna chip packaging structure and method for preparing same

Semiconductor package and package-on-package including the same

Antenna modules and communication devices

Semiconductor device including plurality of gate fingers with vario...

Semiconductor device package

Semiconductor device

Microstructure enhanced absorption photosensitive devices

Waferscale physiological characteristic sensor package with integra...

Cavity resonator for enhancing radio-frequency performance and meth...

Devices and methods related to radio-frequency filters on silicon-o...

Integrated circuit structure

Semiconductor device including wiring substrate having multiple sig...

Crosstalk cancelation structures having metal layers between signal...

System and method for ground fencing

Integrated tunable filter architecture

Integrated circuit, front-end module, and communication apparatus

Millimeter-wave antenna chip and terminal device

Electronic package including lead frame having multiple conductive...

Patents Applicationslast 30 patents

MESH INDUCTORS AND ANTENNAS OF ELECTRONIC ASSEMBLIES

Electronic Device with Three-Dimensional On-Chip Inductors

SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...

INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERN...

CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...

Antenna Apparatus and Method

WAVEGUIDE LAUNCHER IN PACKAGE BASED ON HIGH DIELECTRIC CONSTANT CAR...

DEVICES AND METHODS RELATED TO COMPENSATED POWER DETECTOR

SEMICONDUCTOR DEVICE PACKAGE COMPRISING ANTENNA AND COMMUNICATION M...

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE, HIGH FREQUENCY DEVICE, AND METHOD OF MANUFACT...

TRANSISTOR WITH GATE LAYOUT, DEVICE IMPLEMENTING THE TRANSISTOR WIT...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK

SEMICONDUCTOR DEVICE

MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

Semiconductor Device and Method of Forming AIP Structure to Reduce...

PACKAGED ELECTRICAL DEVICES AND RELATED METHODS

RF PUSH-PULL POWER AMPLIFIER CHIP AND RF FRONT-END MODULE

SEMICONDUCTOR DEVICE PACKAGE

RADIO-FREQUENCY AMPLIFIER HAVING REDUCED GAIN VARIATION

Contact Structures for Dual-Thickness Active Area SOI FETS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...

RF SWITCH DEVICE AND MANUFACTURING METHOD THEREOF

EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

ANTENNA DEVICE