High-frequency adaptations

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H01L2223/66

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/66High-frequency adaptations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Millimeter-wave antenna chip and terminal device
- Patent number 12,224,254
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Weixi Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including lead frame having multiple conductive...
- Patent number 12,224,255
- Issue date Feb 11, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package including antenna horn and semicondu...
- Patent number 12,224,480
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-stage Doherty power amplifiers implemented with multiple s...
- Patent number 12,224,713
- Issue date Feb 11, 2025
- NXP USA, INC.
- Mark Pieter van der Heijden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,224,481
- Issue date Feb 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, electronic device, and method for manufacturing substrate
- Patent number 12,218,085
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,211,765
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor doped region with biased isolated members
- Patent number 12,211,807
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single die design for different polarizations
- Patent number 12,212,074
- Issue date Jan 28, 2025
- NXP B.V.
- Jan Willem Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 12,211,803
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming discrete antenna modules
- Patent number 12,211,808
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and multi-level interposer with RF sloped via and...
- Patent number 12,205,880
- Issue date Jan 21, 2025
- Eagle Technology, LLC
- Matt Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on sapphire substrate for edge computer
- Patent number 12,205,936
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Devendra K. Sadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial oxide materials, structures, and devices
- Patent number 12,206,048
- Issue date Jan 21, 2025
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier device and semiconductor die
- Patent number 12,206,371
- Issue date Jan 21, 2025
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van Der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid Doherty power amplifier module
- Patent number 12,199,571
- Issue date Jan 14, 2025
- Ampleon Netherlands B.V.
- Zhi Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor device
- Patent number 12,199,053
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based monolithic microwave integrated circuits ha...
- Patent number 12,191,821
- Issue date Jan 7, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 12,191,265
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors of semiconductor device capable of operating in high fre...
- Patent number 12,191,348
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Jaeho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with logic circuits and memor...
- Patent number 12,183,699
- Issue date Dec 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,184,243
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Mikiko Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse circuits
- Patent number 12,183,673
- Issue date Dec 31, 2024
- Skyworks Solutions, Inc.
- Bo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,183,648
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Mikiko Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES
- Publication number 20250056927
- Publication date Feb 13, 2025
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250055175
- Publication date Feb 13, 2025
- PanelSemi Corporation
- Ching-Kuang Clive TZUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING AIR GAP
- Publication number 20250046701
- Publication date Feb 6, 2025
- RF MATERIALS CO., LTD.
- Ki Woo HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFFLE-SHAPED RADIO FREQUENCY (RF) SWITCH
- Publication number 20250046736
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Woojin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
- Publication number 20250046737
- Publication date Feb 6, 2025
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20250038136
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...
- Publication number 20250038127
- Publication date Jan 30, 2025
- Lodestar Licensing Group, LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER MEMBER WITH ONE OR MORE VIAS
- Publication number 20250038085
- Publication date Jan 30, 2025
- Avago Technologies International Sales Pte. Limited
- Walter Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250029940
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20250022817
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Tetsurou ASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022818
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Yoshiki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF MODULE
- Publication number 20250022815
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR PROGRAMMING A FUSE
- Publication number 20250022674
- Publication date Jan 16, 2025
- Skyworks Solutions, Inc.
- Bo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
- Publication number 20250015020
- Publication date Jan 9, 2025
- MURATA MANUFACTURING CO., LTD.
- Atsushi ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SEMICONDUCTOR DEVICE
- Publication number 20250015768
- Publication date Jan 9, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Akihiko NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...
- Publication number 20250006667
- Publication date Jan 2, 2025
- Intel Corporation
- Georgios PANAGOPOULOS
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SWITCHES WITH VOLTAGE LEVEL SHIFTERS IN RADIO FREQUENCY APPLICATIONS
- Publication number 20250007499
- Publication date Jan 2, 2025
- Skyworks Solutions, Inc.
- Florinel G. Balteanu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION
- Publication number 20250006626
- Publication date Jan 2, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Didier BELOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC
- Publication number 20250006666
- Publication date Jan 2, 2025
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURI...
- Publication number 20250006669
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAIN-AUXILIARY FIELD-EFFECT TRANSISTOR CONFIGURATIONS
- Publication number 20250007512
- Publication date Jan 2, 2025
- Skyworks Solutions, Inc.
- Hailing Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated Waveguides for Semiconductor Technology
- Publication number 20250006668
- Publication date Jan 2, 2025
- Intel Corporation
- Carla Moran Guizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE WITH ANISOTROPIC HEXAGONAL BORON NITRIDE THERMAL INT...
- Publication number 20250006670
- Publication date Jan 2, 2025
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Jinliang ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429207
- Publication date Dec 26, 2024
- InnoLux Corporation
- Jen-Hai CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICA...
- Publication number 20240429230
- Publication date Dec 26, 2024
- Wolfspeed, Inc.
- Matthew King
- H01 - BASIC ELECTRIC ELEMENTS

High-frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Millimeter-wave antenna chip and terminal device

Electronic package including lead frame having multiple conductive...

Microelectronic device package including antenna horn and semicondu...

Multiple-stage Doherty power amplifiers implemented with multiple s...

Package and method of forming same

Semiconductor device package and method of manufacturing the same

Semiconductor device

Substrate, electronic device, and method for manufacturing substrate

Semiconductor device package

Semiconductor doped region with biased isolated members

Single die design for different polarizations

Semiconductor device and method of forming semiconductor package wi...

Semiconductor device and method of forming discrete antenna modules

Electronic device and multi-level interposer with RF sloped via and...

Silicon on sapphire substrate for edge computer

Epitaxial oxide materials, structures, and devices

Die to die high-speed communication without discrete amplifiers bet...

Power amplifier device and semiconductor die

Hybrid Doherty power amplifier module

Electronic device and semiconductor device

Methods of forming microelectronic device assemblies and packages

Group III nitride-based monolithic microwave integrated circuits ha...

Antenna apparatus and method

Cantilevered power planes to provide a return current path for high...

Capacitors of semiconductor device capable of operating in high fre...

Antenna with graded dielectirc and method of making the same

3D semiconductor device and structure with logic circuits and memor...

Semiconductor device

Fuse circuits

Semiconductor device and semiconductor module

Patents Applicationslast 30 patents

EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES

ANTENNA DEVICE

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

PACKAGE STRUCTURE HAVING AIR GAP

WAFFLE-SHAPED RADIO FREQUENCY (RF) SWITCH

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA

DEVICE PACKAGE

SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

STIFFENER MEMBER WITH ONE OR MORE VIAS

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

HIGH-FREQUENCY MODULE

SEMICONDUCTOR MODULE

RF MODULE

DEVICES AND METHODS FOR PROGRAMMING A FUSE

IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

POWER AMPLIFIER SEMICONDUCTOR DEVICE

AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...

SWITCHES WITH VOLTAGE LEVEL SHIFTERS IN RADIO FREQUENCY APPLICATIONS

INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION

MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURI...

MAIN-AUXILIARY FIELD-EFFECT TRANSISTOR CONFIGURATIONS

Integrated Waveguides for Semiconductor Technology

ANTENNA MODULE WITH ANISOTROPIC HEXAGONAL BORON NITRIDE THERMAL INT...

ELECTRONIC DEVICE

INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICA...