Holders for supporting the complete device in operation

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CPC
H01L23/32

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/32Holders for supporting the complete device in operation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of producing circuit boards
- Patent number 11,974,404
- Issue date Apr 30, 2024
- TOPPAN INC.
- Yuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 11,959,939
- Issue date Apr 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,955,339
- Issue date Apr 9, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for manufacturing the same, and m...
- Patent number 11,929,313
- Issue date Mar 12, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Mingyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 11,901,310
- Issue date Feb 13, 2024
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,894,292
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Qing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in a package modifications
- Patent number 11,869,823
- Issue date Jan 9, 2024
- OCTAVO SYSTEMS LLC
- Michael Kenneth Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including inter-die via structures and methods for...
- Patent number 11,869,877
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supports for thinned semiconductor substrates and related methods
- Patent number 11,854,995
- Issue date Dec 26, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,817,367
- Issue date Nov 14, 2023
- Siemens Aktiengesellschaft
- Jens Schmenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression-loaded printed circuit assembly for solder defect mitig...
- Patent number 11,791,231
- Issue date Oct 17, 2023
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,769,718
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with anchor structure and method for forming...
- Patent number 11,764,168
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression-loaded printed circuit assembly for solder defect mitig...
- Patent number 11,756,851
- Issue date Sep 12, 2023
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package including a lower sem...
- Patent number 11,749,592
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 11,728,243
- Issue date Aug 15, 2023
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,699,674
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection layer for panel handling systems
- Patent number 11,682,600
- Issue date Jun 20, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved clamp
- Patent number 11,652,015
- Issue date May 16, 2023
- Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Yong Ai Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFID tag
- Patent number 11,641,714
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC socket for semiconductor
- Patent number 11,624,774
- Issue date Apr 11, 2023
- Yamaichi Electronics Co., Ltd.
- Hiroki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer and method for manufacturing organic interposer
- Patent number 11,562,951
- Issue date Jan 24, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection electrode and method for manufacturing connection electrode
- Patent number 11,508,682
- Issue date Nov 22, 2022
- Murata Manufacturing Co., Ltd.
- Ryosuke Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip holder
- Patent number 11,499,991
- Issue date Nov 15, 2022
- Brother Kogyo Kabushiki Kaisha
- Hidekazu Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,013
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,495,511
- Issue date Nov 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,469,166
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including optical modules
- Patent number 11,443,998
- Issue date Sep 13, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multidie supports for reducing die warpage
- Patent number 11,430,746
- Issue date Aug 30, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for inspection
- Patent number 11,415,624
- Issue date Aug 16, 2022
- Yamaichi Electronics Co., Ltd.
- Junichi Miyaaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND INFORMATION PROCESSING SYSTEM
- Publication number 20240147625
- Publication date May 2, 2024
- KIOXIA Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN A PACKAGE MODIFICATIONS
- Publication number 20240087975
- Publication date Mar 14, 2024
- Octavo Systems LLC
- Michael Kenneth CONTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
- Publication number 20240079343
- Publication date Mar 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTROTECHNICAL ARRANGEMENT, ELECTRONIC CO...
- Publication number 20240006255
- Publication date Jan 4, 2024
- ROBERT BOSCH GmbH
- Ingo Fritsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402334
- Publication date Dec 14, 2023
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP STORAGE CONTAINER
- Publication number 20230378014
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Nadav Tsur
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE
- Publication number 20230369250
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Ting LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230335465
- Publication date Oct 19, 2023
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230299033
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANODIZED FILM SUBSTRATE BASE, ANODIZED FILM SUBSTRATE PART HAVING S...
- Publication number 20230290740
- Publication date Sep 14, 2023
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230230894
- Publication date Jul 20, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Jens Schmenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187850
- Publication date Jun 15, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHED-MODE LIGHT-EMITTING DIODE (LED) DISPLAY UNIT SATISFYING FI...
- Publication number 20230171903
- Publication date Jun 1, 2023
- NANJING LOPU CO., LTD.
- Bin ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230118368
- Publication date Apr 20, 2023
- Showa Denko Materials Co., Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages Having Support Rings
- Publication number 20230103560
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE FABRICATION KIT AND CHIP PACKAGE FABRICATING METHOD TH...
- Publication number 20230077857
- Publication date Mar 16, 2023
- TIEN CHIEN CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20230069959
- Publication date Mar 9, 2023
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER RING AND SURFACE PACKAGING ASSEMBLY
- Publication number 20230066053
- Publication date Mar 2, 2023
- Huawei Technologies Co., Ltd
- Chuncheng GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTER-DIE VIA STRUCTURES AND METHODS FOR...
- Publication number 20230042438
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE DIPPING STRUCTURE
- Publication number 20230023353
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chun Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS
- Publication number 20230006374
- Publication date Jan 5, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20230005805
- Publication date Jan 5, 2023
- KIOXIA Corporation
- Hideki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP HOLDER
- Publication number 20220413011
- Publication date Dec 29, 2022
- BROTHER KOGYO KABUSHIKI KAISHA
- Hidekazu KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSING DEVICE FOR DIRECTLY OR INDIRECTLY APPLYING PRESSURE TO POW...
- Publication number 20220406674
- Publication date Dec 22, 2022
- Ingo BOGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20220375839
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE AND METHOD FOR FORMING...
- Publication number 20220359422
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Ting LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE SUPPORTS AND RELATED METHODS
- Publication number 20220352095
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED GRID ARRAY MODULE
- Publication number 20220272880
- Publication date Aug 25, 2022
- Intel Corporation
- Shailendra Singh CHAUHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RETAINING STRUCTURE TO FIX A CHIP MODULE
- Publication number 20220254698
- Publication date Aug 11, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- FANG-JWU LIAO
- H01 - BASIC ELECTRIC ELEMENTS

Holders for supporting the complete device in operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of producing circuit boards

Chip socket, testing fixture and chip testing method thereof

Device and method for bonding of substrates

Chip package structure and method for manufacturing the same, and m...

Electronic assembly

Power module

System in a package modifications

Bonded assembly including inter-die via structures and methods for...

Supports for thinned semiconductor substrates and related methods

Power module

Compression-loaded printed circuit assembly for solder defect mitig...

Packages with Si-substrate-free interposer and method forming same

Chip package structure with anchor structure and method for forming...

Compression-loaded printed circuit assembly for solder defect mitig...

Package-on-package type semiconductor package including a lower sem...

Through electrode substrate and semiconductor device

Semiconductor package and method of forming the same

Protection layer for panel handling systems

Semiconductor package with improved clamp

RFID tag

IC socket for semiconductor

Organic interposer and method for manufacturing organic interposer

Connection electrode and method for manufacturing connection electrode

IC chip holder

Integrated circuit package and method

Semiconductor package structure and method for manufacturing the same

Packages with Si-substrate-free interposer and method forming same

Electronic assembly including optical modules

Multidie supports for reducing die warpage

Socket for inspection

Patents Applicationslast 30 patents

SEMICONDUCTOR STORAGE DEVICE AND INFORMATION PROCESSING SYSTEM

SYSTEM IN A PACKAGE MODIFICATIONS

SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

METHOD FOR PRODUCING AN ELECTROTECHNICAL ARRANGEMENT, ELECTRONIC CO...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT CHIP STORAGE CONTAINER

CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

ANODIZED FILM SUBSTRATE BASE, ANODIZED FILM SUBSTRATE PART HAVING S...

POWER MODULE

LIQUID METAL CONNECTION DEVICE AND METHOD

SWITCHED-MODE LIGHT-EMITTING DIODE (LED) DISPLAY UNIT SATISFYING FI...

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Integrated Circuit Packages Having Support Rings

CHIP PACKAGE FABRICATION KIT AND CHIP PACKAGE FABRICATING METHOD TH...

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

STIFFENER RING AND SURFACE PACKAGING ASSEMBLY

BONDED ASSEMBLY INCLUDING INTER-DIE VIA STRUCTURES AND METHODS FOR...

SEMICONDUCTOR DIE DIPPING STRUCTURE

MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

IC CHIP HOLDER

PRESSING DEVICE FOR DIRECTLY OR INDIRECTLY APPLYING PRESSURE TO POW...

Packages with Si-Substrate-Free Interposer and Method Forming Same

CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE AND METHOD FOR FORMING...

MULTIDIE SUPPORTS AND RELATED METHODS

HIGH SPEED GRID ARRAY MODULE

CHIP RETAINING STRUCTURE TO FIX A CHIP MODULE