Holes

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B81B2203/0353

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2203/00Basic micro-electromechanical structures

Current Industry

B81B2203/0353Holes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for producing fine structures in the volume of a substrate c...
- Patent number 12,172,157
- Issue date Dec 24, 2024
- Schott AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Drop resistant MEMS actuator-imager assembly package
- Patent number 12,145,839
- Issue date Nov 19, 2024
- Faez Ba-Tis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic chip and fabrication method
- Patent number 12,134,097
- Issue date Nov 5, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Wei Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Triple-membrane MEMS device
- Patent number 12,133,060
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system and method for fabricating MEMS havi...
- Patent number 12,103,845
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Jung-Hao Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Extremal microstructured surfaces
- Patent number 12,060,261
- Issue date Aug 13, 2024
- BVW Holding AG
- Lukas Bluecher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic chip and valve, production process and uses
- Patent number 12,017,220
- Issue date Jun 25, 2024
- Curiosity Diagnostics sp. z o.o.
- Pawel Solczynski
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-device structures with etch holes
- Patent number 12,006,205
- Issue date Jun 11, 2024
- X-CELEPRINT LIMITED
- António José Marques Trindade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual-layer micro-ribbon MEMS light modulator
- Patent number 11,958,738
- Issue date Apr 16, 2024
- Silicon Light Machines Corporation
- Olav Solgaard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive microphone sensor design and fabrication method for achi...
- Patent number 11,902,741
- Issue date Feb 13, 2024
- Kathirgamasundaram Sooriakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Triple-membrane MEMS device
- Patent number 11,889,283
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical system and manufacturing method thereof
- Patent number 11,851,321
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS chip
- Patent number 11,805,372
- Issue date Oct 31, 2023
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Zhuanzhuan Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS chip
- Patent number 11,805,373
- Issue date Oct 31, 2023
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Zhuanzhuan Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with perimeter barometric relief pierce
- Patent number 11,772,961
- Issue date Oct 3, 2023
- Knowles Electronics, LLC
- Michael Kuntzman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate assembly and method of bonding substrates
- Patent number 11,752,499
- Issue date Sep 12, 2023
- Taiwan Green Point Enterprises Co., Ltd.
- Sung-Yi Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deep reactive ion etching process for fluid ejection heads
- Patent number 11,746,005
- Issue date Sep 5, 2023
- FUNAI ELECTRIC CO. LTD
- David L. Bernard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure forming method and device
- Patent number 11,679,976
- Issue date Jun 20, 2023
- Seiko Epson Corporation
- Shogo Inaba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic devices with electrodes formed as physically separated...
- Patent number 11,673,798
- Issue date Jun 13, 2023
- International Business Machines Corporation
- Gabriel Fernando Puebla Hellmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component for a sensor device and manufacturing met...
- Patent number 11,623,861
- Issue date Apr 11, 2023
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic package including cavity formed by removal of sacrificia...
- Patent number 11,545,952
- Issue date Jan 3, 2023
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing fine structures in the volume of a substrate c...
- Patent number 11,534,754
- Issue date Dec 27, 2022
- Schott AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive microphone sensor design and fabrication method for achi...
- Patent number 11,523,224
- Issue date Dec 6, 2022
- Kathirgamasundaram Sooriakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure of micro-electro-mechanical-system microphone and method...
- Patent number 11,498,830
- Issue date Nov 15, 2022
- Solid State System Co., Ltd.
- Cheng-Wei Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nanopore-forming method, nanopore-forming device and biomolecule me...
- Patent number 11,499,959
- Issue date Nov 15, 2022
- HITACHI HIGH-TECH CORPORATION
- Yoshimitsu Yanagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing at least one recess in a material by means of...
- Patent number 11,478,880
- Issue date Oct 25, 2022
- LPKF Laser & Electronics AG
- Roman Ostholt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microfluidic chip and microfluidic device
- Patent number 11,478,790
- Issue date Oct 25, 2022
- NOK Corporation
- Takayuki Komori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Plurality of filters
- Patent number 11,440,009
- Issue date Sep 13, 2022
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTROMECHANICAL DEVICE AND MICROELECTROMECHANICAL LOUDSPEAKER
- Publication number 20250019228
- Publication date Jan 16, 2025
- ROBERT BOSCH GmbH
- Maximilian Sommer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRIPLE-MEMBRANE MEMS DEVICE
- Publication number 20250024203
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Microphone
- Publication number 20250011158
- Publication date Jan 9, 2025
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Xingfu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250011165
- Publication date Jan 9, 2025
- Vanguard International Semiconductor Corporation
- JIA JIE XIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC SENSOR DEVICE WITH MULTI-SIDED ANCHOR
- Publication number 20240425353
- Publication date Dec 26, 2024
- Soundskrit Inc.
- Stephane Leahy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...
- Publication number 20240425366
- Publication date Dec 26, 2024
- United Microelectronics Corp.
- Jung-Hao CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Inertial Sensor
- Publication number 20240425357
- Publication date Dec 26, 2024
- SensorTek technology Corp.
- Shih-Yuan LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ATTACHABLE MICROPHONE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240417240
- Publication date Dec 19, 2024
- CENTER FOR ADVANCED SOFT ELECTRONICS
- Kilwon CHO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP
- Publication number 20240409396
- Publication date Dec 12, 2024
- Canon Kabushiki Kaisha
- RYOTARO MURAKAMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20240400376
- Publication date Dec 5, 2024
- AAC TECHNOLOGIES PTE. LTD
- Colin Robert Jenkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MEMS PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS
- Publication number 20240391760
- Publication date Nov 28, 2024
- STMicroelectronics International N.V.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Switch, Preparation Method thereof, and Electronic Apparatus
- Publication number 20240359973
- Publication date Oct 31, 2024
- Beijing BOE Technology Development Co., Ltd.
- Yingli SHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIRECTIONAL MEMS MICROPHONE
- Publication number 20240327204
- Publication date Oct 3, 2024
- Merry Electronics(Shenzhen) Co., Ltd.
- Yueh-Kang Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR
- Publication number 20240317579
- Publication date Sep 26, 2024
- Rohm Co., Ltd.
- Daisuke KAMINISHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20240270567
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi MATSUBARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE
- Publication number 20240217809
- Publication date Jul 4, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Zhuanzhuan Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VIBRATION SENSOR AND FABRICA...
- Publication number 20240208801
- Publication date Jun 27, 2024
- UPBEAT TECHNOLOGY Co., Ltd
- Hsi-Wen TUNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL Z-ACCELERATION SENSOR
- Publication number 20240199409
- Publication date Jun 20, 2024
- ROBERT BOSCH GmbH
- Cristian Nagel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240158225
- Publication date May 16, 2024
- UNITED MICROELECTRONICS CORP.
- Jung-Hao Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...
- Publication number 20240137711
- Publication date Apr 25, 2024
- Innogrity Pte Ltd
- KATHIRGAMASUNDARAM SOORIAKUMAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Triple-Membrane MEMS Device
- Publication number 20240114292
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS OPTICAL MICROPHONE
- Publication number 20240101411
- Publication date Mar 28, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Taimoor Ali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE
- Publication number 20240034620
- Publication date Feb 1, 2024
- Merry Electronics(Shenzhen) Co., Ltd.
- Yung-Hsiang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20230391610
- Publication date Dec 7, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230382714
- Publication date Nov 30, 2023
- DB HITEK CO., LTD.
- Min Hyun JUNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD
- Publication number 20230365396
- Publication date Nov 16, 2023
- TDK Corporation
- Toyotaka KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVI...
- Publication number 20230357001
- Publication date Nov 9, 2023
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing fine structures in the volume of a substrate c...

Drop resistant MEMS actuator-imager assembly package

Microfluidic chip and fabrication method

Triple-membrane MEMS device

Micro-electromechanical system and method for fabricating MEMS havi...

Extremal microstructured surfaces

Sensing device and method for manufacturing sensing device

Microfluidic chip and valve, production process and uses

Micro-device structures with etch holes

Dual-layer micro-ribbon MEMS light modulator

Capacitive microphone sensor design and fabrication method for achi...

Triple-membrane MEMS device

Chip package and manufacturing method thereof

Micro-electro mechanical system and manufacturing method thereof

MEMS chip

MEMS chip

MEMS device with perimeter barometric relief pierce

Substrate assembly and method of bonding substrates

Deep reactive ion etching process for fluid ejection heads

Structure forming method and device

Microfluidic devices with electrodes formed as physically separated...

Micromechanical component for a sensor device and manufacturing met...

Electronic package including cavity formed by removal of sacrificia...

Method for producing fine structures in the volume of a substrate c...

Capacitive microphone sensor design and fabrication method for achi...

Structure of micro-electro-mechanical-system microphone and method...

Nanopore-forming method, nanopore-forming device and biomolecule me...

Method for producing at least one recess in a material by means of...

Microfluidic chip and microfluidic device

Plurality of filters

Patents Applicationslast 30 patents

MICROELECTROMECHANICAL DEVICE AND MICROELECTROMECHANICAL LOUDSPEAKER

TRIPLE-MEMBRANE MEMS DEVICE

MEMS Microphone

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

ACOUSTIC SENSOR DEVICE WITH MULTI-SIDED ANCHOR

MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...

Inertial Sensor

ATTACHABLE MICROPHONE AND MANUFACTURING METHOD THEREFOR

LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP

MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

CAPACITIVE MEMS PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS

MEMS Switch, Preparation Method thereof, and Electronic Apparatus

DIRECTIONAL MEMS MICROPHONE

MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

MEMS MICROPHONE

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VIBRATION SENSOR AND FABRICA...

MICROMECHANICAL Z-ACCELERATION SENSOR

MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Triple-Membrane MEMS Device

MEMS OPTICAL MICROPHONE

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE

MEMS MICROPHONE PACKAGE

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME

MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD

PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVI...