Hollow conductors, i.e. conductors partially or completely surrounding a void

Industry

CPC
H05K2201/037

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/037Hollow conductors, i.e. conductors partially or completely surrounding a void

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,997,901
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filtering cable
- Patent number 11,929,189
- Issue date Mar 12, 2024
- Yunan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground terminal and electronic device
- Patent number 11,881,333
- Issue date Jan 23, 2024
- Shenzhen Johan Material Technology Co., Ltd.
- Mujiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive film and conductive film roll, electronic paper, touch p...
- Patent number 11,877,391
- Issue date Jan 16, 2024
- Asahi Kasei Kabushiki Kaisha
- Takeshi Kamijo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Front-end module comprising front-end components and a substrate in...
- Patent number 11,777,186
- Issue date Oct 3, 2023
- Allen-Vanguard Corporation
- Sulav Adhikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount waveguide for vertical transitions of a printed circu...
- Patent number 11,757,166
- Issue date Sep 12, 2023
- Aptiv Technologies Limited
- Biswadeep Das Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,728,258
- Issue date Aug 15, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and wiring structure thereof
- Patent number 11,678,435
- Issue date Jun 13, 2023
- Innolux Corporation
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having waveguides and method of manufacturing the same
- Patent number 11,678,431
- Issue date Jun 13, 2023
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,678,440
- Issue date Jun 13, 2023
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hollow waveguide assembly formed by affixing first and second subst...
- Patent number 11,664,567
- Issue date May 30, 2023
- NXP B.V.
- Adrianus Buijsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically transitioning between substrate integrated waveguides (S...
- Patent number 11,658,378
- Issue date May 23, 2023
- International Business Machines Corporation
- Joshua C. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board having multiple degrees of freedom and anti-shaking m...
- Patent number 11,638,352
- Issue date Apr 25, 2023
- VISTA INNOTECH LIMITED
- Lin Chi Mak
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,605,697
- Issue date Mar 14, 2023
- Samsung Display Co., Ltd.
- Byoungyong Kim
- G02 - OPTICS
Information Patent Grant
Printed circuit board
- Patent number 11,558,959
- Issue date Jan 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,523,517
- Issue date Dec 6, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a structure upon a substrate
- Patent number 11,490,526
- Issue date Nov 1, 2022
- XTPL S.A.
- Piotr Kowalczewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection including a hybrid cable assembly and a circuit boa...
- Patent number 11,482,766
- Issue date Oct 25, 2022
- MD Elektronik GmbH
- Martin Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 11,469,201
- Issue date Oct 11, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and connecting structure of the same
- Patent number 11,470,728
- Issue date Oct 11, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method therefor
- Patent number 11,464,117
- Issue date Oct 4, 2022
- LG Innotek Co., Ltd
- Hee Young Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,439,022
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Il Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board
- Patent number 11,406,024
- Issue date Aug 2, 2022
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB with substrate integrated waveguides using multi-band monopole...
- Patent number 11,399,428
- Issue date Jul 26, 2022
- International Business Machines Corporation
- Pavel Roy Paladhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive particles and test socket having the same
- Patent number 11,373,779
- Issue date Jun 28, 2022
- SNOW CO., LTD.
- Gyu Sun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodeposited copper foil and electrode, and lithium-ion seconda...
- Patent number 11,362,337
- Issue date Jun 14, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Flexible printed circuit
- Publication number 20240292526
- Publication date Aug 29, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Zhigao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240237211
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138066
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...
- Publication number 20240030575
- Publication date Jan 25, 2024
- ALLEN-VANGUARD CORPORATION
- Sulav ADHIKARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230413429
- Publication date Dec 21, 2023
- IBIDEN CO., LTD.
- Atsushi DEGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier assembly and method for producing a carrier assembly
- Publication number 20230354529
- Publication date Nov 2, 2023
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection of printed circuit boards with nanowires
- Publication number 20230319976
- Publication date Oct 5, 2023
- Klaus Haimlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230262885
- Publication date Aug 17, 2023
- InnoLux Corporation
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE
- Publication number 20230223200
- Publication date Jul 13, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...
- Publication number 20230199964
- Publication date Jun 22, 2023
- Nichia Corporation.
- Yosuke NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...
- Publication number 20230172021
- Publication date Jun 1, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230130183
- Publication date Apr 27, 2023
- Shinko Electric Industries Co., Ltd.
- Akihiro TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...
- Publication number 20230115820
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230047768
- Publication date Feb 16, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING WAVIEGUIDES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230011064
- Publication date Jan 12, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With a Magnetic Element and a Manufacturing Method
- Publication number 20220377896
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan SALKOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220217843
- Publication date Jul 7, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Filtering Cable
- Publication number 20220199292
- Publication date Jun 23, 2022
- Yunan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20220173010
- Publication date Jun 2, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUBSTRATE INTEGRATED HOLLOW WAVEGUIDE AND...
- Publication number 20220173490
- Publication date Jun 2, 2022
- NXP B.V.
- Adrianus Buijsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface-Mount Waveguide for Vertical Transitions of a Printed Circu...
- Publication number 20220151074
- Publication date May 12, 2022
- Aptiv Technologies Limited
- Biswadeep Das Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20220084927
- Publication date Mar 17, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20220007494
- Publication date Jan 6, 2022
- Murata Manufacturing Co., Ltd.
- Yukio YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND WIRING STRUCTURE THEREOF
- Publication number 20210385940
- Publication date Dec 9, 2021
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM AND CONDUCTIVE FILM ROLL, ELECTRONIC PAPER, TOUCH P...
- Publication number 20210321512
- Publication date Oct 14, 2021
- Asahi Kasei Kabushiki Kaisha
- Takeshi KAMIJO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE PARTICLES AND TEST SOCKET HAVING THE SAME
- Publication number 20210319928
- Publication date Oct 14, 2021
- SNOW CO., LTD.
- Gyu Sun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A STRUCTURE UPON A SUBSTRATE
- Publication number 20210307176
- Publication date Sep 30, 2021
- XTPL S.A.
- Piotr KOWALCZEWSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
- Publication number 20210202425
- Publication date Jul 1, 2021
- MEDIATEK INC.
- Che-Ya CHOU
- H01 - BASIC ELECTRIC ELEMENTS

Hollow conductors, i.e. conductors partially or completely surrounding a void

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate and semiconductor device

Circuit board and method for manufacturing the same

Display apparatus having grooved terminals

Filtering cable

Method of manufacturing bonded body for insulation circuit substrat...

Ground terminal and electronic device

Conductive film and conductive film roll, electronic paper, touch p...

Front-end module comprising front-end components and a substrate in...

Surface-mount waveguide for vertical transitions of a printed circu...

Electroless metal-defined thin pad first level interconnects for li...

Electronic device and wiring structure thereof

Circuit board having waveguides and method of manufacturing the same

Printed wiring board and method for manufacturing printed wiring board

Hollow waveguide assembly formed by affixing first and second subst...

Vertically transitioning between substrate integrated waveguides (S...

Electroless and electrolytic deposition process for forming traces...

Circuit board having multiple degrees of freedom and anti-shaking m...

Display apparatus having grooved terminals

Printed circuit board

Circuit board and method for manufacturing the same

Method of forming a structure upon a substrate

Interconnection including a hybrid cable assembly and a circuit boa...

Semiconductor package and method for fabricating base for semicondu...

Multilayer board and connecting structure of the same

Printed circuit board and manufacturing method therefor

Printed circuit board

Multi-layer circuit board with traces thicker than a circuit board

PCB with substrate integrated waveguides using multi-band monopole...

Conductive particles and test socket having the same

Electrodeposited copper foil and electrode, and lithium-ion seconda...

Patents Applicationslast 30 patents

Flexible printed circuit

CIRCUIT MODULE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT MODULE

FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...

WIRING SUBSTRATE

Carrier assembly and method for producing a carrier assembly

Interconnection of printed circuit boards with nanowires

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

ELECTRONIC DEVICE

PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE

CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...

DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD HAVING WAVIEGUIDES AND METHOD OF MANUFACTURING THE SAME

Component Carrier With a Magnetic Element and a Manufacturing Method

PRINTED CIRCUIT BOARD

Filtering Cable

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

SEMICONDUCTOR DEVICE WITH SUBSTRATE INTEGRATED HOLLOW WAVEGUIDE AND...

Surface-Mount Waveguide for Vertical Transitions of a Printed Circu...

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

MODULE

ELECTRONIC DEVICE AND WIRING STRUCTURE THEREOF

CONDUCTIVE FILM AND CONDUCTIVE FILM ROLL, ELECTRONIC PAPER, TOUCH P...

CONDUCTIVE PARTICLES AND TEST SOCKET HAVING THE SAME

METHOD OF FORMING A STRUCTURE UPON A SUBSTRATE

SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY