II-VI

Industry

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H01L2924/1037

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1037II-VI

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct filter hybridization for an optical sensor and filter assembly
- Patent number 11,788,884
- Issue date Oct 17, 2023
- Raytheon Company
- Thomas P. Sprafke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 11,430,719
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Manu A. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,158,557
- Issue date Oct 26, 2021
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution deposited magnetically guided chiplet displacement
- Patent number 10,636,837
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 10,607,927
- Issue date Mar 31, 2020
- Texas Instruments Incorporated
- Manu J. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
UBM (under bump metal) electrode structure for radiation detector,...
- Patent number 10,199,343
- Issue date Feb 5, 2019
- JX Nippon Mining & Metals Corporation
- Makoto Mikami
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 10,153,266
- Issue date Dec 11, 2018
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded electronic system having stacked semic...
- Patent number 10,109,614
- Issue date Oct 23, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via structures for thermal dissipation
- Patent number 9,997,428
- Issue date Jun 12, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Marshall Maple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipped die stack
- Patent number 9,825,002
- Issue date Nov 21, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a semiconductor device, and semiconductor...
- Patent number 9,524,940
- Issue date Dec 20, 2016
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic assembly with TSVs formed in stages with pl...
- Patent number 9,368,476
- Issue date Jun 14, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device, and semiconductor...
- Patent number 9,293,409
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic assembly with TSVS formed in stages with pl...
- Patent number 9,099,296
- Issue date Aug 4, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,865,522
- Issue date Oct 21, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,803,312
- Issue date Aug 12, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pads defined by embedded traces
- Patent number 8,772,908
- Issue date Jul 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free wafer bonding using channels
- Patent number 8,652,935
- Issue date Feb 18, 2014
- Tessera, Inc.
- Ilyas Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked microelectronic assembly with TSVs formed in stages with pl...
- Patent number 8,587,126
- Issue date Nov 19, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,546,934
- Issue date Oct 1, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pads defined by embedded traces
- Patent number 8,432,045
- Issue date Apr 30, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,202,786
- Issue date Jun 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20210210404
- Publication date Jul 8, 2021
- Mitsubishi Electric Corporation
- Takuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20190318983
- Publication date Oct 17, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Manu A. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190229031
- Publication date Jul 25, 2019
- Mitsubishi Electric Corporation
- Takuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366417
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UBM (UNDER BUMP METAL) ELECTRODE STRUCTURE FOR RADIATION DETECTOR,...
- Publication number 20180061792
- Publication date Mar 1, 2018
- JX NIPPON MINING & METALS CORPORATION
- Makoto MIKAMI
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS
- Publication number 20140340900
- Publication date Nov 20, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Stephen Bathurst
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PL...
- Publication number 20140048954
- Publication date Feb 20, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130328183
- Publication date Dec 12, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130228905
- Publication date Sep 5, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
- Publication number 20120306092
- Publication date Dec 6, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Metal for Hybridization and Related Methods
- Publication number 20120273951
- Publication date Nov 1, 2012
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120248631
- Publication date Oct 4, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURI...
- Publication number 20120153461
- Publication date Jun 21, 2012
- PANASONIC CORPORATION
- Hidetoshi Kitaura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID-FREE WAFER BONDING USING CHANNELS
- Publication number 20120153426
- Publication date Jun 21, 2012
- Tessera Research LLC
- Vage Oganesian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PL...
- Publication number 20120139124
- Publication date Jun 7, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
- Publication number 20120119367
- Publication date May 17, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120012994
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with a passivation layer and method for produc...

Direct filter hybridization for an optical sensor and filter assembly

Spot-solderable leads for semiconductor device packages

Semiconductor device with a passivation layer and method for produc...

Solution deposited magnetically guided chiplet displacement

Spot-solderable leads for semiconductor device packages

Method for applying a bonding layer

UBM (under bump metal) electrode structure for radiation detector,...

Semiconductor device

Silicon package for embedded electronic system having stacked semic...

Method for manufacturing semiconductor device, heat insulating load...

Via structures for thermal dissipation

Flipped die stack

Method for applying a bonding layer

Method for manufacturing a semiconductor device, and semiconductor...

Stacked microelectronic assembly with TSVs formed in stages with pl...

Method for manufacturing a semiconductor device, and semiconductor...

Stacked microelectronic assembly with TSVS formed in stages with pl...

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Conductive pads defined by embedded traces

Void-free wafer bonding using channels

Stacked microelectronic assembly with TSVs formed in stages with pl...

Method for manufacturing semiconductor devices having a glass subst...

Conductive pads defined by embedded traces

Method for manufacturing semiconductor devices having a glass subst...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Spot-Solderable Leads for Semiconductor Device Packages

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

UBM (UNDER BUMP METAL) ELECTRODE STRUCTURE FOR RADIATION DETECTOR,...

METHOD FOR APPLYING A BONDING LAYER

STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS

STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PL...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

Contact Metal for Hybridization and Related Methods

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURI...

VOID-FREE WAFER BONDING USING CHANNELS

STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PL...

CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...