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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2924/15183
in a single layer of the multilayer substrate
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor packages with pass-through clock traces and associate...
Patent number
11,855,048
Issue date
Dec 26, 2023
Thomas H. Kinsley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method for semiconductor package with cantilever pads
Patent number
11,270,894
Issue date
Mar 8, 2022
STMicroelectronics, Inc.
Jefferson Talledo
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device including two or more chips mounted over wirin...
Patent number
11,069,655
Issue date
Jul 20, 2021
Micron Technology, Inc.
Sensho Usami
G11 - INFORMATION STORAGE
Information
Patent Grant
Molding compound including a carbon nano-tube dispersion
Patent number
10,953,593
Issue date
Mar 23, 2021
Micron Technology, Inc.
Myung Jin Yim
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Sensor system and cover device for a sensor system
Patent number
10,775,407
Issue date
Sep 15, 2020
Robert Bosch GmbH
Ricardo Ehrenpfordt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
10,192,851
Issue date
Jan 29, 2019
Renesas Electronics Corporation
Yoshinori Miyaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
10,083,924
Issue date
Sep 25, 2018
Renesas Electronics Corporation
Kazuyoshi Maekawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,068,823
Issue date
Sep 4, 2018
Rohm Co., Ltd.
Hiroshi Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
10,032,745
Issue date
Jul 24, 2018
Renesas Electronics Corporation
Yoshinori Miyaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,991,195
Issue date
Jun 5, 2018
Renesas Electronics Corporation
Hiromitsu Takeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming a carbon nano-tube dispersion
Patent number
9,950,464
Issue date
Apr 24, 2018
Micron Technology, Inc.
Myung Jin Yim
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Molded leadframe substrate semiconductor package
Patent number
9,899,208
Issue date
Feb 20, 2018
UTAC Thai Limited
Somchai Nondhasitthichai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with cantilever pads
Patent number
9,899,236
Issue date
Feb 20, 2018
STMicroelectronics, Inc.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including two or more chips mounted over wirin...
Patent number
9,837,377
Issue date
Dec 5, 2017
Micron Technology, Inc.
Sensho Usami
G11 - INFORMATION STORAGE
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
9,805,980
Issue date
Oct 31, 2017
Renesas Electronics Corporation
Tadashi Munakata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip cavity package
Patent number
9,761,435
Issue date
Sep 12, 2017
UTAC Thai Limited
Saravuth Sirinorakul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded leadframe substrate semiconductor package
Patent number
9,711,343
Issue date
Jul 18, 2017
UTAC THAI LIMITED
Somchai Nondhasitthichai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
External storage device and method of manufacturing external storag...
Patent number
9,666,659
Issue date
May 30, 2017
Renesas Electronics Corporation
Yasutaka Nakashiba
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor device
Patent number
9,589,882
Issue date
Mar 7, 2017
Renesas Electronics Corporation
Hiromitsu Takeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,508,672
Issue date
Nov 29, 2016
Rohm Co., Ltd.
Hiroshi Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device package
Patent number
9,437,791
Issue date
Sep 6, 2016
LG Innotek Co., Ltd
Byung Mok Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing leadless integrated circuit packages having...
Patent number
9,337,095
Issue date
May 10, 2016
Kaixin, Inc.
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit device
Patent number
9,230,946
Issue date
Jan 5, 2016
Renesas Electronics Corporation
Yoshihiro Masumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,196,601
Issue date
Nov 24, 2015
Amkor Technology, Inc.
Doo Hyun Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with printed circuit layer
Patent number
9,111,845
Issue date
Aug 18, 2015
Texas Instruments Incorporated
Matthew David Romig
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with conductive vias
Patent number
8,937,387
Issue date
Jan 20, 2015
Advanced Semiconductor Engineering, Inc.
Che-Hau Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming cavity in PCB containing...
Patent number
8,895,358
Issue date
Nov 25, 2014
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package structure
Patent number
8,749,043
Issue date
Jun 10, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package
Patent number
8,692,133
Issue date
Apr 8, 2014
Samsung Electronics Co., Ltd.
Yeoung-Jun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame land grid array with routing connector trace under unit
Patent number
8,685,794
Issue date
Apr 1, 2014
UTAC Thai Limited
Somchai Nondhasitthichai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20180323168
Publication date
Nov 8, 2018
RENESAS ELECTRONICS CORPORATION
Yoshinori Miyaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION
Publication number
20180229421
Publication date
Aug 16, 2018
Micron Technology, Inc.
Myung Jin Yim
B82 - NANO-TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS
Publication number
20180144952
Publication date
May 24, 2018
STMICROELECTRONICS, INC.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE CHIPS MOUNTED OVER WIRIN...
Publication number
20180076173
Publication date
Mar 15, 2018
Micron Technology, Inc.
Sensho Usami
G11 - INFORMATION STORAGE
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
Publication number
20140361402
Publication date
Dec 11, 2014
Matthew David Romig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
Publication number
20140264812
Publication date
Sep 18, 2014
MEDIATEK INC.
Sheng-Ming CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package on Package Structure
Publication number
20140246785
Publication date
Sep 4, 2014
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR SYSTEM AND COVER DEVICE FOR A SENSOR SYSTEM
Publication number
20140184263
Publication date
Jul 3, 2014
ROBERT BOSCH GmbH
Ricardo Ehrenpfordt
G01 - MEASURING TESTING
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
Publication number
20140175599
Publication date
Jun 26, 2014
TEXAS INSTRUMENTS INCORPORATED
Matthew David Romig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20140167292
Publication date
Jun 19, 2014
RENESAS ELECTRONICS CORPORATION
Yoshihiro MASUMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DEVICE PACKAGE
Publication number
20140167095
Publication date
Jun 19, 2014
LG Innotek Co., Ltd.
Byung Mok KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROCESS
Publication number
20140124919
Publication date
May 8, 2014
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Che-Hau Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
Publication number
20130337609
Publication date
Dec 19, 2013
UTAC Thai Limited
Somchai Nondhasitthichai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING LEADLESS INTEGRATED CIRCUIT PACKAGES HAVING...
Publication number
20130288432
Publication date
Oct 31, 2013
Kaixin, Inc.
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20130260551
Publication date
Oct 3, 2013
Samsung Electronics Co., Ltd.
Un-Byoung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package on Package Structure
Publication number
20130228932
Publication date
Sep 5, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20130147042
Publication date
Jun 13, 2013
Elpida Memory, Inc.
Yukitoshi HIROSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20130113096
Publication date
May 9, 2013
Rohm Co., Ltd.
Hiroshi Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, INTERPOSER, SEMICONDUC...
Publication number
20120299193
Publication date
Nov 29, 2012
RENESAS ELECTRONICS CORPORATION
Koujirou Shibuya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Publication number
20120208322
Publication date
Aug 16, 2012
Renesas Electronics Corporation
MIKAKO OKADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20120184068
Publication date
Jul 19, 2012
Renesas Electronics Corporation
Yoshiyuki ABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...
Publication number
20120178214
Publication date
Jul 12, 2012
ATMEL CORPORATION
Ken LAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming the Same
Publication number
20120153498
Publication date
Jun 21, 2012
Un-Byoung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20120061847
Publication date
Mar 15, 2012
FUJITSU SEMICONDUCTOR LIMITED
Hirohisa Matsuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT AND DEVICE PROVIDED WITH HEAT DISSIPATION M...
Publication number
20120061849
Publication date
Mar 15, 2012
STMicroelectronics (Grenoble 2) SAS
Romain Coffy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacturing Leadless Integrated Circuit Packages Having...
Publication number
20120045870
Publication date
Feb 23, 2012
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...
Publication number
20120025375
Publication date
Feb 2, 2012
ATMEL CORPORATION
Ken LAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE MOLDED CHIP SCALE PACKAGE
Publication number
20120001322
Publication date
Jan 5, 2012
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
Publication number
20110201160
Publication date
Aug 18, 2011
Hynix Semiconductor Inc.
Ki Il MOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device, semiconductor package, interposer, semiconduc...
Publication number
20110198760
Publication date
Aug 18, 2011
Renesas Electronics Corporation
Koujirou Shibuya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR