in a single layer of the multilayer substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15183in a single layer of the multilayer substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor package with cantilever pads
- Patent number 11,270,894
- Issue date Mar 8, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device including two or more chips mounted over wirin...
- Patent number 11,069,655
- Issue date Jul 20, 2021
- Micron Technology, Inc.
- Sensho Usami
- G11 - INFORMATION STORAGE
Information Patent Grant
Molding compound including a carbon nano-tube dispersion
- Patent number 10,953,593
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Myung Jin Yim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Sensor system and cover device for a sensor system
- Patent number 10,775,407
- Issue date Sep 15, 2020
- Robert Bosch GmbH
- Ricardo Ehrenpfordt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,192,851
- Issue date Jan 29, 2019
- Renesas Electronics Corporation
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,083,924
- Issue date Sep 25, 2018
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,068,823
- Issue date Sep 4, 2018
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,032,745
- Issue date Jul 24, 2018
- Renesas Electronics Corporation
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,991,195
- Issue date Jun 5, 2018
- Renesas Electronics Corporation
- Hiromitsu Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a carbon nano-tube dispersion
- Patent number 9,950,464
- Issue date Apr 24, 2018
- Micron Technology, Inc.
- Myung Jin Yim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,899,208
- Issue date Feb 20, 2018
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with cantilever pads
- Patent number 9,899,236
- Issue date Feb 20, 2018
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including two or more chips mounted over wirin...
- Patent number 9,837,377
- Issue date Dec 5, 2017
- Micron Technology, Inc.
- Sensho Usami
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,805,980
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tadashi Munakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip cavity package
- Patent number 9,761,435
- Issue date Sep 12, 2017
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,711,343
- Issue date Jul 18, 2017
- UTAC THAI LIMITED
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External storage device and method of manufacturing external storag...
- Patent number 9,666,659
- Issue date May 30, 2017
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 9,589,882
- Issue date Mar 7, 2017
- Renesas Electronics Corporation
- Hiromitsu Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,508,672
- Issue date Nov 29, 2016
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 9,437,791
- Issue date Sep 6, 2016
- LG Innotek Co., Ltd
- Byung Mok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing leadless integrated circuit packages having...
- Patent number 9,337,095
- Issue date May 10, 2016
- Kaixin, Inc.
- Tung Lok Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,230,946
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Yoshihiro Masumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,196,601
- Issue date Nov 24, 2015
- Amkor Technology, Inc.
- Doo Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with printed circuit layer
- Patent number 9,111,845
- Issue date Aug 18, 2015
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with conductive vias
- Patent number 8,937,387
- Issue date Jan 20, 2015
- Advanced Semiconductor Engineering, Inc.
- Che-Hau Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming cavity in PCB containing...
- Patent number 8,895,358
- Issue date Nov 25, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 8,749,043
- Issue date Jun 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 8,692,133
- Issue date Apr 8, 2014
- Samsung Electronics Co., Ltd.
- Yeoung-Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame land grid array with routing connector trace under unit
- Patent number 8,685,794
- Issue date Apr 1, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180323168
- Publication date Nov 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION
- Publication number 20180229421
- Publication date Aug 16, 2018
- Micron Technology, Inc.
- Myung Jin Yim
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS
- Publication number 20180144952
- Publication date May 24, 2018
- STMICROELECTRONICS, INC.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE CHIPS MOUNTED OVER WIRIN...
- Publication number 20180076173
- Publication date Mar 15, 2018
- Micron Technology, Inc.
- Sensho Usami
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
- Publication number 20140361402
- Publication date Dec 11, 2014
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20140264812
- Publication date Sep 18, 2014
- MEDIATEK INC.
- Sheng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Structure
- Publication number 20140246785
- Publication date Sep 4, 2014
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SYSTEM AND COVER DEVICE FOR A SENSOR SYSTEM
- Publication number 20140184263
- Publication date Jul 3, 2014
- ROBERT BOSCH GmbH
- Ricardo Ehrenpfordt
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
- Publication number 20140175599
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20140167292
- Publication date Jun 19, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro MASUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20140167095
- Publication date Jun 19, 2014
- LG Innotek Co., Ltd.
- Byung Mok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROCESS
- Publication number 20140124919
- Publication date May 8, 2014
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Che-Hau Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
- Publication number 20130337609
- Publication date Dec 19, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LEADLESS INTEGRATED CIRCUIT PACKAGES HAVING...
- Publication number 20130288432
- Publication date Oct 31, 2013
- Kaixin, Inc.
- Tung Lok Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20130260551
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Structure
- Publication number 20130228932
- Publication date Sep 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130147042
- Publication date Jun 13, 2013
- Elpida Memory, Inc.
- Yukitoshi HIROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130113096
- Publication date May 9, 2013
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, INTERPOSER, SEMICONDUC...
- Publication number 20120299193
- Publication date Nov 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Koujirou Shibuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20120208322
- Publication date Aug 16, 2012
- Renesas Electronics Corporation
- MIKAKO OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120184068
- Publication date Jul 19, 2012
- Renesas Electronics Corporation
- Yoshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...
- Publication number 20120178214
- Publication date Jul 12, 2012
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20120153498
- Publication date Jun 21, 2012
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120061847
- Publication date Mar 15, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND DEVICE PROVIDED WITH HEAT DISSIPATION M...
- Publication number 20120061849
- Publication date Mar 15, 2012
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Leadless Integrated Circuit Packages Having...
- Publication number 20120045870
- Publication date Feb 23, 2012
- Tung Lok Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...
- Publication number 20120025375
- Publication date Feb 2, 2012
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE MOLDED CHIP SCALE PACKAGE
- Publication number 20120001322
- Publication date Jan 5, 2012
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20110201160
- Publication date Aug 18, 2011
- Hynix Semiconductor Inc.
- Ki Il MOON
- H01 - BASIC ELECTRIC ELEMENTS

in a single layer of the multilayer substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with pass-through clock traces and associate...

Manufacturing method for semiconductor package with cantilever pads

Semiconductor device including two or more chips mounted over wirin...

Molding compound including a carbon nano-tube dispersion

Sensor system and cover device for a sensor system

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Forming a carbon nano-tube dispersion

Molded leadframe substrate semiconductor package

Semiconductor package with cantilever pads

Semiconductor device including two or more chips mounted over wirin...

Method of manufacturing a semiconductor device

Flip chip cavity package

Molded leadframe substrate semiconductor package

External storage device and method of manufacturing external storag...

Semiconductor device

Semiconductor device

Light emitting device package

Method of manufacturing leadless integrated circuit packages having...

Semiconductor integrated circuit device

Semiconductor device

Integrated circuit package with printed circuit layer

Semiconductor device with conductive vias

Semiconductor device and method of forming cavity in PCB containing...

Package on package structure

Semiconductor package

Lead frame land grid array with routing connector trace under unit

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION

SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS

SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE CHIPS MOUNTED OVER WIRIN...

INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER

SEMICONDUCTOR PACKAGE ASSEMBLY

Package on Package Structure

SENSOR SYSTEM AND COVER DEVICE FOR A SENSOR SYSTEM

INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

LIGHT EMITTING DEVICE PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROCESS

LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT

METHOD OF MANUFACTURING LEADLESS INTEGRATED CIRCUIT PACKAGES HAVING...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Package on Package Structure

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, INTERPOSER, SEMICONDUC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...

Semiconductor Device and Method of Forming the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR COMPONENT AND DEVICE PROVIDED WITH HEAT DISSIPATION M...

Method of Manufacturing Leadless Integrated Circuit Packages Having...

ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...

DOUBLE MOLDED CHIP SCALE PACKAGE

METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...