in different layers of the multilayer substrate

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H01L2924/15184

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15184in different layers of the multilayer substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and equipment
- Patent number 11,798,855
- Issue date Oct 24, 2023
- Canon Kabushiki Kaisha
- Yu Katase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 11,502,392
- Issue date Nov 15, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna feeder package structure and packaging method
- Patent number 11,437,707
- Issue date Sep 6, 2022
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 11,239,128
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray system, semiconductor package, and tray having X-ray absorpti...
- Patent number 11,217,495
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- G01 - MEASURING TESTING
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,101,262
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 11,011,423
- Issue date May 18, 2021
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-access memory system and a method to manufacture the system
- Patent number 10,896,890
- Issue date Jan 19, 2021
- Altera Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 10,886,594
- Issue date Jan 5, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CTE compensation for wafer-level and chip-scale packages and assemb...
- Patent number 10,847,469
- Issue date Nov 24, 2020
- Cubic Corporation
- Kenneth J. Vanhille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switch having stack of non-uniform elements
- Patent number 10,840,233
- Issue date Nov 17, 2020
- Skyworks Solutions, Inc.
- Yu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna feeder package structure and packaging method
- Patent number 10,777,876
- Issue date Sep 15, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,727,206
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,714,415
- Issue date Jul 14, 2020
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,692,827
- Issue date Jun 23, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,665,557
- Issue date May 26, 2020
- Samsung Electronics Co., Ltd.
- Jung-Hoon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 10,615,154
- Issue date Apr 7, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 10,504,881
- Issue date Dec 10, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to a semiconductor structure with gallium arsenide...
- Patent number 10,439,051
- Issue date Oct 8, 2019
- Skyworks Solutions, Inc.
- Cristian Cismaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,431,513
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,283,444
- Issue date May 7, 2019
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack device having voltage compensation
- Patent number 10,229,902
- Issue date Mar 12, 2019
- Skyworks Solutions, Inc.
- Yu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of radio-frequency devices with amplifier voltage limit...
- Patent number 10,211,197
- Issue date Feb 19, 2019
- Skyworks Solutions, Inc.
- Anthony Francis Quaglietta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,163,826
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234279
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153856
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136266
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128176
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- SEOK GEUN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063103
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY
- Publication number 20240047328
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Jinduck Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPRISING REDISTRIBUTION STRUCTURE, AND METHOD FOR M...
- Publication number 20230128862
- Publication date Apr 27, 2023
- NEPES CO., LTD.
- Yong Tae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20210384185
- Publication date Dec 9, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20210233815
- Publication date Jul 29, 2021
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM
- Publication number 20210104486
- Publication date Apr 8, 2021
- Altera Corporation
- Hui LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Packaging Method for Antenna
- Publication number 20210083362
- Publication date Mar 18, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Feeder Package Structure and Packaging Method
- Publication number 20200411948
- Publication date Dec 31, 2020
- SJ Semiconductor(Jiangyin) Corporation
- Jangshen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...
- Publication number 20200402864
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- SANG-YOUNG KIM
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20200243493
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20200105737
- Publication date Apr 2, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20190371693
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure And Packaging Method For Antenna
- Publication number 20190288370
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCH HAVING STACK OF NON-UNIFORM ELEMENTS
- Publication number 20190273076
- Publication date Sep 5, 2019
- SKYWORKS SOLUTIONS, INC.
- Yu ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES RELATED TO BARRIER FOR METALLIZATION OF GALLIUM BASED SEMIC...
- Publication number 20190123045
- Publication date Apr 25, 2019
- SKYWORKS SOLUTIONS, INC.
- Cristian Cismaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20190081015
- Publication date Mar 14, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND SYSTEM FOR INTEGRATED SENSOR SYSTEM (ISS)
- Publication number 20180265350
- Publication date Sep 20, 2018
- InvenSense, Inc.
- Stephen LLOYD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20180226387
- Publication date Aug 9, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO A SEMICONDUCTOR STRUCTURE WITH GALLIUM ARSENIDE...
- Publication number 20180204934
- Publication date Jul 19, 2018
- SKYWORKS SOLUTIONS, INC.
- Cristian Cismaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20180122654
- Publication date May 3, 2018
- RENESAS ELECTRONICS CORPORATION
- Haruhiko HARADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
STACK DEVICE HAVING VOLTAGE COMPENSATION
- Publication number 20180047715
- Publication date Feb 15, 2018
- SKYWORKS SOLUTIONS, INC.
- Yu ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF RADIO-FREQUENCY DEVICES WITH AMPLIFIER VOLTAGE LIMIT...
- Publication number 20170373052
- Publication date Dec 28, 2017
- SKYWORKS SOLUTIONS, INC.
- Anthony Francis QUAGLIETTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20170301598
- Publication date Oct 19, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS

in different layers of the multilayer substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

Semiconductor device and method of making a wafer-level chip-scale...

Stacked semiconductor die assemblies with support members and assoc...

Electronic module and equipment

Memory devices with controllers under memory packages and associate...

Packaging structure and packaging method for antenna

Semiconductor device assembly with through-package interconnect and...

Antenna feeder package structure and packaging method

Microelectronic devices, stacked microelectronic devices, and metho...

X-ray system, semiconductor package, and tray having X-ray absorpti...

Stacked semiconductor die assemblies with support members and assoc...

Semiconductor device and method of using a standardized carrier in...

Multi-access memory system and a method to manufacture the system

Packaging structure and packaging method for antenna

CTE compensation for wafer-level and chip-scale packages and assemb...

Radio-frequency switch having stack of non-uniform elements

Antenna feeder package structure and packaging method

Memory devices with controllers under memory packages and associate...

Semiconductor device and method of manufacturing the same

Packaged microelectronic devices and methods for manufacturing pack...

Semiconductor device

Semiconductor device assembly with through-package interconnect and...

Stacked semiconductor die assemblies with support members and assoc...

Methods related to a semiconductor structure with gallium arsenide...

Microelectronic devices, stacked microelectronic devices, and metho...

Semiconductor device and method of manufacturing the same

Stack device having voltage compensation

Fabrication of radio-frequency devices with amplifier voltage limit...

Microelectronic devices, stacked microelectronic devices, and metho...

Packaged microelectronic devices and methods for manufacturing pack...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY

SEMICONDUCTOR COMPRISING REDISTRIBUTION STRUCTURE, AND METHOD FOR M...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

Semiconductor Device and Method of Using a Standardized Carrier in...

MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM

Packaging Structure and Packaging Method for Antenna

Antenna Feeder Package Structure and Packaging Method

X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

Packaging Structure And Packaging Method For Antenna

RADIO-FREQUENCY SWITCH HAVING STACK OF NON-UNIFORM ELEMENTS

DEVICES RELATED TO BARRIER FOR METALLIZATION OF GALLIUM BASED SEMIC...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

DEVICE AND SYSTEM FOR INTEGRATED SENSOR SYSTEM (ISS)

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

METHODS RELATED TO A SEMICONDUCTOR STRUCTURE WITH GALLIUM ARSENIDE...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

STACK DEVICE HAVING VOLTAGE COMPENSATION

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

FABRICATION OF RADIO-FREQUENCY DEVICES WITH AMPLIFIER VOLTAGE LIMIT...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...