in liquid form

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H01L2224/2741

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2741in liquid form

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electronic component
- Patent number 12,191,278
- Issue date Jan 7, 2025
- CONNECTEC AMERICA, INC.
- Katsunori Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing structure, and structure
- Patent number 11,569,192
- Issue date Jan 31, 2023
- Shinkawa Ltd.
- Yuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process, DAF replacement
- Patent number 11,552,040
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Siqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device, method of manufacturing a multi-chip device, and...
- Patent number 11,488,921
- Issue date Nov 1, 2022
- Infineon Technologies AG
- Ali Roshanghias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for adjusting dimensions of dielectric bond line material...
- Patent number 11,189,590
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making integrated circuit packages
- Patent number 11,152,324
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of device chip
- Patent number 11,024,542
- Issue date Jun 1, 2021
- Disco Corporation
- Heidi Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconfiguration during a coating process or an electric plati...
- Patent number 10,964,580
- Issue date Mar 30, 2021
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,714,457
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,714,444
- Issue date Jul 14, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 10,665,565
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic conductive film
- Patent number 10,553,554
- Issue date Feb 4, 2020
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240321809
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20240145305
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240021563
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES
- Publication number 20230268309
- Publication date Aug 24, 2023
- SUMITOMO CHEMICAL CO., LTD.
- Martin Humphries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...
- Publication number 20230037241
- Publication date Feb 2, 2023
- Kateeva Display Technology (Shaoxing) Limited
- Erdong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220310558
- Publication date Sep 29, 2022
- CONNECTEC AMERICA, INC.
- Katsunori HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATING METHOD
- Publication number 20220310557
- Publication date Sep 29, 2022
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS, DAF REPLACEMENT
- Publication number 20220028819
- Publication date Jan 27, 2022
- Western Digital Technologies, Inc.
- Siqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR ADJUSTING DIMENSIONS OF DIELECTRIC BOND LINE MATERIAL...
- Publication number 20210183806
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20210134674
- Publication date May 6, 2021
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and...
- Publication number 20210098410
- Publication date Apr 1, 2021
- INFINEON TECHNOLOGIES AG
- Ali Roshanghias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20200343224
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200144214
- Publication date May 7, 2020
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE
- Publication number 20200083190
- Publication date Mar 12, 2020
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS

in liquid form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing electronic component

Semiconductor components having conductive vias with aligned back s...

Adhesive bonding composition and method of use

Method for producing structure, and structure

Package process, DAF replacement

Multilayered transient liquid phase bonding

Multi-chip device, method of manufacturing a multi-chip device, and...

Alternative compositions for high temperature soldering applications

Semiconductor packages and methods of forming same

Processes for adjusting dimensions of dielectric bond line material...

Method and apparatus for making integrated circuit packages

Manufacturing method of device chip

Wafer reconfiguration during a coating process or an electric plati...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Contact structures with porous networks for solder connections, and...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Adhesive bonding composition and method of use

Semiconductor packages and methods of forming same

Anisotropic conductive film

Wafer level flat no-lead semiconductor packages and methods of manu...

Engineered polymer-based electronic materials

Package assembly

Low-temperature bonding with spaced nanorods and eutectic alloys

Method for producing a substrate arrangement, substrate arrangement...

Conductive paste and die bonding method

Anisotropic conductive film

Method for manufacturing semiconductor apparatus, method for manufa...

3D packaging method for semiconductor components

Adhesive bonding composition and method of use

Patents Applicationslast 30 patents

Heat Dissipating Structure and Methods of Forming The Same

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

ELECTRONIC DEVICE

SINTERING FILM FRAMES AND RELATED METHODS

OPTICAL SENSOR PACKAGE

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

INTEGRATED CIRCUIT PACKAGE

METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE

THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

METHOD FOR USING A BUFFER SHEET

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

WAFER LAMINATING METHOD

Semiconductor Packages and Methods of Forming Same

PACKAGE PROCESS, DAF REPLACEMENT

PROCESSES FOR ADJUSTING DIMENSIONS OF DIELECTRIC BOND LINE MATERIAL...

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

Semiconductor Packages and Methods of Forming Same

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

ANISOTROPIC CONDUCTIVE FILM

METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE