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H01L2224/0343

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0343in solid form

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D flex-foil package
- Patent number 11,764,122
- Issue date Sep 19, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for hybrid wafer bonding integrated with CMOS processing
- Patent number 10,510,597
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Nan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a wire bonding and a sintered region, and...
- Patent number 10,490,523
- Issue date Nov 26, 2019
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,403,592
- Issue date Sep 3, 2019
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming dummy pillars between se...
- Patent number 10,096,540
- Issue date Oct 9, 2018
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding thin chips in polymer
- Patent number 10,032,709
- Issue date Jul 24, 2018
- MC10, Inc.
- Conor Rafferty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal joining structure using metal nanoparticles and metal joining...
- Patent number 9,960,140
- Issue date May 1, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Kohei Tatsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 9,735,129
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for hybrid wafer bonding integrated with CMOS processing
- Patent number 9,728,453
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Nan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding thin chips in polymer
- Patent number 9,583,428
- Issue date Feb 28, 2017
- MC10, Inc.
- Conor Rafferty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuit
- Patent number 9,536,781
- Issue date Jan 3, 2017
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact
- Patent number 9,490,193
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding thin chips in polymer
- Patent number 9,171,794
- Issue date Oct 27, 2015
- MC10, Inc.
- Conor Rafferty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit and method of making
- Patent number 9,142,472
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device by reducing thickness...
- Patent number 8,815,651
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for fabricating the semiconductor modu...
- Patent number 8,476,776
- Issue date Jul 2, 2013
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device mounting board and semiconductor module
- Patent number 8,314,345
- Issue date Nov 20, 2012
- Sanyo Electric Co., LTD
- Koichi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic bump structure without under bump metallurgy and manufactu...
- Patent number 7,968,446
- Issue date Jun 28, 2011
- Wan-Ling Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,414,390
- Issue date Jul 2, 2002
- Seiko Epson Corporation
- Kazuhiko Nozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,181,010
- Issue date Jan 30, 2001
- Seiko Epson Corporation
- Kazuhiko Nozawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20230411317
- Publication date Dec 21, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF...
- Publication number 20210257322
- Publication date Aug 19, 2021
- ACTRON TECHNOLOGY CORPORATION
- I-Dar Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FLEX-FOIL PACKAGE
- Publication number 20200279787
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20190348387
- Publication date Nov 14, 2019
- UTAC Headquarters Pte. Ltd.
- Yongbo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING
- Publication number 20170372998
- Publication date Dec 28, 2017
- Yenhao Benjamin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Hybrid Wafer Bonding Integrated with CMOS Processing
- Publication number 20170338150
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Nan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Hybrid Wafer Bonding Integrated with CMOS Processing
- Publication number 20140273347
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Nan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...
- Publication number 20140230989
- Publication date Aug 21, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING THIN CHIPS IN POLYMER
- Publication number 20140110859
- Publication date Apr 24, 2014
- MC10, Inc.
- Conor RAFFERTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20130168870
- Publication date Jul 4, 2013
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130140685
- Publication date Jun 6, 2013
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075890
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075928
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009300
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Dummy Pillars Between Se...
- Publication number 20120286418
- Publication date Nov 15, 2012
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGE CONNECTION SCHEME
- Publication number 20120211884
- Publication date Aug 23, 2012
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR FABRICATING THE SEMICONDUCTOR MODU...
- Publication number 20110193222
- Publication date Aug 11, 2011
- Ryosuke Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFAC...
- Publication number 20110086505
- Publication date Apr 14, 2011
- Wan-Ling Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Bump Structure Without Under Bump Metallurgy And a Manufac...
- Publication number 20100320560
- Publication date Dec 23, 2010
- Wan-Ling Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICO...
- Publication number 20100140797
- Publication date Jun 10, 2010
- Yasuyuki YANASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE
- Publication number 20100132992
- Publication date Jun 3, 2010
- Koichi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Bump Structure Without Under Bump Metallurgy And Manufactu...
- Publication number 20100084763
- Publication date Apr 8, 2010
- Wan-Ling Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20010000080
- Publication date Mar 29, 2001
- Kazuhiko Nozawa
- H01 - BASIC ELECTRIC ELEMENTS

in solid form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with multi-layer contact and system

3D flex-foil package

Methods for hybrid wafer bonding integrated with CMOS processing

Semiconductor device with a wire bonding and a sintered region, and...

Method for producing electronic device with multi-layer contact

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and method of forming dummy pillars between se...

Embedding thin chips in polymer

Metal joining structure using metal nanoparticles and metal joining...

Electronic devices with semiconductor die attached with sintered me...

Method for creating a connection between metallic moulded bodies an...

Semiconductor packages and methods of forming the same

Methods for hybrid wafer bonding integrated with CMOS processing

Electronic devices with semiconductor die coupled to a thermally co...

Embedding thin chips in polymer

Method of making integrated circuit

Electronic device with multi-layer contact

Embedding thin chips in polymer

Integrated circuit and method of making

Power semiconductor devices

Method for manufacturing an electronic device by reducing thickness...

Semiconductor module, method for fabricating the semiconductor modu...

Device mounting board and semiconductor module

Metallic bump structure without under bump metallurgy and manufactu...

Semiconductor device and method of manufacturing the same, circuit...

Semiconductor device and method of manufacturing the same, circuit...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

CHIP PACKAGE

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF...

3D FLEX-FOIL PACKAGE

Electronic Device with Multi-Layer Contact and System

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Method for Producing Electronic Device With Multi-Layer Contact

SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING

Methods for Hybrid Wafer Bonding Integrated with CMOS Processing

Methods for Hybrid Wafer Bonding Integrated with CMOS Processing

METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...

POWER SEMICONDUCTOR DEVICES

EMBEDDING THIN CHIPS IN POLYMER

DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

Electronic Device and a Method for Fabricating an Electronic Device

INTEGRATED CIRCUIT AND METHOD OF MAKING

INTEGRATED CIRCUIT AND METHOD OF MAKING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor Device and Method of Forming Dummy Pillars Between Se...

WAFER CHIP SCALE PACKAGE CONNECTION SCHEME

SEMICONDUCTOR MODULE, METHOD FOR FABRICATING THE SEMICONDUCTOR MODU...

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFAC...

Metallic Bump Structure Without Under Bump Metallurgy And a Manufac...

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICO...

DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE

Metallic Bump Structure Without Under Bump Metallurgy And Manufactu...

Semiconductor device and method of manufacturing the same, circuit...