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H01L2224/29012

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29012in top view

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability semiconductor devices and methods of fabricating t...
- Patent number 11,488,923
- Issue date Nov 1, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for measuring physical characteristics of semic...
- Patent number 10,352,877
- Issue date Jul 16, 2019
- Kulicke and Soffa Industries, Inc.
- Deepak Sood
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
- Patent number 10,332,858
- Issue date Jun 25, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for bonding substrates
- Patent number 10,131,126
- Issue date Nov 20, 2018
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flip chip interconnection with reduced current density
- Patent number 10,090,274
- Issue date Oct 2, 2018
- Efficient Power Conversion Corporation
- Robert Strittmatter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for measuring physical characteristics of semic...
- Patent number 9,810,641
- Issue date Nov 7, 2017
- Kulicke and Soffa Industries, Inc.
- Deepak Sood
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing thermal interface sheet
- Patent number 9,704,775
- Issue date Jul 11, 2017
- Fujitsu Limited
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for a wafer seal ring
- Patent number 9,673,169
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 9,653,424
- Issue date May 16, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
- Patent number 9,653,312
- Issue date May 16, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 9,627,231
- Issue date Apr 18, 2017
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,620,390
- Issue date Apr 11, 2017
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
- Publication number 20240387436
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL-LEVEL PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240332240
- Publication date Oct 3, 2024
- JIANGSU PANGU SEMICONDUCTOR TECHNOLOGY CO., LTD
- Zhiyi XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240170360
- Publication date May 23, 2024
- MEDIATEK INC.
- Chun-Yin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20230019230
- Publication date Jan 19, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220384379
- Publication date Dec 1, 2022
- Sony Semiconductor Solutions Corporation
- TAKESHI YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR
- Publication number 20220375915
- Publication date Nov 24, 2022
- LG ELECTRONICS INC.
- Dohan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20200373270
- Publication date Nov 26, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20180233440
- Publication date Aug 16, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MEASURING PHYSICAL CHARACTERISTICS OF SEMIC...
- Publication number 20180038806
- Publication date Feb 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Deepak Sood
- G01 - MEASURING TESTING
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGE STRUCTURE
- Publication number 20170098589
- Publication date Apr 6, 2017
- MEDIATEK INC.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THERMAL INTERFACE SHEET
- Publication number 20170047269
- Publication date Feb 16, 2017
- Fujitsu Limited
- Naoaki Nakamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CHIP STACK STRUCTURE USING CONDUCTIVE FILM BRIDGE ADHESIVE TECHNOLOGY
- Publication number 20150187735
- Publication date Jul 2, 2015
- LINGSEN PRECISION INDUSTRIES, LTD.
- Chien-Ko LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140306338
- Publication date Oct 16, 2014
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for a Wafer Seal Ring
- Publication number 20140220735
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20140193658
- Publication date Jul 10, 2014
- Indium Corporation
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS

in top view

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Display panel, preparation method thereof, and display device

Seal ring structures and methods of forming same

Electroconductive film, roll, connected structure, and process for...

Semiconductor device and method for manufacturing the same

High reliability semiconductor devices and methods of fabricating t...

Seal ring structures and methods of forming same

Method and apparatus for creating a bond between objects based on f...

Seal ring structures and methods of forming same

Seal ring structures and methods of forming same

3D packaging method for semiconductor components

Systems and methods for measuring physical characteristics of semic...

Electronic sandwich structure with two parts joined together by mea...

Chip mounting structure

Methods for bonding substrates

Flip chip interconnection with reduced current density

Method for coating conductive substrate with adhesive

Chip mounting structure

Method for producing structured sintered connection layers, and sem...

Electronic devices with semiconductor die attached with sintered me...

Systems and methods for measuring physical characteristics of semic...

Method for manufacturing thermal interface sheet

Method and apparatus for a wafer seal ring

Semiconductor package with adhesive material pre-printed on the lea...

Sealing structure for a bonded wafer and method of forming the seal...

Methods for bonding substrates

Method of making a semiconductor device having a functional capping

Electronic component mounting method

Electrode connection structure and electrode connection method

Electronic devices with semiconductor die coupled to a thermally co...

Patents Applicationslast 30 patents

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

HERMETIC PACKAGE DEVICE, AND DEVICE MODULE

PANEL-LEVEL PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

SEMICONDUCTOR DEVICE

DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

CHIP MOUNTING STRUCTURE

SYSTEMS AND METHODS FOR MEASURING PHYSICAL CHARACTERISTICS OF SEMIC...

FAN-OUT WAFER LEVEL PACKAGE STRUCTURE

METHOD FOR MANUFACTURING THERMAL INTERFACE SHEET

CHIP STACK STRUCTURE USING CONDUCTIVE FILM BRIDGE ADHESIVE TECHNOLOGY

DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME

Method for Producing Structured Sintered Connection Layers, and Sem...

Method and Apparatus for a Wafer Seal Ring

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS