including integrated passive components

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CPC
H01L2924/19011

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/19011including integrated passive components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 12,159,853
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic surface mount passive component
- Patent number 12,142,402
- Issue date Nov 12, 2024
- SanDisk Technologies, Inc.
- Ai-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with near-die integrated passive device
- Patent number 12,136,613
- Issue date Nov 5, 2024
- Xilinx, Inc.
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having a lead frame and a passive c...
- Patent number 12,033,923
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 11,955,395
- Issue date Apr 9, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric stackup structure for SoC package substrates
- Patent number 11,862,597
- Issue date Jan 2, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,469
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,756,871
- Issue date Sep 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 11,742,273
- Issue date Aug 29, 2023
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device and fabrication method using a last throu...
- Patent number 11,735,497
- Issue date Aug 22, 2023
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly having a conductive electromagnetic...
- Patent number 11,728,292
- Issue date Aug 15, 2023
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 11,688,762
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,664,323
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallization structure and redistribution layer design...
- Patent number 11,631,658
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 11,594,494
- Issue date Feb 28, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 11,587,900
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture with tunable magnetic properties for embedded...
- Patent number 11,574,993
- Issue date Feb 7, 2023
- Intel Corporation
- Rengarajan Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379646
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP IN INTEGRATED DEVICE PACKAGE FOR GROUNDING AND ELECTROMA...
- Publication number 20240347474
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...
- Publication number 20240312890
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240312922
- Publication date Sep 19, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240297120
- Publication date Sep 5, 2024
- MEDIATEK INC.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...
- Publication number 20240258363
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234329
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20240213220
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Yeunhee HUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS
- Publication number 20240203911
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240194611
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED PASSIVE DEVICE
- Publication number 20240194413
- Publication date Jun 13, 2024
- Wolfspeed, Inc.
- Jeremy FISHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
- Publication number 20240194552
- Publication date Jun 13, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...
- Publication number 20240178086
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
- Publication number 20240162182
- Publication date May 16, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20240096792
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240063078
- Publication date Feb 22, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
- Publication number 20240038753
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END MODULE WITH VERTICALLY STACKED DIE AND CIRCULATOR
- Publication number 20230387042
- Publication date Nov 30, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Warpage High Density Trench Capacitor
- Publication number 20230361166
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230352411
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Yunseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230282557
- Publication date Sep 7, 2023
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR
- Publication number 20230268306
- Publication date Aug 24, 2023
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230260977
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Hsiao-Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE
- Publication number 20230253380
- Publication date Aug 10, 2023
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
- Publication number 20230253384
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS

including integrated passive components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages and methods of forming same

Package structure including IPD and method of forming the same

Monolithic surface mount passive component

Integrated fan-out package and the methods of manufacturing

Through electrode substrate and semiconductor device

Chip package with near-die integrated passive device

Multi-die fine grain integrated voltage regulation

Bonded structures with integrated passive component

Package structure and method of forming the same

Semiconductor package structure having a lead frame and a passive c...

Package structure with improved antenna patterns performance

Integrated high voltage capacitor

Fan out package with integrated peripheral devices and methods

Advanced info POP and method of forming thereof

Semiconductor package and method

Semiconductor device encapsulated by molding material attached to r...

Asymmetric stackup structure for SoC package substrates

Package structure and method of manufacturing the same

Semiconductor device with discrete blocks

Fan-out packaging structure and method

Through electrode substrate and semiconductor device

Integrated passive device and fabrication method using a last throu...

Semiconductor package assembly having a conductive electromagnetic...

Low warpage high density trench capacitor

Semiconductor package and method

Under-bump-metallization structure and redistribution layer design...

Bonded structures with integrated passive component

High density interconnection using fanout interposer chiplet

Package structure including IPD and method of forming the same

Package architecture with tunable magnetic properties for embedded...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

METAL CLIP IN INTEGRATED DEVICE PACKAGE FOR GROUNDING AND ELECTROMA...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE STRUCTURE

INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...

METHOD OF FORMING PACKAGE STRUCTURE

METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING

INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS

SEMICONDUCTOR PACKAGE AND METHOD

STACKED INTEGRATED PASSIVE DEVICE

FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS

PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...

Asymmetric Stackup Structure for SoC Package Substrates

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

DOHERTY AMPLIFIERS

SEMICONDUCTOR PACKAGE STRUCTURE

DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...

FRONT-END MODULE WITH VERTICALLY STACKED DIE AND CIRCULATOR

Low Warpage High Density Trench Capacitor

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR

SEMICONDUCTOR PACKAGES

CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE

UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...