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H01L2924/19011
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Current Industry
H01L2924/19011
including integrated passive components
Industries
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Patents Grants
last 30 patents
Information
Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated high voltage capacitor
Patent number
11,967,610
Issue date
Apr 23, 2024
Semtech Corporation
Christopher David Ainsworth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan out package with integrated peripheral devices and methods
Patent number
11,955,395
Issue date
Apr 9, 2024
Intel Corporation
Lizabeth Keser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advanced info POP and method of forming thereof
Patent number
11,955,460
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Da Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,942,435
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,887,952
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Asymmetric stackup structure for SoC package substrates
Patent number
11,862,597
Issue date
Jan 2, 2024
Apple Inc.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,862,469
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Feng-Cheng Hsu
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Semiconductor device with discrete blocks
Patent number
11,855,045
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out packaging structure and method
Patent number
11,756,871
Issue date
Sep 12, 2023
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through electrode substrate and semiconductor device
Patent number
11,742,273
Issue date
Aug 29, 2023
Dai Nippon Printing Co., Ltd.
Takamasa Takano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated passive device and fabrication method using a last throu...
Patent number
11,735,497
Issue date
Aug 22, 2023
Semiconductor Components Industries, LLC
Takashi Noma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package assembly having a conductive electromagnetic...
Patent number
11,728,292
Issue date
Aug 15, 2023
Mediatek Inc.
Tzu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low warpage high density trench capacitor
Patent number
11,688,762
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jyun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,664,323
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under-bump-metallization structure and redistribution layer design...
Patent number
11,631,658
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structures with integrated passive component
Patent number
11,626,363
Issue date
Apr 11, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
11,594,494
Issue date
Feb 28, 2023
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including IPD and method of forming the same
Patent number
11,587,900
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hua-Wei Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package architecture with tunable magnetic properties for embedded...
Patent number
11,574,993
Issue date
Feb 7, 2023
Intel Corporation
Rengarajan Shanmugam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully symmetrical laterally coupled transformer for signal and powe...
Patent number
11,569,340
Issue date
Jan 31, 2023
Analog Devices, Inc.
Ruida Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing thereof
Patent number
11,569,176
Issue date
Jan 31, 2023
Amkor Technology Singapore Holding Pte Ltd.
Yi Seul Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out stacked package with fan-out redistribution laye...
Patent number
11,538,788
Issue date
Dec 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and the methods of manufacturing
Patent number
11,532,594
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,508,696
Issue date
Nov 22, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Weiming Chris Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of a semiconductor package
Patent number
11,495,507
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF amplifiers with series-coupled output bondwire arrays and shunt...
Patent number
11,476,209
Issue date
Oct 18, 2022
NXP B.V.
Vikas Shilimkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transistor die with output bondpad at the input side of the die, an...
Patent number
11,444,044
Issue date
Sep 13, 2022
NXP USA, INC.
Ibrahim Khalil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having front end under embedded radio fr...
Patent number
11,424,195
Issue date
Aug 23, 2022
Intel Corporation
Eliav Shaul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,417,620
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
Publication number
20240162182
Publication date
May 16, 2024
Apple Inc.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
Publication number
20240096792
Publication date
Mar 21, 2024
Murata Manufacturing Co., Ltd.
Satoshi GOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20240087903
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOHERTY AMPLIFIERS
Publication number
20240063756
Publication date
Feb 22, 2024
NXP USA, Inc.
Qi Hua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240063078
Publication date
Feb 22, 2024
MEDIATEK INC.
Che-Hung KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
Publication number
20240038753
Publication date
Feb 1, 2024
QUALCOMM Incorporated
Aniket PATIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT-END MODULE WITH VERTICALLY STACKED DIE AND CIRCULATOR
Publication number
20230387042
Publication date
Nov 30, 2023
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low Warpage High Density Trench Capacitor
Publication number
20230361166
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Co. Ltd.
Jyun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
Publication number
20230352411
Publication date
Nov 2, 2023
Samsung Electronics Co., Ltd.
Yunseok Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
Publication number
20230282557
Publication date
Sep 7, 2023
DAI NIPPON PRINTING CO., LTD.
Takamasa TAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR
Publication number
20230268306
Publication date
Aug 24, 2023
Xilinx, Inc.
Jing Jing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20230260977
Publication date
Aug 17, 2023
MEDIATEK INC.
Hsiao-Yun CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE
Publication number
20230253380
Publication date
Aug 10, 2023
Xilinx, Inc.
Li-Sheng WENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
Publication number
20230253384
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20230223348
Publication date
Jul 13, 2023
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230187366
Publication date
Jun 15, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
Publication number
20230163079
Publication date
May 25, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Yi Seul Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Fan-Out Package and the Methods of Manufacturing
Publication number
20230114652
Publication date
Apr 13, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
Publication number
20230092505
Publication date
Mar 23, 2023
Apple Inc.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
Publication number
20230060727
Publication date
Mar 2, 2023
Intel Corporation
Kaladhar Radhakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20230014450
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Jui Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MONOLITHIC SURFACE MOUNT PASSIVE COMPONENT
Publication number
20220399306
Publication date
Dec 15, 2022
Western Digital Technologies, Inc.
Ai-Wen WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20220320010
Publication date
Oct 6, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
Publication number
20220278067
Publication date
Sep 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hua-Wei Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
Publication number
20220246554
Publication date
Aug 4, 2022
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated High Voltage Capacitor
Publication number
20220238635
Publication date
Jul 28, 2022
SEMTECH CORPORATION
Christopher David Ainsworth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220223424
Publication date
Jul 14, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
Publication number
20220216192
Publication date
Jul 7, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Discrete Blocks
Publication number
20220122944
Publication date
Apr 21, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD
Publication number
20220084925
Publication date
Mar 17, 2022
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS