Insulating layers on lead frames

Industry

CPC
H01L23/49586

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49586Insulating layers on lead frames

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages with cavities and methods of manufactur...
- Patent number 12,165,942
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance semiconductor device
- Patent number 12,159,817
- Issue date Dec 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a package for a semiconductor device, semiconductor...
- Patent number 12,142,552
- Issue date Nov 12, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated current sensor with magnetic flux concentrators
- Patent number 12,013,419
- Issue date Jun 18, 2024
- Texas Instruments Incorporated
- Dok Won Lee
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 12,009,333
- Issue date Jun 11, 2024
- Shinko Electric Industries Co., Ltd.
- Satoshi Shiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having a plurality of lead frames connected to a sub...
- Patent number 11,935,819
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Hideshi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 11,842,954
- Issue date Dec 12, 2023
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor devices
- Patent number 11,791,248
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,776,867
- Issue date Oct 3, 2023
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High connectivity device stacking
- Patent number 11,742,330
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Kurtis Leschkies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 11,742,263
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with a metal oxide coating and method of forming the same
- Patent number 11,735,512
- Issue date Aug 22, 2023
- STMICROELECTRONICS INTERNATIONAL N.V.
- Luca Maria Carlo Di Dio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 11,735,508
- Issue date Aug 22, 2023
- SEMICONDUCTOR COMONENTS INDUTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated temperature sensor device package
- Patent number 11,658,101
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,640,932
- Issue date May 2, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,626,355
- Issue date Apr 11, 2023
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor devices
- Patent number 11,552,006
- Issue date Jan 10, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, resin-attached lead frame, and methods of ma...
- Patent number 11,515,458
- Issue date Nov 29, 2022
- Nichia Corporation
- Yukitoshi Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a package for a semiconductor device, semiconductor...
- Patent number 11,515,240
- Issue date Nov 29, 2022
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 11,508,635
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,508,646
- Issue date Nov 22, 2022
- Mitsubishi Electric Corporation
- Katsumi Miyawaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and maunfacturing method of semiconductor device
- Patent number 11,488,895
- Issue date Nov 1, 2022
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,462,504
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Koichi Tokubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
- Patent number 11,444,048
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,444,006
- Issue date Sep 13, 2022
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,437,304
- Issue date Sep 6, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20240371733
- Publication date Nov 7, 2024
- Ohkuchi Materials Co., Ltd.
- Keiichi Otaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...
- Publication number 20240363499
- Publication date Oct 31, 2024
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CURRENT SENSOR WITH MAGNETIC FLUX CONCENTRATORS
- Publication number 20240319234
- Publication date Sep 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Dok Won LEE
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240234331
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Insert
- Publication number 20240178109
- Publication date May 30, 2024
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170454
- Publication date May 23, 2024
- Fuji Electric Co., Ltd.
- Taisuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Current Sensing
- Publication number 20240170374
- Publication date May 23, 2024
- Shu Hui Goh
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136302
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20240120250
- Publication date Apr 11, 2024
- NEXPERIA B.V.
- Sönke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240096766
- Publication date Mar 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyeong Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20240021582
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package or a Printed Circuit Board, Both Modified to...
- Publication number 20240014104
- Publication date Jan 11, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME
- Publication number 20230402364
- Publication date Dec 14, 2023
- STMicroelectronics International N.V.
- Luca Maria Carlo DI DIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERDIGITAL CAPACITOR
- Publication number 20230402356
- Publication date Dec 14, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POTTED ELECTRONIC CIRCUIT
- Publication number 20230360988
- Publication date Nov 9, 2023
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Eike HAHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE
- Publication number 20230298979
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20230272536
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20230268253
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT FOR IC PACKAGE
- Publication number 20230170285
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Merto Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230163049
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Atsushi URATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DEVICES
- Publication number 20230163050
- Publication date May 25, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND HIGH THERMAL CONDUCTION ELEMENT
- Publication number 20230131821
- Publication date Apr 27, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR...
- Publication number 20230090848
- Publication date Mar 23, 2023
- STMicroelectronics S.r.l
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20230083412
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPON...
- Publication number 20230031356
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230028808
- Publication date Jan 26, 2023
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20220392830
- Publication date Dec 8, 2022
- STMicroelectronics S.r.l
- Federico Giovanni ZIGLIOLI
- H01 - BASIC ELECTRIC ELEMENTS

Insulating layers on lead frames

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit packages with cavities and methods of manufactur...

High performance semiconductor device

Lead frame for a package for a semiconductor device, semiconductor...

Package with different types of semiconductor dies attached to a fl...

Microelectronics package assemblies and processes for making

Semiconductor package having routable encapsulated conductive subst...

Integrated current sensor with magnetic flux concentrators

Semiconductor device

Electronic component apparatus having a first lead frame and a seco...

Circuit module having a plurality of lead frames connected to a sub...

Method of manufacturing semiconductor devices and corresponding sem...

Coated semiconductor devices

Chip package

High connectivity device stacking

Flippable leadframe for packaged electronic system having verticall...

Leadframe with a metal oxide coating and method of forming the same

Vertical and horizontal circuit assemblies

Isolated temperature sensor device package

Packaged electronic device with film isolated power stack

Semiconductor device and corresponding method

Coated semiconductor devices

Light emitting device, resin-attached lead frame, and methods of ma...

Lead frame for a package for a semiconductor device, semiconductor...

Semiconductor package having routable encapsulated conductive subst...

Semiconductor device

Semiconductor device and maunfacturing method of semiconductor device

Semiconductor apparatus

Shaped interconnect bumps in semiconductor devices

Electronic component apparatus having a first lead frame and a seco...

Substrate structures and methods of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...

LEAD FRAME

LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...

INTEGRATED CURRENT SENSOR WITH MAGNETIC FLUX CONCENTRATORS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Package with Insert

SEMICONDUCTOR DEVICE

Semiconductor Package with Current Sensing

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

HIGH CONNECTIVITY DEVICE STACKING

Semiconductor Package or a Printed Circuit Board, Both Modified to...

LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME

INTERDIGITAL CAPACITOR

POTTED ELECTRONIC CIRCUIT

ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

Packaged Electronic Device With Film Isolated Power Stack

INTERCONNECT FOR IC PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

COATED SEMICONDUCTOR DEVICES

HEAT DISSIPATION STRUCTURE AND HIGH THERMAL CONDUCTION ELEMENT

LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPON...

SEMICONDUCTOR DEVICE

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...