-
-
Semiconductor Device
-
Publication number 20240120250
-
Publication date Apr 11, 2024
-
NEXPERIA B.V.
-
Sönke Habenicht
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
HIGH CONNECTIVITY DEVICE STACKING
-
Publication number 20240021582
-
Publication date Jan 18, 2024
-
Applied Materials, Inc.
-
Kurtis LESCHKIES
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
INTERDIGITAL CAPACITOR
-
Publication number 20230402356
-
Publication date Dec 14, 2023
-
TEXAS INSTRUMENTS INCORPORATED
-
Yiqi Tang
-
H01 - BASIC ELECTRIC ELEMENTS
-
POTTED ELECTRONIC CIRCUIT
-
Publication number 20230360988
-
Publication date Nov 9, 2023
-
SEMIKRON ELEKTRONIK GMBH & CO. KG
-
Eike HAHN
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
INTERCONNECT FOR IC PACKAGE
-
Publication number 20230170285
-
Publication date Jun 1, 2023
-
TEXAS INSTRUMENTS INCORPORATED
-
Ruby Ann Merto Camenforte
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
COATED SEMICONDUCTOR DEVICES
-
Publication number 20230163050
-
Publication date May 25, 2023
-
TEXAS INSTRUMENTS INCORPORATED
-
Sreenivasan Kalyani Koduri
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
SEMICONDUCTOR DEVICE
-
Publication number 20230028808
-
Publication date Jan 26, 2023
-
Mitsubishi Electric Corporation
-
Hiroyuki MASUMOTO
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
-
-
-
CHIP PACKAGE
-
Publication number 20220310473
-
Publication date Sep 29, 2022
-
Industrial Technology Research Institute
-
Kuo-Shu Kao
-
H01 - BASIC ELECTRIC ELEMENTS
-
SEMICONDUCTOR DEVICE
-
Publication number 20220301988
-
Publication date Sep 22, 2022
-
Kabushiki Kaisha Toshiba
-
Fumiyoshi KAWASHIRO
-
H01 - BASIC ELECTRIC ELEMENTS