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CPC
B81B7/0006

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0006Interconnects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical system (MEMS) interconnect including spring...
- Patent number 12,258,264
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Muir Kumph
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
- Patent number 12,208,416
- Issue date Jan 28, 2025
- Zhejiang Xiansheng Technology Co., Ltd.
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device built using the BEOL metal layers of a solid state semi...
- Patent number 12,209,009
- Issue date Jan 28, 2025
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor substrate, method for manufa...
- Patent number 12,187,607
- Issue date Jan 7, 2025
- Hamamatsu Photonics K.K.
- Nao Inoue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithic post complementary metal-oxide-semiconductor integration...
- Patent number 12,168,603
- Issue date Dec 17, 2024
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 12,134,555
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS actuator package architecture
- Patent number 12,132,420
- Issue date Oct 29, 2024
- MEMS DRIVE (NANJING) CO., LTD.
- Xiaolei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics H-frame device
- Patent number 12,122,666
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator device
- Patent number 11,952,265
- Issue date Apr 9, 2024
- Hamamatsu Photonics K.K.
- Sadaharu Takimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for balancing detection sensitivity in produci...
- Patent number 11,889,252
- Issue date Jan 30, 2024
- Knowles Electronics, LLC
- Mark Niederberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,887,906
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical interconnection structure, electronic apparatus and manu...
- Patent number 11,884,536
- Issue date Jan 30, 2024
- AAC Technologies Pte. Ltd.
- Bharadwaja S.N. Shrowthi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS bridge devices and methods of manufacture thereof
- Patent number 11,834,327
- Issue date Dec 5, 2023
- SOFANT TECHNOLOGIES LTD
- Nakul Haridas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Connected field effect transistors
- Patent number 11,827,512
- Issue date Nov 28, 2023
- Hewlett-Packard Development Company, L.P.
- Eric Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through silicon via and redistribution layer
- Patent number 11,795,051
- Issue date Oct 24, 2023
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Thomas Weidner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a layer structure and microelectromechanical...
- Patent number 11,787,686
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device built using the BEOL metal layers of a solid state semi...
- Patent number 11,780,725
- Issue date Oct 10, 2023
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Copper alloys for interconnectors and methods for making the same
- Patent number 11,776,893
- Issue date Oct 3, 2023
- The Trustees of the University of Pennsylvania
- Daniel S. Gianola
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone assembly with standoffs for die bonding
- Patent number 11,750,983
- Issue date Sep 5, 2023
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,749,628
- Issue date Sep 5, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electromechanical microsystem comprising an active element having a...
- Patent number 11,716,907
- Issue date Aug 1, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Thierry Hilt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic package with mold-integrated components
- Patent number 11,694,962
- Issue date Jul 4, 2023
- Intel Corporation
- Georgios Dogiamis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,685,648
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Panel transducer scale package and method of manufacturing the same
- Patent number 11,679,975
- Issue date Jun 20, 2023
- Vermon S.A.
- Claire Bantignies
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE WITH HOLLOW STRUCTURE AND METHOD FOR ASSEMBLING SENS...
- Publication number 20250091859
- Publication date Mar 20, 2025
- Carrier Corporation
- Jacob Kerling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO...
- Publication number 20250059023
- Publication date Feb 20, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROCHEMISTRY MICROSCOPY BIPOLAR REFERENCE ELECTRODE ASSEMBLY
- Publication number 20250027899
- Publication date Jan 23, 2025
- PROTOCHIPS, INC.
- Katherine Marusak Stephens
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
- Publication number 20250030998
- Publication date Jan 23, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE
- Publication number 20250011160
- Publication date Jan 9, 2025
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR
- Publication number 20250002329
- Publication date Jan 2, 2025
- Rohm Co., Ltd.
- Masahiro SAKURAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20240383745
- Publication date Nov 21, 2024
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE
- Publication number 20240317577
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Yusuke SHIRAYANAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR
- Publication number 20240317579
- Publication date Sep 26, 2024
- Rohm Co., Ltd.
- Daisuke KAMINISHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240270566
- Publication date Aug 15, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hao YAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR DEVICE
- Publication number 20240190699
- Publication date Jun 13, 2024
- HAMAMATSU PHOTONICS K. K.
- Sadaharu TAKIMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240124298
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Chung Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES
- Publication number 20240101413
- Publication date Mar 28, 2024
- Intel Corporation
- Jeremy D. Ecton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240083743
- Publication date Mar 14, 2024
- Vanguard International Semiconductor Corporation
- RAKESH CHAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING
- Publication number 20240043264
- Publication date Feb 8, 2024
- Obsidian Sensors, Inc.
- Tallis CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...
- Publication number 20230406693
- Publication date Dec 21, 2023
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED SUPERCONDUCTING INTERCONNECT IN SILICON
- Publication number 20230391609
- Publication date Dec 7, 2023
- International Business Machines Corporation
- Muir Kumph
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...
- Publication number 20230302495
- Publication date Sep 28, 2023
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for CMOS-MEMS Thin Film Encapsulation
- Publication number 20230278856
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20230278857
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20230202835
- Publication date Jun 29, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAV...
- Publication number 20230074970
- Publication date Mar 9, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20220325396
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS H-FRAME DEVICE
- Publication number 20220289559
- Publication date Sep 15, 2022
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PANEL TRANSDUCER SCALE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220289562
- Publication date Sep 15, 2022
- VERMON SA
- Claire BANTIGNIES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20220285213
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Display Device
- Publication number 20220246596
- Publication date Aug 4, 2022
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei YAMAZAKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Interconnects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectromechanical system (MEMS) interconnect including spring...

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...

MEMS packages and methods of manufacture thereof

MEMS device built using the BEOL metal layers of a solid state semi...

Method for manufacturing semiconductor substrate, method for manufa...

Monolithic post complementary metal-oxide-semiconductor integration...

Conductive bond structure to increase membrane sensitivity in MEMS...

Method and structure for CMOS-MEMS thin film encapsulation

Undercut-free patterned aluminum nitride structure and methods for...

MEMS actuator package architecture

Microelectronics H-frame device

Microelectronic assembly from processed substrate

Method for producing a wafer connection

Actuator device

Method and apparatus for balancing detection sensitivity in produci...

Packaged device with die wrapped by a substrate

Electrical interconnection structure, electronic apparatus and manu...

MEMS bridge devices and methods of manufacture thereof

Connected field effect transistors

Support structure for MEMS device with particle filter

Through silicon via and redistribution layer

Method for processing a layer structure and microelectromechanical...

MEMS device built using the BEOL metal layers of a solid state semi...

Copper alloys for interconnectors and methods for making the same

Microphone assembly with standoffs for die bonding

Sacrificial redistribution layer in microelectronic assemblies havi...

Electromechanical microsystem comprising an active element having a...

Microelectronic package with mold-integrated components

MEMS packages and methods of manufacture thereof

Panel transducer scale package and method of manufacturing the same

Patents Applicationslast 30 patents

SENSOR PACKAGE WITH HOLLOW STRUCTURE AND METHOD FOR ASSEMBLING SENS...

FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO...

ELECTROCHEMISTRY MICROSCOPY BIPOLAR REFERENCE ELECTRODE ASSEMBLY

FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE

MEMS SENSOR

MICROMECHANICAL COMPONENT

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE

MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR

ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME

ACTUATOR DEVICE

Semiconductor Devices and Methods of Manufacture

SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES

MICROELECTROMECHANICAL SYSTEMS PACKAGE AND METHOD FOR MANUFACTURING...

MEMS DEVICE MANUFACTURING

MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...

MICROMACHINED SUPERCONDUCTING INTERCONNECT IN SILICON

CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...

Method and Structure for CMOS-MEMS Thin Film Encapsulation

MEMS Packages and Methods of Manufacture Thereof

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAV...

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

MICROELECTRONICS H-FRAME DEVICE

PANEL TRANSDUCER SCALE PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

Display Device