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CPC
B81C1/00095

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00095Interconnects

Industries

Patents Grantslast 30 patents

Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,887,906
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Connected field effect transistors
- Patent number 11,827,512
- Issue date Nov 28, 2023
- Hewlett-Packard Development Company, L.P.
- Eric Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through silicon via and redistribution layer
- Patent number 11,795,051
- Issue date Oct 24, 2023
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Thomas Weidner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for microelectromechanical systems (MEMS) devices to cont...
- Patent number 11,697,588
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Panel transducer scale package and method of manufacturing the same
- Patent number 11,679,975
- Issue date Jun 20, 2023
- Vermon S.A.
- Claire Bantignies
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 11,618,674
- Issue date Apr 4, 2023
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged pressure sensor device
- Patent number 11,427,464
- Issue date Aug 30, 2022
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding pad layer system, gas sensor and method for manufacturing a...
- Patent number 11,407,635
- Issue date Aug 9, 2022
- Robert Bosch GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 11,371,133
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 11,367,652
- Issue date Jun 21, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for forming a biological microdevice
- Patent number 11,351,537
- Issue date Jun 7, 2022
- University of Central Florida Research Foundation, Inc.
- Swaminathan Rajaraman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS with over-voltage protection
- Patent number 11,312,622
- Issue date Apr 26, 2022
- SiTime Corporation
- Nicholas Miller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and manufacturing method thereof
- Patent number 11,312,624
- Issue date Apr 26, 2022
- MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Li-Tien Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,201,096
- Issue date Dec 14, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for microelectromechanical systems (MEMS) devices to cont...
- Patent number 11,198,606
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical test structure and method for monitoring deep trench imp...
- Patent number 11,119,137
- Issue date Sep 14, 2021
- Texas Instruments Incorporated
- Thomas Edward Lillibridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing conductive structure
- Patent number 11,111,134
- Issue date Sep 7, 2021
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Lieng Loo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing MEMS device and MEMS device
- Patent number 11,114,604
- Issue date Sep 7, 2021
- Seiko Epson Corporation
- Yoshiki Sugawara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithic, biocompatible feedthrough for hermetically sealed elect...
- Patent number 11,107,703
- Issue date Aug 31, 2021
- NEURALINK CORP.
- Vanessa M. Tolosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component having low-resistance wiring and method for manufact...
- Patent number 10,988,373
- Issue date Apr 27, 2021
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar electrode arrays and fabrication methods thereof
- Patent number 10,969,359
- Issue date Apr 6, 2021
- National Technology & Engineering Solutions of Sandia, LLC
- Eric John Schindelholz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D stack configuration for 6-axis motion sensor
- Patent number 10,941,033
- Issue date Mar 9, 2021
- Invensense, Inc.
- Dongyang Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming micro-electro-mechanical system (MEMS) structure
- Patent number 10,865,100
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical connection to a micro electro-mechanical system
- Patent number 10,843,921
- Issue date Nov 24, 2020
- Kionix, Inc.
- Andrew Hocking
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged pressure sensor device
- Patent number 10,822,224
- Issue date Nov 3, 2020
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of achieving universal interfacing using suspended and/or f...
- Patent number 10,807,864
- Issue date Oct 20, 2020
- The Regents of the University of Colorado, a Body Corporate
- Joseph J. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with air cavity
- Patent number 10,777,536
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS with over-voltage protection
- Patent number 10,737,934
- Issue date Aug 11, 2020
- SiTime Corporation
- Nicholas Miller
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE
- Publication number 20240317577
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Yusuke SHIRAYANAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240124298
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Chung Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES
- Publication number 20240101413
- Publication date Mar 28, 2024
- Intel Corporation
- Jeremy D. Ecton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20230294978
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIGITAL ASSEMBLY OF SPHERICAL HYDROGEL VOXELS TO FORM 3D LATTICE ST...
- Publication number 20230271377
- Publication date Aug 31, 2023
- University of Virginia Patent Foundation
- Liheng CAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20230202835
- Publication date Jun 29, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CROSSOVERS FOR VACUUM PACKAGING
- Publication number 20220411261
- Publication date Dec 29, 2022
- Obsidian Sensors, Inc.
- John HONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20220325396
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PANEL TRANSDUCER SCALE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220289562
- Publication date Sep 15, 2022
- VERMON SA
- Claire BANTIGNIES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20220285213
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20220106188
- Publication date Apr 7, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20220089434
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE
- Publication number 20220077014
- Publication date Mar 10, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER ASSISTED METAL ADHESION TO INDIUM TIN OXIDE ON GLASS, QUARTZ,...
- Publication number 20210380919
- Publication date Dec 9, 2021
- King Abdullah University of Science and Technology
- Ulrich BUTTNER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTED FIELD EFFECT TRANSISTORS
- Publication number 20210246013
- Publication date Aug 12, 2021
- Hewlett-Packard Development Company, L.P.
- Eric Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL TEST STRUCTURE AND METHOD FOR MONITORING DEEP TRENCH IMP...
- Publication number 20210208187
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Edward Lillibridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EXTERNALLY GROUNDED PRINTED CIRCUIT BOARD
- Publication number 20210204394
- Publication date Jul 1, 2021
- KNOWLES ELECTRONICS, LLC
- Joshua Watson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Through Silicon Via and Redistribution Layer
- Publication number 20210087053
- Publication date Mar 25, 2021
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Thomas Weidner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20210087055
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE
- Publication number 20210013116
- Publication date Jan 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE
- Publication number 20210009405
- Publication date Jan 14, 2021
- NXP USA, Inc.
- Weng Foong YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Monolithic, Biocompatible Feedthrough for Hermetically Sealed Elect...
- Publication number 20210013051
- Publication date Jan 14, 2021
- Neuralink Corp.
- Vanessa M. Tolosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20200243380
- Publication date Jul 30, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL CONNECTION TO A MICRO ELECTRO-MECHANICAL SYSTEM
- Publication number 20200216310
- Publication date Jul 9, 2020
- Kionix, Inc.
- Andrew Hocking
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A...
- Publication number 20200140261
- Publication date May 7, 2020
- ROBERT BOSCH GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D STACK CONFIGURATION FOR 6-AXIS MOTION SENSOR
- Publication number 20200131027
- Publication date Apr 30, 2020
- InvenSense, Inc.
- Dongyang KANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200115226
- Publication date Apr 16, 2020
- MiraMEMS Sensing Technology Co., Ltd.
- LI-TIEN TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for processing conductive structure
- Publication number 20190337799
- Publication date Nov 7, 2019
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Lieng Loo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE
- Publication number 20190315620
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Interconnects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Undercut-free patterned aluminum nitride structure and methods for...

Microelectronic assembly from processed substrate

Packaged device with die wrapped by a substrate

Connected field effect transistors

Through silicon via and redistribution layer

Structure for microelectromechanical systems (MEMS) devices to cont...

Panel transducer scale package and method of manufacturing the same

Actuator layer patterning with topography

Packaged pressure sensor device

Bonding pad layer system, gas sensor and method for manufacturing a...

Undercut-free patterned aluminum nitride structure and methods for...

Microelectronic assembly from processed substrate

System and method for forming a biological microdevice

MEMS with over-voltage protection

MEMS device and manufacturing method thereof

Packaged device with die wrapped by a substrate

Structure for microelectromechanical systems (MEMS) devices to cont...

Electrical test structure and method for monitoring deep trench imp...

Method for processing conductive structure

Method of manufacturing MEMS device and MEMS device

Monolithic, biocompatible feedthrough for hermetically sealed elect...

MEMS component having low-resistance wiring and method for manufact...

Planar electrode arrays and fabrication methods thereof

3D stack configuration for 6-axis motion sensor

Method for forming micro-electro-mechanical system (MEMS) structure

Electrical connection to a micro electro-mechanical system

Packaged pressure sensor device

Methods of achieving universal interfacing using suspended and/or f...

Semiconductor package with air cavity

MEMS with over-voltage protection

Patents Applicationslast 30 patents

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE

Semiconductor Devices and Methods of Manufacture

SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

DIGITAL ASSEMBLY OF SPHERICAL HYDROGEL VOXELS TO FORM 3D LATTICE ST...

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

CROSSOVERS FOR VACUUM PACKAGING

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

PANEL TRANSDUCER SCALE PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE

LASER ASSISTED METAL ADHESION TO INDIUM TIN OXIDE ON GLASS, QUARTZ,...

CONNECTED FIELD EFFECT TRANSISTORS

ELECTRICAL TEST STRUCTURE AND METHOD FOR MONITORING DEEP TRENCH IMP...

EXTERNALLY GROUNDED PRINTED CIRCUIT BOARD

Through Silicon Via and Redistribution Layer

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE

PACKAGED PRESSURE SENSOR DEVICE

Monolithic, Biocompatible Feedthrough for Hermetically Sealed Elect...

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

ELECTRICAL CONNECTION TO A MICRO ELECTRO-MECHANICAL SYSTEM

BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A...

3D STACK CONFIGURATION FOR 6-AXIS MOTION SENSOR

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

Method for processing conductive structure

METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE