interposed between the semiconductor or sold-state device and the die mounting substrate [

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H01L2924/19103

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/19103interposed between the semiconductor or sold-state device and the die mounting substrate [

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,369,337
- Issue date Jul 22, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor, its manufacturing method, and electronic circu...
- Patent number 12,336,203
- Issue date Jun 17, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-plane inductors in IC packages
- Patent number 12,336,197
- Issue date Jun 17, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,237,366
- Issue date Feb 25, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,230,590
- Issue date Feb 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,218,185
- Issue date Feb 4, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforced element
- Patent number 12,218,080
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid glass core for wafer level and panel level packaging applica...
- Patent number 12,191,240
- Issue date Jan 7, 2025
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with near-die integrated passive device
- Patent number 12,136,613
- Issue date Nov 5, 2024
- Xilinx, Inc.
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure, semiconductor package and fabrication method th...
- Patent number 12,074,122
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,074,112
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure having conductive sheets having fan plate shape...
- Patent number 12,062,685
- Issue date Aug 13, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,009,289
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,984,412
- Issue date May 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,955,442
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR
- Publication number 20250240981
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyun-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
- Publication number 20250226365
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...
- Publication number 20250218983
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20250167048
- Publication date May 22, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149471
- Publication date May 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
- Publication number 20250096163
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250079414
- Publication date Mar 6, 2025
- Universal Global Technology (Kunshan) Co., Ltd.
- KUO-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
- Publication number 20250040231
- Publication date Jan 30, 2025
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
- Publication number 20250029785
- Publication date Jan 23, 2025
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...
- Publication number 20250022814
- Publication date Jan 16, 2025
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20240379589
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20240363559
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DE...
- Publication number 20240363605
- Publication date Oct 31, 2024
- QUALCOMM Incorporated
- Darko POPOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240219630
- Publication date Jul 4, 2024
- Shanghai Xizhi Technology Co., Ltd.
- Yichen SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213168
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240203907
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20240194574
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips (SoIC) and Semiconductor Structures with...
- Publication number 20240153881
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED IN...
- Publication number 20240128247
- Publication date Apr 18, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS

interposed between the semiconductor or sold-state device and the die mounting substrate [

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin film capacitor and electronic circuit substrate having the same

Thin film capacitor, its manufacturing method, and electronic circu...

In-plane inductors in IC packages

Package substrate, electronic device package and method for manufac...

Low warpage high density trench capacitor

Thin film capacitor and electronic circuit substrate having the same

Electronic package and manufacturing method thereof

Magnetic core inductors in interposer

Thin film capacitor and electronic circuit substrate having the same

Package structure with reinforced element

Integrated circuit structure and method

Hybrid glass core for wafer level and panel level packaging applica...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Organic interposer including a dual-layer inductor structure and me...

Chip package with near-die integrated passive device

Package embedded magnetic inductor structures and manufacturing tec...

Thin film capacitor and electronic circuit substrate having the same

Multilayer capacitor and circuit board containing the same

Semiconductor device and method of making the same

Semiconductor device assembly with surface-mount die support struct...

Inductor structure, semiconductor package and fabrication method th...

Package structure

Multi-die fine grain integrated voltage regulation

Inductor structure having conductive sheets having fan plate shape...

Bonded structures with integrated passive component

Semiconductor package and manufacturing method thereof

Multiple plated via arrays of different wire heights on a same subs...

Electronic package and manufacturing method thereof

Structure and method for fabricating a computing system with an int...

Semiconductor package and method

Patents Applicationslast 30 patents

LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR

INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...

Structure and Method for Fabricating a Computing System with an Int...

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Multi-Die Fine Grain Integrated Voltage Regulation

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

INTEGRATED CIRCUIT STRUCTURE AND METHOD

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY

Multilayer Capacitor and Circuit Board Containing the Same

PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Structure and Method for Fabricating a Computing System with an Int...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

SEMICONDUCTOR PACKAGE

System on Integrated Chips (SoIC) and Semiconductor Structures with...

PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED IN...