TREA

interposed between the semiconductor or sold-state device and the die mounting substrate [

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Industry

  • CPC
  • H01L2924/19103
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19103interposed between the semiconductor or sold-state device and the die mounting substrate [
Industries