interposed between the semiconductor or sold-state device and the die mounting substrate [

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H01L2924/19103

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19103interposed between the semiconductor or sold-state device and the die mounting substrate [

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,955,442
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer power, converter with devices having reduced lateral cur...
- Patent number 11,908,844
- Issue date Feb 20, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,894,308
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips (SoIC) and semiconductor structures with...
- Patent number 11,894,309
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor device packages and method for...
- Patent number 11,887,943
- Issue date Jan 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,881,463
- Issue date Jan 23, 2024
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,855,003
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and semiconductor package including...
- Patent number 11,854,989
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 11,830,822
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,804,455
- Issue date Oct 31, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexibility in capacitor design for powe...
- Patent number 11,804,826
- Issue date Oct 31, 2023
- MediaTek Singapore Pte Ltd.
- Zhigang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising passive component between substrates for improve...
- Patent number 11,791,276
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 11,769,741
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 11,764,171
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,735,532
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial magnetic inductors with pre-fabricated ferrite cores
- Patent number 11,735,535
- Issue date Aug 22, 2023
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,728,077
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 11,716,813
- Issue date Aug 1, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including decoupling capacitor
- Patent number 11,715,708
- Issue date Aug 1, 2023
- SK hynix Inc.
- Jae Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,705,401
- Issue date Jul 18, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermals for packages with inductors
- Patent number 11,699,630
- Issue date Jul 11, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 11,688,762
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 11,670,597
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure, semiconductor package and fabrication method th...
- Patent number 11,658,134
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 11,636,978
- Issue date Apr 25, 2023
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System on Integrated Chips (SoIC) and Semiconductor Structures with...
- Publication number 20240153881
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED IN...
- Publication number 20240128247
- Publication date Apr 18, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240113090
- Publication date Apr 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Myoung KI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105694
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jung Hoo YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
- Publication number 20240014149
- Publication date Jan 11, 2024
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20230387038
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20230378039
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369253
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20230369255
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method
- Publication number 20230369254
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Warpage High Density Trench Capacitor
- Publication number 20230361166
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM STRUCTURE FOR INTEGRATED PASSIVE DEVICE INTEGRATION AND METHODS...
- Publication number 20230326819
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...
- Publication number 20230299044
- Publication date Sep 21, 2023
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230260918
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE
- Publication number 20230253380
- Publication date Aug 10, 2023
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20230253348
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20230223359
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20230223360
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20230197631
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND PLANAR INDUCTORS
- Publication number 20230187386
- Publication date Jun 15, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230154873
- Publication date May 18, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230154872
- Publication date May 18, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES
- Publication number 20230082743
- Publication date Mar 16, 2023
- RF360 Europe GmbH
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...
- Publication number 20230075019
- Publication date Mar 9, 2023
- SMOLTEK AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20220375836
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220367383
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method
- Publication number 20220344287
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20220346235
- Publication date Oct 27, 2022
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220328416
- Publication date Oct 13, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS

interposed between the semiconductor or sold-state device and the die mounting substrate [

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure and method for fabricating a computing system with an int...

Semiconductor package and method

Process for thin film capacitor integration

Multilayer power, converter with devices having reduced lateral cur...

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor package and method of manufacturing the same

System on integrated chips (SoIC) and semiconductor structures with...

Semiconductor devices, semiconductor device packages and method for...

Coreless organic packages with embedded die and magnetic inductor s...

Package structure and method of fabricating the same

Semiconductor package substrate and semiconductor package including...

Semiconductor device and method of making the same

Substrate integrated thin film capacitors using amorphous high-k di...

Semiconductor devices with flexibility in capacitor design for powe...

Package comprising passive component between substrates for improve...

Organic interposer including a dual-layer inductor structure and me...

Integrated circuit structure and method

Semiconductor packages

Coaxial magnetic inductors with pre-fabricated ferrite cores

Magnetic material having coated ferromagnetic filler particles

Module

Semiconductor package including decoupling capacitor

Semiconductor package structure and method for manufacturing the same

Thermals for packages with inductors

Low warpage high density trench capacitor

Structure and method for fabricating a computing system with an int...

Method for forming package structure

Inductor structure, semiconductor package and fabrication method th...

Multilayer capacitor and circuit board containing the same

Bonded structures with integrated passive component

Patents Applicationslast 30 patents

System on Integrated Chips (SoIC) and Semiconductor Structures with...

PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED IN...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR DEVICE

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

Integrated Circuit Structure and Method

Low Warpage High Density Trench Capacitor

Structure and Method for Fabricating a Computing System with an Int...

DAM STRUCTURE FOR INTEGRATED PASSIVE DEVICE INTEGRATION AND METHODS...

PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...

PACKAGE STRUCTURE

CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND PLANAR INDUCTORS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED PASSIVE DEVICES

ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated Circuit Structure and Method

MODULE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME