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H01L2224/859

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/859involving monitoring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,125,813
- Issue date Oct 22, 2024
- Denso Corporation
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for increasing the reliability of a power module
- Patent number 11,929,346
- Issue date Mar 12, 2024
- Mitsubishi Electric Corporation
- Julio Cezar Brandelero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating a wire bonding machine, including methods of m...
- Patent number 11,865,633
- Issue date Jan 9, 2024
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power converter
- Patent number 11,855,033
- Issue date Dec 26, 2023
- Mitsubishi Electric Corporation
- Haruko Hitomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 11,808,436
- Issue date Nov 7, 2023
- Epistar Corporation
- Chi-Chih Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode (LED) components and methods
- Patent number 11,769,757
- Issue date Sep 26, 2023
- CreeLED, Inc.
- Jesse Colin Reiherzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge tool, bonding device, and bonding inspection method
- Patent number 11,756,919
- Issue date Sep 12, 2023
- Mitsubishi Electric Corporation
- Daisuke Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,721,660
- Issue date Aug 8, 2023
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,699,672
- Issue date Jul 11, 2023
- Denso Corporation
- Mariko Fujieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device including RGB light emitting diodes and phosphor
- Patent number 11,605,762
- Issue date Mar 14, 2023
- Seoul Semiconductor Co., Ltd.
- Chung-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating a wire bonding machine, including methods of m...
- Patent number 11,597,031
- Issue date Mar 7, 2023
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting devices and components having improved chemical resi...
- Patent number 11,563,156
- Issue date Jan 24, 2023
- CreeLED, Inc.
- Shaow B. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 11,557,566
- Issue date Jan 17, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 11,552,051
- Issue date Jan 10, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leads for semiconductor package
- Patent number 11,538,740
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Jason Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...
- Publication number 20240250063
- Publication date Jul 25, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY WIRE OVER STITCH BOND
- Publication number 20240128228
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aniceto Rabilas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
- Publication number 20240038720
- Publication date Feb 1, 2024
- SK HYNIX INC.
- Su Ji UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TESTING BONDED WIRES ON WIRE BONDING MACHINES
- Publication number 20240014169
- Publication date Jan 11, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- ODAL KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230369282
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Donguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF IMPROVING WIRE BONDING OPERATIONS
- Publication number 20230352443
- Publication date Nov 2, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230335528
- Publication date Oct 19, 2023
- NIPPON MICROMETAL COPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING A HEIGHT, AND A HEIGHT PROFILE, OF A WIRE LO...
- Publication number 20230335532
- Publication date Oct 19, 2023
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON SHIELD DEVICE AND METHOD
- Publication number 20230317680
- Publication date Oct 5, 2023
- Intel Corporation
- Prabhat Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230299030
- Publication date Sep 21, 2023
- DENSO CORPORATION
- Kazuaki MAWATARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...
- Publication number 20230260960
- Publication date Aug 17, 2023
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230215834
- Publication date Jul 6, 2023
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PROCESS WIRE BOND TESTING
- Publication number 20230215835
- Publication date Jul 6, 2023
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF M...
- Publication number 20230166348
- Publication date Jun 1, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR INCREASING THE RELIABILITY OF A POWER MODULE
- Publication number 20230141711
- Publication date May 11, 2023
- Mitsubishi Electric Corporation
- Julio Cezar BRANDELERO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT
- Publication number 20230139201
- Publication date May 4, 2023
- Sony Semiconductor Solutions Corporation
- Kenta FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20230121780
- Publication date Apr 20, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230119348
- Publication date Apr 20, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS
- Publication number 20230098907
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- LongTing LI
- H01 - BASIC ELECTRIC ELEMENTS

involving monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming an electrical connection between an electronic c...

In-process wire bond testing using wire bonding apparatus

Apparatus and methods for tool mark free stitch bonding

Semiconductor device and method for manufacturing same

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus and method for manufacturing semiconductor d...

Chip package, method of forming a chip package and method of formin...

Sensor package and manufacturing method thereof

Device and method for increasing the reliability of a power module

Manufacturing method of semiconductor device and semiconductor device

Stacked microfeature devices and associated methods

Methods of operating a wire bonding machine, including methods of m...

Semiconductor device package and a method of manufacturing the same

Power semiconductor module and power converter

Method of manufacturing a semiconductor device having a bond wire o...

Stacked semiconductor die assemblies with die support members and a...

Light emitting apparatus

Semiconductor device having conductive wire with increased attachme...

Light emitting diode (LED) components and methods

Wedge tool, bonding device, and bonding inspection method

Package-on-package assembly with wire bond vias

Bonding wire for semiconductor devices

Semiconductor device and method for manufacturing same

Sensor package and manufacturing method thereof

Light emitting device including RGB light emitting diodes and phosphor

Methods of operating a wire bonding machine, including methods of m...

Light emitting devices and components having improved chemical resi...

Method for forming an electrical connection between an electronic c...

Electronic device package

Leads for semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

CAPILLARY FOR STITCH BOND

METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SECURITY WIRE OVER STITCH BOND

DOCUMENT STRUCTURE FORMATION

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...

METHODS OF TESTING BONDED WIRES ON WIRE BONDING MACHINES

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHODS OF IMPROVING WIRE BONDING OPERATIONS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHODS OF DETERMINING A HEIGHT, AND A HEIGHT PROFILE, OF A WIRE LO...

RIBBON SHIELD DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

IN-PROCESS WIRE BOND TESTING

METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF M...

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

DEVICE AND METHOD FOR INCREASING THE RELIABILITY OF A POWER MODULE

IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS