involving movement of a part of the bonding apparatus

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H01L2224/85148

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85148involving movement of a part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
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- Issue date Jul 19, 2016
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,177,936
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,040,358
- Issue date May 26, 2015
- Renesas Electronics Corporation
- Kazuya Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,846,455
- Issue date Sep 30, 2014
- Renesas Electronics Corporation
- Kazuya Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and semiconductor device
- Patent number 8,815,732
- Issue date Aug 26, 2014
- Shinkawa Ltd.
- Tatsunari Mii
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,796,074
- Issue date Aug 5, 2014
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,609,527
- Issue date Dec 17, 2013
- Oki Semiconductor Co., Ltd.
- Isao Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,384,229
- Issue date Feb 26, 2013
- Renesas Electronics Corporation
- Kazuya Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of bonding wires between semiconduc...
- Patent number 8,378,507
- Issue date Feb 19, 2013
- Elpida Memory, Inc.
- Satoshi Itaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing structure for electronic component and resin sealing...
- Patent number 8,358,018
- Issue date Jan 22, 2013
- Panasonic Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 8,308,049
- Issue date Nov 13, 2012
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,283,210
- Issue date Oct 9, 2012
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 8,231,046
- Issue date Jul 31, 2012
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including semiconductor chip and sealing material
- Patent number 8,169,089
- Issue date May 1, 2012
- Elpida Memory, Inc.
- Toshihiko Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and semiconductor device
- Patent number 8,143,155
- Issue date Mar 27, 2012
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,091,761
- Issue date Jan 10, 2012
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure and mounting method
- Patent number 8,080,884
- Issue date Dec 20, 2011
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package type semiconductor device
- Patent number 8,053,278
- Issue date Nov 8, 2011
- Oki Semiconductor Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including plural sem...
- Patent number 7,998,795
- Issue date Aug 16, 2011
- Renesas Electronics Corporation
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,889,513
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including plural sem...
- Patent number 7,772,044
- Issue date Aug 10, 2010
- Renesas Technology Corp.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method therefor
- Patent number 7,514,800
- Issue date Apr 7, 2009
- NEC Electronics Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor device package
- Patent number 7,466,024
- Issue date Dec 16, 2008
- Renesas Technology Corp.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal head and bonding connection method therefor
- Patent number 7,142,228
- Issue date Nov 28, 2006
- Alps Electric Co., Ltd.
- Hidetomi Majima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and production method therefor and module for...
- Patent number 7,135,782
- Issue date Nov 14, 2006
- Sharp Kabushiki Kaisha
- Masataka Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package type semiconductor device
- Patent number 7,115,977
- Issue date Oct 3, 2006
- Oki Electric Industry Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 6,923,361
- Issue date Aug 2, 2005
- Kabushiki Kaisha Shinkawa
- Tooru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package type semiconductor device
- Patent number 6,882,056
- Issue date Apr 19, 2005
- Oki Electric Industry Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 6,871,772
- Issue date Mar 29, 2005
- Kabushiki Kaisha Shinkawa
- Ryuichi Kyomasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device and wire bonding method
- Patent number 6,786,392
- Issue date Sep 7, 2004
- NEC Electronics Corporation
- Jun Nogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140363926
- Publication date Dec 11, 2014
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140127860
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130171776
- Publication date Jul 4, 2013
- RENESAS ELECTRONICS CORPORATION
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTRUING SEMICONDUCTOR DEVICE
- Publication number 20130005086
- Publication date Jan 3, 2013
- Renesas Electronics Corporation
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120139129
- Publication date Jun 7, 2012
- SHINKAWA LTD.
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110171777
- Publication date Jul 14, 2011
- Renesas Electronics Corporation
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20110159644
- Publication date Jun 30, 2011
- Renesas Electronics Corporation
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20110114704
- Publication date May 19, 2011
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110101544
- Publication date May 5, 2011
- Renesas Electronics Corporation
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20110070729
- Publication date Mar 24, 2011
- Oki Semiconductor Co., Ltd.
- Isao Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device and bonding apparatus
- Publication number 20110062216
- Publication date Mar 17, 2011
- RENESAS ELECTRONICS CORPORATION
- Tsutomu SANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEM...
- Publication number 20100255639
- Publication date Oct 7, 2010
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING DEVICE
- Publication number 20100230471
- Publication date Sep 16, 2010
- Kabushiki Kaisha Toshiba
- Masahiko Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding method and semiconductor device
- Publication number 20100207280
- Publication date Aug 19, 2010
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100187690
- Publication date Jul 29, 2010
- Kabushiki Kaisha Toshiba
- Kiyokazu OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100181367
- Publication date Jul 22, 2010
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD
- Publication number 20100096437
- Publication date Apr 22, 2010
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF BONDING WIRES BETWEEN SEMICONDUC...
- Publication number 20100084773
- Publication date Apr 8, 2010
- Elpida Memory, Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING METHOD
- Publication number 20090321926
- Publication date Dec 31, 2009
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20090315192
- Publication date Dec 24, 2009
- ELPIDA MEMORY, INC.
- Toshihiko Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMP...
- Publication number 20090278265
- Publication date Nov 12, 2009
- Panasonic Corporation
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20090166774
- Publication date Jul 2, 2009
- FUJIFILM CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEM...
- Publication number 20090061563
- Publication date Mar 5, 2009
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES...
- Publication number 20080304245
- Publication date Dec 11, 2008
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Chih Ming CHOU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20080099532
- Publication date May 1, 2008
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20080038872
- Publication date Feb 14, 2008
- NEC ELECTRONICS CORPORATION
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070182026
- Publication date Aug 9, 2007
- KABUSHIKI KAISHA SHINKAWA
- Shinichi Nishiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20070158392
- Publication date Jul 12, 2007
- RENESAS TECHNOLOGY CORP.
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package type semiconductor device
- Publication number 20070048903
- Publication date Mar 1, 2007
- Oki Electric Industry, Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070035017
- Publication date Feb 15, 2007
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS

involving movement of a part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Wire bonding method and semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and method of bonding wires between semiconduc...

Resin sealing structure for electronic component and resin sealing...

Wire bonding method

Method of manufacturing semiconductor device

Wire bonding apparatus and wire bonding method

Semiconductor device including semiconductor chip and sealing material

Wire bonding method and semiconductor device

Bonding apparatus and bonding method

Mounting structure and mounting method

Multi-chip package type semiconductor device

Method of manufacturing a semiconductor device including plural sem...

Semiconductor device

Method of manufacturing a semiconductor device including plural sem...

Semiconductor device and wire bonding method therefor

Multi-chip semiconductor device package

Thermal head and bonding connection method therefor

Semiconductor module and production method therefor and module for...

Multi-chip package type semiconductor device

Bonding apparatus

Multi-chip package type semiconductor device

Wire bonding apparatus

Wire bonding device and wire bonding method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTRUING SEMICONDUCTOR DEVICE

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Bonding apparatus and bonding method

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing semiconductor device

Method for manufacturing semiconductor device and bonding apparatus

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEM...

BONDING METHOD AND BONDING DEVICE

Wire bonding method and semiconductor device

SEMICONDUCTOR DEVICE

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF BONDING WIRES BETWEEN SEMICONDUC...

MOUNTING STRUCTURE AND MOUNTING METHOD

Method of manufacturing semiconductor device and semiconductor device

ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMP...

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEM...

SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES...

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device and a method of manufacturing the same

Multi-chip package type semiconductor device

Semiconductor device