Laminates or multilayers

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CPC
H01L23/3735

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3735Laminates or multilayers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus
- Patent number 12,132,014
- Issue date Oct 29, 2024
- Hitachi, Ltd.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor structure with heat dissipation structure and method...
- Patent number 12,131,976
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing processes and additively manufactured products
- Patent number 12,122,120
- Issue date Oct 22, 2024
- The Research Foundation for the State University of New York
- Scott N. Schiffres
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method of forming hybrid TIM layers
- Patent number 12,125,764
- Issue date Oct 22, 2024
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,125,739
- Issue date Oct 22, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 12,125,799
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing package substrate for mounting semiconductor d...
- Patent number 12,119,277
- Issue date Oct 15, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,119,318
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal extraction of single layer transfer integrated circuits
- Patent number 12,113,069
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Abhijeet Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,108,563
- Issue date Oct 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor module, vehicle, and manufactur...
- Patent number 12,107,030
- Issue date Oct 1, 2024
- Fuji Electric Co., Ltd.
- Sho Takano
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 12,100,688
- Issue date Sep 24, 2024
- Rohm Co., Ltd.
- Kaito Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip heat dissipation structure, chip structure, circuit board and...
- Patent number 12,100,639
- Issue date Sep 24, 2024
- BITMAIN TECHNOLOGIES INC.
- Dan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blocking element for connecting pins of semiconductor dice
- Patent number 12,094,806
- Issue date Sep 17, 2024
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-ceramic substrate with a foil formed for direct cooling as su...
- Patent number 12,087,660
- Issue date Sep 10, 2024
- Heraeus Deutschland GmbH & Co. KG
- Peter Dietrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power package and heat sink/cold rail arrangement
- Patent number 12,087,659
- Issue date Sep 10, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Binghua Pan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat conducting sheet and electronic device using same
- Patent number 12,087,661
- Issue date Sep 10, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akihito Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided cooling type power module and manufacturing method the...
- Patent number 12,080,674
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Heoncheol Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with low capacitance and high thermal conduc...
- Patent number 12,080,650
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,080,621
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Yoshiaki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240379737
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Ryosuke ISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20240379492
- Publication date Nov 14, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240379767
- Publication date Nov 14, 2024
- Sumitomo Electric Industries, Ltd.
- Sadanori ARAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphite-Copper Composite Material, Heat Sink Member Using the Same...
- Publication number 20240375176
- Publication date Nov 14, 2024
- UBE Corporation
- Masafumi Yoshimura
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...
- Publication number 20240379494
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240379572
- Publication date Nov 14, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MOLDING CAVITY
- Publication number 20240371659
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20240371724
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
- Publication number 20240371723
- Publication date Nov 7, 2024
- Denka Company Limited
- Motoi NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY ISOLATED DISCRETE PACKAGE WITH HIGH PERFORMANCE CERAMI...
- Publication number 20240363478
- Publication date Oct 31, 2024
- LITTELFUSE, INC.
- Aalok Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240363483
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240363480
- Publication date Oct 31, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
- Publication number 20240363482
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- KAI-MOU CHOU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
- Publication number 20240363479
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- KAI-MOU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE
- Publication number 20240363477
- Publication date Oct 31, 2024
- Honor Device Co., Ltd.
- Erliang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240363481
- Publication date Oct 31, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR...
- Publication number 20240355718
- Publication date Oct 24, 2024
- LITTELFUSE, INC.
- THOMAS SPANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK-INTEGRATED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING...
- Publication number 20240347416
- Publication date Oct 17, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20240347417
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Andreas Burghardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON
- Publication number 20240332102
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...
- Publication number 20240332121
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS
- Publication number 20240332126
- Publication date Oct 3, 2024
- Intel Corporation
- Andy Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCRIBED CERAMIC CIRCUIT SUBSTRATE, CERAMIC CIRCUIT SUBSTRATE, METHO...
- Publication number 20240332123
- Publication date Oct 3, 2024
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240332147
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Yusuke ISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332271
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS

Laminates or multilayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package including multiple semiconductor devices

Power semiconductor apparatus

Heat sink, semiconductor package and semiconductor module

Semiconductor structure with heat dissipation structure and method...

Additive manufacturing processes and additively manufactured products

Systems and methods for bidirectional message architecture for inve...

Semiconductor device and method of forming hybrid TIM layers

RF devices with enhanced performance and methods of forming the sam...

Copper/ceramic joined body and insulating circuit substrate

Embedded die packaging with integrated ceramic substrate

DBC substrate for power semiconductor devices, method for fabricati...

Method for producing package substrate for mounting semiconductor d...

Bonding structure and method of forming same

Thermal extraction of single layer transfer integrated circuits

Ceramic-copper composite, ceramic circuit board, power module, and...

Systems and methods for integrated gate driver for inverter for ele...

Power electronics assemblies having embedded power electronics devices

Semiconductor device, semiconductor module, vehicle, and manufactur...

Ceramic substrate manufacturing method

Semiconductor device

Chip heat dissipation structure, chip structure, circuit board and...

Thick-silver layer interface

Blocking element for connecting pins of semiconductor dice

Metal-ceramic substrate with a foil formed for direct cooling as su...

Electronic power package and heat sink/cold rail arrangement

Heat conducting sheet and electronic device using same

Double-sided cooling type power module and manufacturing method the...

Interconnect structure with low capacitance and high thermal conduc...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

HIGH SPEED, EFFICIENT SIC POWER MODULE

SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

Graphite-Copper Composite Material, Heat Sink Member Using the Same...

HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR MODULE

PACKAGE WITH MOLDING CAVITY

PACKAGE STRUCTURES

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

ELECTRICALLY ISOLATED DISCRETE PACKAGE WITH HIGH PERFORMANCE CERAMI...

SEMICONDUCTOR PACKAGE STRUCTURE

COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE

CERAMIC METAL COMPOSITE SUBSTRATE

CERAMIC METAL COMPOSITE SUBSTRATE

THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE

COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE

METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR...

HEATSINK-INTEGRATED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING...

DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME

PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON

ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS

SCRIBED CERAMIC CIRCUIT SUBSTRATE, CERAMIC CIRCUIT SUBSTRATE, METHO...

SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE