Laminates or multilayers

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CPC
H01L23/3735

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3735Laminates or multilayers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Ceramic substrate and manufacturing method therefor
- Patent number 12,183,689
- Issue date Dec 31, 2024
- AMOSENSE CO., LTD.
- Ji-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat extraction path from a laser die using a highly conductive the...
- Patent number 12,183,650
- Issue date Dec 31, 2024
- Intel Corporation
- Aditi Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing conductive tracks, and electronic module
- Patent number 12,183,710
- Issue date Dec 31, 2024
- Siemens Aktiengesellschaft
- Alexander Hensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating substrate and power module using the same
- Patent number 12,183,654
- Issue date Dec 31, 2024
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display device
- Patent number 12,165,949
- Issue date Dec 10, 2024
- Samsung Display Co., Ltd.
- Munsik Ham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Bonded substrate, and method for manufacturing bonded substrate
- Patent number 12,165,948
- Issue date Dec 10, 2024
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spaced apart containers
- Patent number 12,154,836
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Hisashi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 12,154,844
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-coated heat spreader for integrated circuit device assemblies
- Patent number 12,154,839
- Issue date Nov 26, 2024
- Advanced Micro Devices, Inc.
- Xiaoyang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package having the same
- Patent number 12,154,840
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Seonho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus
- Patent number 12,132,014
- Issue date Oct 29, 2024
- Hitachi, Ltd.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor structure with heat dissipation structure and method...
- Patent number 12,131,976
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing processes and additively manufactured products
- Patent number 12,122,120
- Issue date Oct 22, 2024
- The Research Foundation for the State University of New York
- Scott N. Schiffres
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method of forming hybrid TIM layers
- Patent number 12,125,764
- Issue date Oct 22, 2024
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,125,739
- Issue date Oct 22, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 12,125,799
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing package substrate for mounting semiconductor d...
- Patent number 12,119,277
- Issue date Oct 15, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,119,318
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal extraction of single layer transfer integrated circuits
- Patent number 12,113,069
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Abhijeet Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250006648
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006622
- Publication date Jan 2, 2025
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240429180
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCKING ELEMENT FOR CONNECTING PINS OF SEMICONDUCTOR DICE
- Publication number 20240429132
- Publication date Dec 26, 2024
- STMicroelectronics S.r.l.
- Agatino MINOTTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Assembling a Power Module
- Publication number 20240429121
- Publication date Dec 26, 2024
- ZF Friedrichshafen AG
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20240429143
- Publication date Dec 26, 2024
- Delta Electronics, Inc.
- Jung-Li CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240421106
- Publication date Dec 19, 2024
- Hyundai Motor Company
- Jin Myeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER MATERIAL
- Publication number 20240409800
- Publication date Dec 12, 2024
- ARCELORMITTAL
- Cristina BLANCO ROLDAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...
- Publication number 20240413046
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND HEAT DISSIPATION PLATE
- Publication number 20240413045
- Publication date Dec 12, 2024
- DENSO CORPORATION
- MASAYUKI KAMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413044
- Publication date Dec 12, 2024
- DENSO CORPORATION
- Koji URAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240404913
- Publication date Dec 5, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240395752
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE EQUIPPED WITH A UNIQUE CODE FOR A HEAT DISSIPATIO...
- Publication number 20240395659
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...
- Publication number 20240395565
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395679
- Publication date Nov 28, 2024
- DOWA METALTECH CO., LTD.
- Ayumu OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE
- Publication number 20240395692
- Publication date Nov 28, 2024
- LITTELFUSE, INC.
- Tiburcio Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240379737
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Ryosuke ISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240379767
- Publication date Nov 14, 2024
- Sumitomo Electric Industries, Ltd.
- Sadanori ARAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20240379492
- Publication date Nov 14, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphite-Copper Composite Material, Heat Sink Member Using the Same...
- Publication number 20240375176
- Publication date Nov 14, 2024
- UBE Corporation
- Masafumi Yoshimura
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS

Laminates or multilayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for single channel fault encoding for inverter...

Ceramic substrate and manufacturing method therefor

Heat extraction path from a laser die using a highly conductive the...

Thermal conductive film

Method for producing conductive tracks, and electronic module

Insulating substrate and power module using the same

Heat-dissipating circuit board, heat-dissipating member, and produc...

Direct bonded copper substrates fabricated using silver sintering

Display device

Systems and methods for phase switch timing controller for inverter...

Bonded substrate, and method for manufacturing bonded substrate

Semiconductor device with spaced apart containers

Dual-side cooling semiconductor packages and related methods

Graphene-coated heat spreader for integrated circuit device assemblies

Semiconductor device and semiconductor package having the same

Package including multiple semiconductor devices

Power semiconductor apparatus

Heat sink, semiconductor package and semiconductor module

Semiconductor structure with heat dissipation structure and method...

Additive manufacturing processes and additively manufactured products

Systems and methods for bidirectional message architecture for inve...

Semiconductor device and method of forming hybrid TIM layers

RF devices with enhanced performance and methods of forming the sam...

Copper/ceramic joined body and insulating circuit substrate

Embedded die packaging with integrated ceramic substrate

DBC substrate for power semiconductor devices, method for fabricati...

Method for producing package substrate for mounting semiconductor d...

Bonding structure and method of forming same

Thermal extraction of single layer transfer integrated circuits

Ceramic-copper composite, ceramic circuit board, power module, and...

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

BLOCKING ELEMENT FOR CONNECTING PINS OF SEMICONDUCTOR DICE

Power Module and Method for Assembling a Power Module

POWER MODULE STRUCTURE

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

POWER MODULE

HEAT SPREADER MATERIAL

SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

ON DIE FLEXURE CONTROL DEVICE AND METHOD

SEMICONDUCTOR MODULE AND HEAT DISSIPATION PLATE

SEMICONDUCTOR DEVICE

HEAT DISSIPATION MEMBER

THICK-SILVER LAYER INTERFACE

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

BONDING STRUCTURE AND METHOD OF FORMING SAME

CERAMIC SUBSTRATE EQUIPPED WITH A UNIQUE CODE FOR A HEAT DISSIPATIO...

MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...

METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE

CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

HIGH SPEED, EFFICIENT SIC POWER MODULE

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...

Graphite-Copper Composite Material, Heat Sink Member Using the Same...

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS