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H01L2224/03436

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03436Lamination of a preform

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D flex-foil package
- Patent number 11,764,122
- Issue date Sep 19, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,403,592
- Issue date Sep 3, 2019
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding thin chips in polymer
- Patent number 10,032,709
- Issue date Jul 24, 2018
- MC10, Inc.
- Conor Rafferty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal joining structure using metal nanoparticles and metal joining...
- Patent number 9,960,140
- Issue date May 1, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Kohei Tatsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding thin chips in polymer
- Patent number 9,583,428
- Issue date Feb 28, 2017
- MC10, Inc.
- Conor Rafferty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuit
- Patent number 9,536,781
- Issue date Jan 3, 2017
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding thin chips in polymer
- Patent number 9,171,794
- Issue date Oct 27, 2015
- MC10, Inc.
- Conor Rafferty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit and method of making
- Patent number 9,142,472
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for fabricating the semiconductor modu...
- Patent number 8,476,776
- Issue date Jul 2, 2013
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device mounting board and semiconductor module
- Patent number 8,314,345
- Issue date Nov 20, 2012
- Sanyo Electric Co., LTD
- Koichi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic bump structure without under bump metallurgy and manufactu...
- Patent number 7,968,446
- Issue date Jun 28, 2011
- Wan-Ling Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,414,390
- Issue date Jul 2, 2002
- Seiko Epson Corporation
- Kazuhiko Nozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,181,010
- Issue date Jan 30, 2001
- Seiko Epson Corporation
- Kazuhiko Nozawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF...
- Publication number 20210257322
- Publication date Aug 19, 2021
- ACTRON TECHNOLOGY CORPORATION
- I-Dar Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FLEX-FOIL PACKAGE
- Publication number 20200279787
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20190348387
- Publication date Nov 14, 2019
- UTAC Headquarters Pte. Ltd.
- Yongbo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING
- Publication number 20170372998
- Publication date Dec 28, 2017
- Yenhao Benjamin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING THIN CHIPS IN POLYMER
- Publication number 20140110859
- Publication date Apr 24, 2014
- MC10, Inc.
- Conor RAFFERTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075890
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075928
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009300
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR FABRICATING THE SEMICONDUCTOR MODU...
- Publication number 20110193222
- Publication date Aug 11, 2011
- Ryosuke Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFAC...
- Publication number 20110086505
- Publication date Apr 14, 2011
- Wan-Ling Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Bump Structure Without Under Bump Metallurgy And a Manufac...
- Publication number 20100320560
- Publication date Dec 23, 2010
- Wan-Ling Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICO...
- Publication number 20100140797
- Publication date Jun 10, 2010
- Yasuyuki YANASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE
- Publication number 20100132992
- Publication date Jun 3, 2010
- Koichi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Bump Structure Without Under Bump Metallurgy And Manufactu...
- Publication number 20100084763
- Publication date Apr 8, 2010
- Wan-Ling Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20010000080
- Publication date Mar 29, 2001
- Kazuhiko Nozawa
- H01 - BASIC ELECTRIC ELEMENTS

Lamination of a preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D flex-foil package

Semiconductor packages and methods of packaging semiconductor devices

Embedding thin chips in polymer

Metal joining structure using metal nanoparticles and metal joining...

Electronic devices with semiconductor die attached with sintered me...

Electronic devices with semiconductor die coupled to a thermally co...

Embedding thin chips in polymer

Method of making integrated circuit

Embedding thin chips in polymer

Integrated circuit and method of making

Power semiconductor devices

Semiconductor module, method for fabricating the semiconductor modu...

Device mounting board and semiconductor module

Metallic bump structure without under bump metallurgy and manufactu...

Semiconductor device and method of manufacturing the same, circuit...

Semiconductor device and method of manufacturing the same, circuit...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF...

3D FLEX-FOIL PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING

POWER SEMICONDUCTOR DEVICES

EMBEDDING THIN CHIPS IN POLYMER

INTEGRATED CIRCUIT AND METHOD OF MAKING

INTEGRATED CIRCUIT AND METHOD OF MAKING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR MODULE, METHOD FOR FABRICATING THE SEMICONDUCTOR MODU...

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFAC...

Metallic Bump Structure Without Under Bump Metallurgy And a Manufac...

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICO...

DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE

Metallic Bump Structure Without Under Bump Metallurgy And Manufactu...

Semiconductor device and method of manufacturing the same, circuit...